公开(公告)号：US20190164696A1

公开(公告)日：2019-05-30

申请号：US16189618

申请日：2018-11-13

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Takehisa TAMURA ,  Ken MORITA ,  Atsushi TAKEDA

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12

Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.

公开(公告)号：US20160240315A1

公开(公告)日：2016-08-18

申请号：US14995604

申请日：2016-01-14

Applicant: TDK CORPORATION

Inventor： Toru ONOUE ,  Ken MORITA ,  Kenta YAMASHITA

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/12 ,  H01G4/224 ,  H01G4/236 ,  H01G4/30

Abstract: A length in a first direction of the element body is smaller than a length in a second direction of the element body and smaller than a length in a third direction of the element body, the second direction being perpendicular to the first direction, the third direction being perpendicular to the first and second direction. Each of a first terminal electrode and a second terminal electrode includes a sintered conductor layer formed on the element body, a first plated layer formed on the sintered conductor layer, and a second plated layer formed on the first plated layer. In each of a first electrode portion disposed on a principal face and a third electrode portion disposed on a principal face, a maximum thickness of the sintered conductor layer is larger than a thickness of the first plated layer and not more than a thickness of the second plated layer.

Abstract translation: 元件主体的第一方向上的长度小于元件主体的第二方向上的长度，并且小于元件主体的第三方向上的长度，第二方向垂直于第一方向，第三方向 垂直于第一和第二方向。 第一端子电极和第二端子电极中的每一个包括形成在元件体上的烧结导体层，形成在烧结导体层上的第一镀层和形成在第一镀层上的第二镀层。 在设置在主面上的第一电极部分和设置在主面上的第三电极部分中的每一个中，烧结导体层的最大厚度大于第一镀层的厚度，并且不大于第二电极的厚度 镀层。