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公开(公告)号：US20170272115A1
公开(公告)日：2017-09-21
申请号：US15610296
申请日：2017-05-31
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Yuki ENDO , Nobuaki MATSUO
CPC classification number: H04B1/44 , H04B1/0057 , H04B1/0064 , H04B15/02
Abstract: A module comprising: a first transmit filter that passes a transmission signal of a first band; a first receive filter that passes a reception signal of the first band; a second transmit filter that passes a transmission signal of a second band; a second receive filter that passes a reception signal of the second band; a third transmit filter that passes a transmission signal of a third band; and a third receive filter that passes a reception signal of the third band, wherein a transmit band of the first band overlaps with at least a part of a receive band of the second band, a receive band of the third band does not overlap with the transmit band of the first band or a transmit band of the second band, and the third receive filter is located between the first receive filter and the second receive filter.
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公开(公告)号：US20150236393A1
公开(公告)日：2015-08-20
申请号：US14701171
申请日：2015-04-30
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Hiroshi NAKAMURA
CPC classification number: H01P3/08 , H01P3/003 , H05K1/025 , H05K1/0253 , H05K1/0298 , H05K2201/09245
Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area.
Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层跨过绝缘层面向所述第一导电层。 第一信号线在多层电路基板的俯视图中与第二信号线相交，在第一和第二信号线的交叉区域中，第一接地导体与第一信号线之间的间隔比非非空 在第二接地导体和第二信号线之间的空间在交叉区域中比非交叉区域中的空间小，并且第一信号线形成在交叉区域中比在 非交叉区域。
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公开(公告)号：US20150098203A1
公开(公告)日：2015-04-09
申请号：US14566470
申请日：2014-12-10
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tatsuro SAWATARI , Yuichi SUGIYAMA , Hiroshi NAKAMURA , Masaki NAGANUMA , Tetsuo SAJI
CPC classification number: H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
Abstract translation: 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。
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公开(公告)号：US20150062835A1
公开(公告)日：2015-03-05
申请号：US14102241
申请日：2013-12-10
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Takehiko KAI , Eiji MUGIYA , Masaya SHIMAMURA , Kenzo KITAZAKI , Hiroshi NAKAMURA , Tetsuo SAJI
CPC classification number: H05K1/0218 , H01L21/561 , H01L23/3121 , H01L23/5383 , H01L23/552 , H01L24/97 , H01L2224/97 , H01L2924/15159 , H01L2924/15192 , H01L2924/15313 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K3/101 , H05K9/003 , H05K2201/0715 , Y10T29/4913
Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.
Abstract translation: 电路模块包括具有第一，第二和第三区域的安装表面的布线基板; 安装在所述区域上的多个电子部件; 绝缘密封层，其具有主表面和侧表面并且覆盖所述多个电子部件，所述主表面具有沟槽，所述沟槽沿着要沿着所述发散的区域之间的边界顺序地形成，并且具有朝向所述安装件的锥形形状 表面，所述侧表面围绕所述主表面形成; 以及具有第一和第二屏蔽部分并且包括导电树脂的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的侧表面并具有第一厚度，所述第二屏蔽部分设置在所述沟槽中，并且具有大于 第一厚度在第二屏蔽部分的总高度的一半的高度处。
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公开(公告)号：US20140308906A1
公开(公告)日：2014-10-16
申请号：US14063754
申请日：2013-10-25
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H04B1/48
CPC classification number: H04B1/48 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/16225 , H01L2224/24137 , H01L2224/73267 , H01L2924/19105 , H04B1/0458 , H04B1/18
Abstract: A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
Abstract translation: 高频电路模块具有：多层电路基板; 用于切换天线连接的第一高频开关; 传输滤波器; 和接收过滤器。 传输滤波器或接收滤波器或两者以及第一高频开关都嵌入在多层电路基板中，并且接地导体形成在面向嵌入式电子部件的导电层中。
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Patent Agency Ranking
公开(公告)号：US20140133114A1
公开(公告)日：2014-05-15
申请号：US13861907
申请日：2013-04-12
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H05K1/02
CPC classification number: H05K1/0253 , H01P3/088 , H05K1/0227 , H05K1/185 , H05K3/4602 , H05K2201/09245 , H05K2201/09336 , H05K2201/09727
Abstract: A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.
Abstract translation: 多层电路基板包括：第一导体层，其中形成有第一传输线和第二传输线; 通过绝缘层面对所述第一导电层的第二导电层; 以及通过绝缘层面向所述第二导电层并且在其中形成有旁路线的第三导电层。 旁通线路通过通孔导体与第一导电层的第二传输线电连接，使得第二传输线与第一传输线相互交叉。 在第二导电层中，至少形成面向旁路线的位置的接地导体，并且使第一传输线在与第二传输线的交点处比其他部分更窄。
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公开(公告)号：US20170013748A1
公开(公告)日：2017-01-12
申请号：US15115868
申请日：2015-02-04
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Yohei ICHIKAWA , Hiroshi NAKAMURA
CPC classification number: H05K9/0024 , H01L23/00 , H01L23/28 , H01L23/3121 , H01L23/552 , H01L2924/0002 , H05K1/0216 , H05K1/185 , H05K2201/10371 , H05K2201/10522 , H01L2924/00
Abstract: One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.
Abstract translation: 一个目的是通过限制电路模块尺寸的增加来防止电子元件之间的电磁波干扰。 根据实施例的电路模块包括电路板，设置在电路板上的多个电子部件，设置在电路板上以便以绝缘方式密封多个电子部件的树脂模具，覆盖 树脂模具的顶表面和侧表面以及设置在树脂模具中的具有柱状的多个导电极，并且将导电屏蔽的顶表面与电路板的接地连接。 由等于或小于预定最大可用频率的频率引起的共振受到限制。
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公开(公告)号：US20150119102A1
公开(公告)日：2015-04-30
申请号：US14481779
申请日：2014-09-09
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Yohei ICHIKAWA , Hiroshi NAKAMURA
IPC: H04M1/02
CPC classification number: H04M1/026 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/73267 , H01L2924/0002 , H01L2924/19105 , H04B1/38 , H04B1/3888 , H04B15/02 , H04B15/04 , H05K1/0218 , H05K1/0243 , H05K3/284 , H05K9/0022 , H05K9/0045 , H05K2201/0715 , H05K2201/10371 , H01L2924/00
Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.
Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，处理与卫星定位系统相关的接收信号的第二高频处理部分，具有基带处理部分和应用处理部分的系统部分 以及电源电路部，覆盖安装在电路基板上的电子部件的密封部件，形成在密封部件的表面上的导电性屏蔽层和形成在密封部件中的屏蔽壁， 第一高频处理部和第二高频处理部的安装区域。
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公开(公告)号：US20150044822A1
公开(公告)日：2015-02-12
申请号：US14517424
申请日：2014-10-17
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Eiji MUGIYA , Takehiko KAI , Masaya SHIMAMURA , Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H01L23/552 , H01L21/52 , H01L21/56
CPC classification number: H01L23/552 , H01L21/52 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L24/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/00
Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
Abstract translation: 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。
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公开(公告)号：US20140133117A1
公开(公告)日：2014-05-15
申请号：US13869335
申请日：2013-04-24
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H05K1/02
CPC classification number: H05K1/0243 , H01L24/19 , H01L24/24 , H01L2223/6677 , H01L2224/04105 , H01L2224/16225 , H01L2224/73267 , H01L2924/19105 , H05K1/0233 , H05K1/0253 , H05K1/185
Abstract: A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction.
Abstract translation: 多层电路衬底具有嵌入其中的高频开关。 在多层电路基板中，通过绝缘层面向高频开关的主表面的第一导电层具有形成在其中的电路图案，以便通过通孔导体连接到输入/输出端子。 第一导电层具有开口图案，其中接地导体不存在于面向高频开关的主表面并且在电路图案之外的区域中。 在相对于高频开关设置在第一导电层的外侧的第三导电层中，至少在高频开关的主表面沿厚度方向突出的区域中形成接地导体。
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