公开(公告)号：US20130249662A1

公开(公告)日：2013-09-26

申请号：US13847079

申请日：2013-03-19

申请人： TDK CORPORATION

发明人： Kyohei TONOYAMA ,  Makoto MORITA ,  Tomokazu ITO ,  Hitoshi OHKUBO ,  Manabu OHTA ,  Yoshihiro MAEDA ,  Yuuya KANAME ,  Hideharu MORO

IPC分类号： H01F27/255

CPC分类号： H01F27/255 ,  H01F17/0013 ,  H01F27/292 ,  H01F2017/048

摘要： In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.

摘要翻译： 在平面线圈元件中，设置在线圈单元的通孔中的含金属磁性粉末的树脂中包含的第一金属磁粉的倾斜粒子与总粒子的定量比高于倾斜粒子与总体的定量比 除了通孔以外的金属磁性粉末的树脂中含有的第一金属磁性粉末的颗粒，磁芯中的第一金属磁性粉末的许多颗粒是倾斜的，其长轴相对于 厚度方向和基板的平面方向。 因此，与图1所示的平面线圈元件相比，平面线圈元件具有改善的强度。 与图9A所示的平面线圈元件相比，磁导率提高。 9B。

公开(公告)号：US20200303116A1

公开(公告)日：2020-09-24

申请号：US16811610

申请日：2020-03-06

申请人： TDK CORPORATION

发明人： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC分类号： H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/18

摘要： In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20140009254A1

公开(公告)日：2014-01-09

申请号：US13935442

申请日：2013-07-03

申请人： TDK Corporation

发明人： Hitoshi OHKUBO ,  Tomokazu ITO ,  Hideto ITOH ,  Yoshihiro MAEDA ,  Manabu OHTA ,  Yuuya KANAME ,  Takahiro KAWAHARA ,  Takashi NAKAGAWA

IPC分类号： H01F27/28

CPC分类号： H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/255 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0073 ,  H01F2027/2809

摘要： A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.

摘要翻译： 线圈部件1包括基板2，形成在基板2的顶面2t上的平面状螺旋导体10a，与平面螺旋导体10a的外周端连接的引出导体11a， 基板2的上表面和平面螺旋导体10a的最外侧的一侧和基板2的端部2X2之间，并且与同一平面内的另一个导体没有电连接，与顶部平行布置的外部电极26a和26b 基板2的表面以及形成在引线导体11a的表面上的突起电极25a，并将引线导体11a与外部电极26a连接起来。 外部端子26a和26b具有比用于确保接合强度的凸起电极15a和15b更大的面积。

公开(公告)号：US20160351316A1

公开(公告)日：2016-12-01

申请号：US15166519

申请日：2016-05-27

申请人： TDK CORPORATION

发明人： Hitoshi OHKUBO ,  Masazumi ARATA ,  Manabu OHTA ,  Yuuya KANAME ,  Yoshihiro MAEDA ,  Takahiro KAWAHARA ,  Hokuto EDA ,  Shigeki SATO

IPC分类号： H01F27/255 ,  H01F27/28

摘要： A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

摘要翻译： 提供防止卷绕部的厚度变化的线圈部件。 根据线圈部件，由于一对相邻树脂壁和一对树脂壁之间的种子部分中的每一个分开预定距离，所以在种子部分上生长的电镀部分容易在所述一对相邻的树脂壁之间均匀地生长 树脂墙壁。 由于这个原因，通过电镀生长获得表面平缓并且其中防止厚度变化的卷绕部分。

公开(公告)号：US20150357115A1

公开(公告)日：2015-12-10

申请号：US14831761

申请日：2015-08-20

申请人： TDK Corporation

发明人： Hitoshi OHKUBO ,  Tomokazu ITO ,  Hideto ITOH ,  Yoshihiro MAEDA ,  Manabu OHTA ,  Yuuya KANAME ,  Takahiro KAWAHARA ,  Takashi NAKAGAWA

IPC分类号： H01F27/28 ,  H01F27/255 ,  H01F27/29

CPC分类号： H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/255 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0073 ,  H01F2027/2809

摘要： A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.

摘要翻译： 线圈部件包括基板，形成在基板的上表面的平面螺旋导体，与平面螺旋导体的外周端连接的引线导体，形成在基板的上表面之间的最外侧 平面螺旋导体和基板的端部的转动，并且与同一平面内的另一个导体和外部电极的电连接没有电连接，并且与基板的顶表面平行布置，并且凸起电极形成在基板的表面上 引线导体，并将引线导体与外部电极连接。 外部端子具有比用于确保接合强度的凸块电极更大的面积。

公开(公告)号：US20130249664A1

公开(公告)日：2013-09-26

申请号：US13848441

申请日：2013-03-21

申请人： TDK CORPORATION

发明人： Kyohei TONOYAMA ,  Makoto MORITA ,  Tomokazu ITO ,  Hitoshi OHKUBO ,  Manabu OHTA ,  Yoshihiro MAEDA ,  Yuuya KANAME ,  Hideharu MORO

IPC分类号： H01F41/04 ,  H01F27/255

CPC分类号： H01F41/04 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/046

摘要： In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

摘要翻译： 在平面线圈元件及其制造方法中，含有扁平或针状的第一金属磁性粉末的含金属磁性粉末的树脂含有平均粒径（1μm）小于（ 32微米）的第一金属磁性粉末，这显着降低了含金属磁性粉末的树脂的粘度。 因此，当用于包围线圈单元时，含金属磁性粉末的树脂易于处理，这使得容易制造平面线圈元件。