公开(公告)号：US09219019B2

公开(公告)日：2015-12-22

申请号：US14215896

申请日：2014-03-17

Applicant: Texas Instruments Incorporated

Inventor： Alok Kumar Lohia ,  Reynaldo Corpuz Javier ,  Andy Quang Tran

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78

CPC classification number: H01L23/3107 ,  H01L21/4842 ,  H01L21/56 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49565 ,  H01L23/49838 ,  H01L24/97 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/10254 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2224/85

Abstract: A semiconductor device has a leadframe with a pad and a row of elongated leads with a solderable surfaces in a common plane; a package encapsulating the leadframe with an assembled semiconductor device, leaving the common-plane lead surfaces un-encapsulated and coplanar with the package material between adjacent leads, the row of aligned leads positioned along a package edge; and grooves in the package material cut in the common-plane surface, the grooves extend along a portion of each lead length, have a width and a depth about twice the width, and expose solderable lead surfaces.

Abstract translation: 半导体器件具有引线框架，其具有焊盘和一排具有可焊接表面在公共平面中的细长引线; 封装引线框架与组装的半导体器件的封装，使公共平面引线表面与相邻引线之间的封装材料未封装和共面，沿着封装边缘定位一排排列的引线; 并且在共同平面表面中切割的封装材料中的凹槽沿着每个引线长度的一部分延伸，具有宽度和宽度的两倍，并且暴露可焊接的引线表面。

公开(公告)号：US20150262919A1

公开(公告)日：2015-09-17

申请号：US14213224

申请日：2014-03-14

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Reynaldo Corpuz Javier ,  Alok Kumar Lohia

IPC: H01L23/495 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Semiconductor device (100) comprises a metallic Quad Flat No-Lead/Small Outline No-Lead QFN/SON-type leadframe (101) with a pad (102) and a plurality of leads (103) with solderable surfaces (101a, 110a), at least one set of leads aligned in a row while having one surface in a common plane (170), each lead of the set having a protrusion (110) shaped as a reduced-thickness metal sheet. A package (160) encapsulates the assembly and the leadframe, the package material shaped by sidewalls (161) with the row of leads positioned along an edge of a sidewall and the protrusions extending away from the package sidewalls, the common-plane lead surfaces and the protrusions remaining un-encapsulated. The protruding metal sheets (110) are solder-attached along with the leads to absorb thermo-mechanical stress.

Abstract translation: 半导体器件（100）包括具有焊盘（102）和具有可焊接表面（101a，110a）的多个引线（103）的金属四方扁平无引线/小外形无引线QFN / SON型引线框架（101） 至少一组引线在一行中排列同时具有公共平面（170）中的一个表面，所述组的每个引线具有形成为厚度减小的金属片的突起（110）。 封装（160）封装组件和引线框架，封装材料由侧壁（161）成形，其中一排引线沿着侧壁的边缘定位，并且突出部延伸远离封装侧壁，共面引线表面和 突起保持未封装。 突出的金属片（110）与引线一起焊接附着以吸收热机械应力。