公开(公告)号：US20140104801A1

公开(公告)日：2014-04-17

申请号：US14106517

申请日：2013-12-13

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tetsuo SAJI ,  Gohki NISHIMURA ,  Naoyuki TASAKA

IPC: H05K1/16

CPC classification number: H05K1/0284 ,  H01F2017/0046 ,  H01F2017/0073 ,  H01P1/213 ,  H01P3/003 ,  H05K1/0219 ,  H05K1/0253 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/0338 ,  H05K2201/09745

Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

Abstract translation: 通过堆叠导电层和绝缘层来构成多层基板。 多层基板包括作为导电层之一并且比任何其它导电层更厚的芯以及包含在导电层中并且与芯相邻并且与第一绝缘层为一体的第一信号线 的绝缘层插入在芯和第一信号线之间，第一信号线用于发射RF信号。 芯部具有面向第一信号线的凹部。