公开(公告)号：US20140204549A1

公开(公告)日：2014-07-24

申请号：US14226712

申请日：2014-03-26

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Sachiko TANAKA ,  Naoyuki TASAKA ,  Gohki NISHIMURA

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/19105 ,  H03H9/0561 ,  H03H9/0566 ,  H03H9/706 ,  H03H9/725

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract translation: 电路基板包括：层压基板，其中层压有导电层和绝缘层; 具有声波滤波器并设置在层叠基板的内部的滤波器芯片; 以及芯片部件，其设置在所述层叠基板的表面上并连接到所述滤芯，所述芯片部件的至少一部分与所述滤芯的沿着所述滤芯的厚度方向突出的区域的突出区域重叠 层压基板。

公开(公告)号：US20180226952A1

公开(公告)日：2018-08-09

申请号：US15868228

申请日：2018-01-11

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Sachiko TANAKA ,  Makoto INOUE ,  Naoyuki TASAKA

IPC: H03H9/72 ,  H03H9/64 ,  H03H9/17 ,  H03H7/01

Abstract: A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.

公开(公告)号：US20200235714A1

公开(公告)日：2020-07-23

申请号：US16719260

申请日：2019-12-18

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Jaeho JEONG ,  Shuei HASHIMOTO ,  Naoyuki TASAKA ,  Sachiko TANAKA ,  Makoto INOUE

IPC: H03H7/01

Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.

公开(公告)号：US20130163212A1

公开(公告)日：2013-06-27

申请号：US13662990

申请日：2012-10-29

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Sachiko TANAKA ,  Naoyuki TASAKA ,  Gohki NISHIMURA

IPC: H05K7/06

CPC classification number: H03H9/706 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/19 ,  H03H9/0561 ,  H03H9/0566 ,  H03H9/725

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract translation: 电路基板包括：层压基板，其中层压有导电层和绝缘层; 具有声波滤波器并设置在层叠基板的内部的滤波器芯片; 以及活性成分，其设置在所述层叠基板的表面上并与所述滤芯连接，所述有源部件的至少一部分与所述滤光片的区域的投影区域重叠，所述投影区域沿所述滤色片的厚度方向突出， 层压基板。

公开(公告)号：US20150123744A1

公开(公告)日：2015-05-07

申请号：US14524857

申请日：2014-10-27

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Gohki NISHIMURA ,  Takuma KUROYANAGI ,  Naoyuki TASAKA ,  Sachiko TANAKA

IPC: H03H9/72 ,  H03H9/17 ,  H01L41/047 ,  H01L41/08

CPC classification number: H03H9/0566 ,  H01L2224/16225 ,  H03H9/0514 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/10 ,  H03H9/1007 ,  H03H9/1064 ,  H03H9/173 ,  H03H9/706 ,  H03H9/725

Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

Abstract translation: 电子设备包括：第一基板，其第一表面中的第一功能部件，第一表面上的包围第一功能部件的粘合剂层，通过粘合剂层粘合到第一基板上以形成间隙的第二基板 在所述第一和第二基板之间，穿过所述第一基板以连接所述第一表面和相对的第二表面的第一通孔互连件，刺穿所述第二基板以连接所述第二基板的与所述第一基板相对的第三表面的第二通孔互连和 与所述第三表面相对的第四表面，设置在所述第二表面上并连接到所述第一通孔互连件的第一端子，设置在所述第四表面上并连接到所述第二通孔互连件的第二端子。 第一功能部分连接到第一和第二通孔互连中的至少一个。

公开(公告)号：US20140104801A1

公开(公告)日：2014-04-17

申请号：US14106517

申请日：2013-12-13

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tetsuo SAJI ,  Gohki NISHIMURA ,  Naoyuki TASAKA

IPC: H05K1/16

CPC classification number: H05K1/0284 ,  H01F2017/0046 ,  H01F2017/0073 ,  H01P1/213 ,  H01P3/003 ,  H05K1/0219 ,  H05K1/0253 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/0338 ,  H05K2201/09745

Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

Abstract translation: 通过堆叠导电层和绝缘层来构成多层基板。 多层基板包括作为导电层之一并且比任何其它导电层更厚的芯以及包含在导电层中并且与芯相邻并且与第一绝缘层为一体的第一信号线 的绝缘层插入在芯和第一信号线之间，第一信号线用于发射RF信号。 芯部具有面向第一信号线的凹部。

公开(公告)号：US20130162367A1

公开(公告)日：2013-06-27

申请号：US13662982

申请日：2012-10-29

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Sachiko TANAKA ,  Naoyuki TASAKA ,  Gohki NISHIMURA

IPC: H03H9/70

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/19105 ,  H03H9/0561 ,  H03H9/0566 ,  H03H9/706 ,  H03H9/725

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract translation: 电路基板包括：层压基板，其中层压有导电层和绝缘层; 具有声波滤波器并设置在层叠基板的内部的滤波器芯片; 以及芯片部件，其设置在所述层叠基板的表面上并连接到所述滤芯，所述芯片部件的至少一部分与所述滤芯的沿着所述滤芯的厚度方向突出的区域的突出区域重叠 层压基板。