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公开(公告)号：US20230215618A1
公开(公告)日：2023-07-06
申请号：US18119473
申请日：2023-03-09
Applicant: TDK CORPORATION
Inventor： Takahiro KAWAHARA , Manabu OHTA , Kenei ONUMA , Yuuya KANAME , Ryo FUKUOKA , Hokuto EDA , Masataro SAITO , Kohei TAKAHASHI
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F41/041 , H05K1/181 , H01F27/2804 , H01F2017/048
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号：US20190385792A1
公开(公告)日：2019-12-19
申请号：US16555169
申请日：2019-08-29
Applicant: TDK CORPORATION
Inventor： Hitoshi OHKUBO , Masazumi ARATA , Manabu OHTA , Shou KAWADAHARA , Yoshihiro MAEDA , Takahiro KAWAHARA , Hokuto EDA , Shigeki SATO
IPC: H01F41/04
Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
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公开(公告)号：US20230066655A1
公开(公告)日：2023-03-02
申请号：US17892939
申请日：2022-08-22
Applicant: TDK CORPORATION
Inventor： Hokuto EDA , Hitoshi OHKUBO , Masazumi ARATA , Masataro SAITO , Kohei TAKAHASHI , Takamasa IWASAKI , Manabu OHTA , Kenei ONUMA
Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.
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公开(公告)号：US20220415566A1
公开(公告)日：2022-12-29
申请号：US17845003
申请日：2022-06-21
Applicant: TDK CORPORATION
Inventor： Hokuto EDA , Hitoshi OHKUBO , Masazumi ARATA , Masataro SAITO , Kohei TAKAHASHI , Takamasa IWASAKI , Manabu OHTA , Kenei ONUMA
IPC: H01F27/29 , H01F27/255
Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.
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公开(公告)号：US20210225588A1
公开(公告)日：2021-07-22
申请号：US17224508
申请日：2021-04-07
Applicant: TDK CORPORATION
Inventor： Hitoshi OHKUBO , Masazumi ARATA , Manabu OHTA , Shou KAWADAHARA , Yoshihiro MAEDA , Takahiro KAWAHARA , Hokuto EDA , Shigeki SATO
Abstract: In a coil component and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
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Patent Agency Ranking
公开(公告)号：US20130249662A1
公开(公告)日：2013-09-26
申请号：US13847079
申请日：2013-03-19
Applicant: TDK CORPORATION
Inventor： Kyohei TONOYAMA , Makoto MORITA , Tomokazu ITO , Hitoshi OHKUBO , Manabu OHTA , Yoshihiro MAEDA , Yuuya KANAME , Hideharu MORO
IPC: H01F27/255
CPC classification number: H01F27/255 , H01F17/0013 , H01F27/292 , H01F2017/048
Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.
Abstract translation: 在平面线圈元件中，设置在线圈单元的通孔中的含金属磁性粉末的树脂中包含的第一金属磁粉的倾斜粒子与总粒子的定量比高于倾斜粒子与总体的定量比 除了通孔以外的金属磁性粉末的树脂中含有的第一金属磁性粉末的颗粒，磁芯中的第一金属磁性粉末的许多颗粒是倾斜的，其长轴相对于 厚度方向和基板的平面方向。 因此，与图1所示的平面线圈元件相比，平面线圈元件具有改善的强度。 与图9A所示的平面线圈元件相比，磁导率提高。 9B。
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公开(公告)号：US20240331905A1
公开(公告)日：2024-10-03
申请号：US18617849
申请日：2024-03-27
Applicant: TDK Corporation
Inventor： Manabu OHTA , Ryo Fukuoka , Yuji Matsuura , Hokuto Eda , Takahiro Nemoto , Kenei Onuma , Masazumi Arata , Hitoshi Ohkubo
CPC classification number: H01F5/04 , H01F27/292
Abstract: In the coil component, the terminal electrode enters an aperture of the element body and is jointed with the bump electrode inside the element body. That is, the terminal electrode is in contact with both the bump electrode and the element body. Therefore, as compared with the case where the bump electrode is exposed to the lower surface of the element body, a joint surface of the terminal electrode is enlarged, and high adhesion of the terminal electrode is realized.
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公开(公告)号：US20210151234A1
公开(公告)日：2021-05-20
申请号：US17093808
申请日：2020-11-10
Applicant: TDK CORPORATION
Inventor： Hitoshi OHKUBO , Manabu OHTA , Ryo FUKUOKA , Hironori KIMATA
Abstract: In a coil component, a height h1 of a pedestal portion of a resin wall corresponds to the height position of a step portion. In addition, a height of a seed portion corresponds to the plating start position at a time when a winding portion of a coil is plated and grown. The plating start position and the step portion are designed to be close to each other by the height h1 of the pedestal portion and the height h2 of the seed portion satisfying 0.3≤h1/h2≤10. Accordingly, although the coil component has a configuration in which the resin wall has the step portion, the inside of the step portion is sufficiently filled with a coil conductor, and thus deterioration of characteristics is suppressed.
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公开(公告)号：US20200303116A1
公开(公告)日：2020-09-24
申请号：US16811610
申请日：2020-03-06
Applicant: TDK CORPORATION
Inventor： Takahiro KAWAHARA , Manabu OHTA , Kenei ONUMA , Yuuya KANAME , Ryo FUKUOKA , Hokuto EDA , Masataro SAITO , Kohei TAKAHASHI
Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
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公开(公告)号：US20140009254A1
公开(公告)日：2014-01-09
申请号：US13935442
申请日：2013-07-03
Applicant: TDK Corporation
Inventor： Hitoshi OHKUBO , Tomokazu ITO , Hideto ITOH , Yoshihiro MAEDA , Manabu OHTA , Yuuya KANAME , Takahiro KAWAHARA , Takashi NAKAGAWA
IPC: H01F27/28
CPC classification number: H01F27/2804 , H01F17/0033 , H01F27/022 , H01F27/255 , H01F27/29 , H01F27/292 , H01F2017/0073 , H01F2027/2809
Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.
Abstract translation: 线圈部件1包括基板2，形成在基板2的顶面2t上的平面状螺旋导体10a，与平面螺旋导体10a的外周端连接的引出导体11a， 基板2的上表面和平面螺旋导体10a的最外侧的一侧和基板2的端部2X2之间，并且与同一平面内的另一个导体没有电连接，与顶部平行布置的外部电极26a和26b 基板2的表面以及形成在引线导体11a的表面上的突起电极25a，并将引线导体11a与外部电极26a连接起来。 外部端子26a和26b具有比用于确保接合强度的凸起电极15a和15b更大的面积。
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