公开(公告)号：US20240194392A1

公开(公告)日：2024-06-13

申请号：US18528876

申请日：2023-12-05

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Ryo FUKUOKA

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F2027/2809

Abstract: In the coil component, the thickness of the first coil portion and the thickness of the second coil portion are different from each other in the thickness direction of the substrate, thereby achieving improvement in characteristics such as self-resonance frequencies and heat dissipation.

公开(公告)号：US20230022189A1

公开(公告)日：2023-01-26

申请号：US17866837

申请日：2022-07-18

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29

Abstract: In a coil component, heat radiation around a through conductor is improved. In the coil component, since the cross-sectional area of the inner end portion of the planar coil is designed to be relatively large, heat generated in the through conductor is easily transferred to the inner end portion. Since heat is efficiently transferred from the through conductor to the inner end portion, high heat radiation around the through conductor is achieved.

公开(公告)号：US20220189682A1

公开(公告)日：2022-06-16

申请号：US17545629

申请日：2021-12-08

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Masazumi ARATA

IPC: H01F27/29 ,  H01F27/32 ,  H01F17/04

Abstract: By overlapping the protruding portion of the first insulator and the protruding portion of the second insulator via the protruding portion of the substrate, the DC superposition characteristic of the coil component is improved.

公开(公告)号：US20210166858A1

公开(公告)日：2021-06-03

申请号：US17108023

申请日：2020-12-01

Applicant: TDK CORPORATION

Inventor： Masataro SAITO ,  Masazumi ARATA ,  Hokuto EDA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

Abstract: In a coil component, a double coil is configured of a first coil portion and a second coil portion, and a first through conductor of the first coil portion and a second through conductor of the second coil portion are adjacent to each other. Thus, the first coil portion and the second coil portion have enhanced magnetic coupling at locations (that is, the first through conductor and the second through conductor) at which planar coil patterns of upper and lower surfaces of an insulating substrate are connected, in addition to magnetic coupling in the planar coil patterns wound around a through hole. Therefore, according to the coil component, a high coupling coefficient between the first coil portion and the second coil portion is realized.

公开(公告)号：US20200303116A1

公开(公告)日：2020-09-24

申请号：US16811610

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/18

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.