ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20230095767A1

    公开(公告)日:2023-03-30

    申请号:US17939819

    申请日:2022-09-07

    Abstract: Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.

    Electronic Component
    3.
    发明申请

    公开(公告)号:US20180082792A1

    公开(公告)日:2018-03-22

    申请号:US15703632

    申请日:2017-09-13

    Abstract: An element body includes first and second end surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and first and second principal surfaces opposing each other in a third direction. The length of the element body in the third direction is shorter than that of the element body in the first direction and is shorter than that of the element body in the second direction. A pair of first external electrodes is disposed at both ends of the element body in the first direction. Each of the first external electrodes includes a first conductor part disposed on one main surface and a second conductor part disposed on the end surface and coupled to the first conductor part. The porosity of the first conductor part is smaller than that of the second conductor part.

    ELECTRONIC COMPONENT
    4.
    发明申请

    公开(公告)号:US20190341191A1

    公开(公告)日:2019-11-07

    申请号:US16515648

    申请日:2019-07-18

    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.

    ELECTRONIC COMPONENT
    5.
    发明申请

    公开(公告)号:US20190237261A1

    公开(公告)日:2019-08-01

    申请号:US16250346

    申请日:2019-01-17

    CPC classification number: H01G4/30 H01G4/005 H01G4/12 H01G4/2325

    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.

    ELECTRONIC COMPONENT
    6.
    发明申请

    公开(公告)号:US20190237250A1

    公开(公告)日:2019-08-01

    申请号:US16250505

    申请日:2019-01-17

    CPC classification number: H01G4/005 H01G4/12 H01G4/2325 H01G4/248 H01G4/30

    Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the third direction is smaller than a length of the conductive resin layer in the first direction.

    ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE

    公开(公告)号:US20190131073A1

    公开(公告)日:2019-05-02

    申请号:US16166629

    申请日:2018-10-22

    Abstract: An element body of a rectangular parallelepiped shape includes first and second principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed at an end portion of the element body in the third direction. The external electrode includes a first conductive resin layer and a second conductive resin layer. The first conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. The second conductive resin layer is separated from the first conductive resin layer, and continuously covers one part of the second principal surface, one part of the end surface, and one part of each of the pair of side surfaces.

    ELECTRONIC COMPONENT
    8.
    发明申请

    公开(公告)号:US20170092423A1

    公开(公告)日:2017-03-30

    申请号:US15270744

    申请日:2016-09-20

    Abstract: An element body includes a first principal surface and a second principal surface opposing each other in a first direction. A first terminal electrode is disposed on the first principal surface side of the element body. A second terminal electrode is disposed on the second principal surface side of the element body. The first terminal electrode includes a first sintered metal layer formed on the first principal surface; and a first plating layer formed on the first sintered metal layer and including base metal. The second terminal electrode includes a second sintered metal layer formed on the second principal surface, a second plating layer formed on the second sintered metal layer and including base metal, and a solder layer formed on the second plating layer and including Sn and a metal having a higher melting point than the melting point of Sn.

    ELECTRONIC COMPONENT
    9.
    发明申请

    公开(公告)号:US20210043385A1

    公开(公告)日:2021-02-11

    申请号:US16986712

    申请日:2020-08-06

    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.

    ELECTRONIC COMPONENT
    10.
    发明申请

    公开(公告)号:US20210043378A1

    公开(公告)日:2021-02-11

    申请号:US16986588

    申请日:2020-08-06

    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1>0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.

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