公开(公告)号：US20190169019A1

公开(公告)日：2019-06-06

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  H01L23/31 ,  B81C1/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US09230862B2

公开(公告)日：2016-01-05

申请号：US13894177

申请日：2013-05-14

Applicant: Texas Instruments Incorporated

Inventor： Genki Yano

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/78 ,  H01L21/67 ,  H01L21/683 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68735 ,  H01L2221/68336

Abstract: A method of separating dice of a singulated wafer that is supported on a dicing tape sheet is disclosed. The method may include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.

Abstract translation: 公开了一种分离支撑在切割带片上的单片晶片的骰子的方法。 该方法可以包括将切割带片附接到环形框架上; 使相对于环形框架支撑晶片的切割带片的一部分相对地升高; 并将支撑带附接到环形框架和切割胶带片材。

公开(公告)号：US20140339672A1

公开(公告)日：2014-11-20

申请号：US13894177

申请日：2013-05-14

Applicant: Texas Instruments Incorporated

Inventor： Genki Yano

IPC: H01L21/78 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/67 ,  H01L21/683 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68735 ,  H01L2221/68336

Abstract: A method of separating dice of a singulated wafer that is supported on a dicing tape sheet is disclosed. The method may include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.

Abstract translation: 公开了一种分离支撑在切割带片上的单片晶片的骰子的方法。 该方法可以包括将切割带片附接到环形框架上; 使相对于环形框架支撑晶片的切割带片的一部分相对地升高; 并将支撑带附接到环形框架和切割胶带片材。