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    Semiconductor package with interconnected leads
    1.
    发明授权
    Semiconductor package with interconnected leads 有权

    公开(公告)号：US10541194B2

    公开(公告)日：2020-01-21

    申请号：US15934516

    申请日：2018-03-23

    Applicant: Texas Instruments Incorporated

    Inventor： Jeffrey Gail Holloway ,  Andy Quang Tran

    IPC: H01L23/057 ,  H01L23/498 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

    Abstract: A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality of contact pads. Each of a first plurality of leads includes a top portion and a bottom portion. The top portion of each of the first plurality of leads is electrically connected to a contact pad of the plurality of contact pads. Each of a second plurality of leads includes a top portion and a bottom portion and an interconnection portion between the top portion and the bottom portion. The top portion of each of the second plurality of leads includes separate finger portions that are electrically connected to at least two of the plurality of contact pads.

    Light Blocking Structure in Leadframe
    4.
    发明申请
    Light Blocking Structure in Leadframe 有权
    引线框架中的光阻结构

    公开(公告)号：US20140091326A1

    公开(公告)日：2014-04-03

    申请号：US13954533

    申请日：2013-07-30

    Applicant: Texas Instruments Incorporated

    Inventor： Andy Quang Tran ,  Lance Wright

    IPC: H01L27/14 ,  H01L21/82

    CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

    Abstract: A semiconductor proximity sensor (100) has a flat leadframe (110) with a first (110a) and a second (110b) surface, the second surface being solderable; the leadframe includes a first (111) and a second (112) pad, a plurality of leads (113, 114), and fingers (115, 118) framing the first pad, the fingers spaced from the first pad by a gap (116) which is filled with a clear molding compound. A light-emitting diode (LED) chip (120) is assembled on the first pad and encapsulated by a first volume (140) of the clear compound, the first volume outlined as a first lens (141). A sensor chip (130) is assembled on the second pad and encapsulated by a second volume (145) of the clear compound, the second volume outlined as a second lens (146). Opaque molding compound (150) fills the space between the first and second volumes of clear compound, forms shutters (151) for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. A layer (180) of solder is on the second leadframe surface of the pads, leads, and fingers.

    Abstract translation: 半导体接近传感器（100）具有带有第一（110a）和第二（110b）表面的扁平引线框架（110），该第二表面是可焊接的; 所述引线框架包括第一焊盘（111）和第二焊盘（112），多个引线（113,114）和构成所述第一焊盘的指状物（115,118），所述指状物与所述第一焊盘间隔开间隙（116 ）填充有透明模塑料。 发光二极管（LED）芯片（120）组装在第一焊盘上并由清洁化合物的第一容积（140）封装，第一容积被概述为第一透镜（141）。 传感器芯片（130）组装在第二垫上并由清洁化合物的第二体积（145）封装，第二体积被概述为第二透镜（146）。 不透明模塑料（150）填充第一和第二体积的透明化合物之间的空间，形成用于第一透镜和第二透镜的快门（151），并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊料层（180）位于焊盘，引线和手指的第二引线框表面上。

    Exposed pad integrated circuit package
    5.
    发明授权
    Exposed pad integrated circuit package 有权

    公开(公告)号：US11195269B2

    公开(公告)日：2021-12-07

    申请号：US14671727

    申请日：2015-03-27

    Applicant: Texas Instruments Incorporated

    Inventor： Reynaldo Corpuz Javier ,  Alok Kumar Lohia ,  Andy Quang Tran

    IPC: G06T7/00 ,  H01L23/495 ,  H01L23/00 ,  H05K3/34

    Abstract: An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.

    Fabricating a Proximity Sensor Having Light-Blocking Structure in Leadframe
    8.
    发明申请
    Fabricating a Proximity Sensor Having Light-Blocking Structure in Leadframe 审中-公开
    在引线框架中制造具有光阻挡结构的接近传感器

    公开(公告)号：US20150162317A1

    公开(公告)日：2015-06-11

    申请号：US14627839

    申请日：2015-02-20

    Applicant: Texas Instruments Incorporated

    Inventor： Andy Quang Tran ,  Lance Wright

    IPC: H01L25/16 ,  H01L31/0232 ,  H01L33/62 ,  H01L33/58 ,  H01L31/16 ,  H01L31/18

    CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

    Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound, forms shutters for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

    Abstract translation: 制造半导体接近传感器的方法包括提供具有第一表面和第二表面的扁平引线框架。 第二个表面是可焊接的。 引线框架包括第一和第二焊盘，多个引线和构成第一焊盘的指状物。 指状物通过填充有透明模塑料的间隙与第一垫片隔开。 发光二极管（LED）芯片组装在第一焊盘上并由第一体积的透明化合物封装。 第一卷被列为第一个镜头。 传感器芯片组装在第二焊盘上并被第二体积的透明化合物封装。 第二卷被列为第二个镜头。 不透明模塑料填充第一和第二体积的透明化合物之间的空间，形成用于第一和第二透镜的百叶窗，并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊盘，引线和手指连接到板上，使用焊料层来附接接近传感器。

    Proximity sensor having light blocking structure in leadframe
    9.
    发明授权
    Proximity sensor having light blocking structure in leadframe 有权
    在引线框架中具有遮光结构的接近传感器

    公开(公告)号：US08994154B2

    公开(公告)日：2015-03-31

    申请号：US13954533

    申请日：2013-07-30

    Applicant: Texas Instruments Incorporated

    Inventor： Andy Quang Tran ,  Lance Wright

    IPC: H01L23/495 ,  H01L27/14 ,  H01L21/82

    CPC classification number: H01L31/16 ,  H01L21/82 ,  H01L25/165 ,  H01L25/167 ,  H01L27/14 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/08 ,  H01L31/09 ,  H01L31/101 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2224/45099

    Abstract: A semiconductor proximity sensor (100) has a flat leadframe (110) with a first (110a) and a second (110b) surface, the second surface being solderable; the leadframe includes a first (111) and a second (112) pad, a plurality of leads (113, 114), and fingers (115, 118) framing the first pad, the fingers spaced from the first pad by a gap (116) which is filled with a clear molding compound. A light-emitting diode (LED) chip (120) is assembled on the first pad and encapsulated by a first volume (140) of the clear compound, the first volume outlined as a first lens (141). A sensor chip (130) is assembled on the second pad and encapsulated by a second volume (145) of the clear compound, the second volume outlined as a second lens (146). Opaque molding compound (150) fills the space between the first and second volumes of clear compound, forms shutters (151) for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. A layer (180) of solder is on the second leadframe surface of the pads, leads, and fingers.

    Abstract translation: 半导体接近传感器（100）具有带有第一（110a）和第二（110b）表面的扁平引线框架（110），该第二表面是可焊接的; 所述引线框架包括第一焊盘（111）和第二焊盘（112），多个引线（113,114）和构成所述第一焊盘的指状物（115,118），所述指状物与所述第一焊盘间隔开间隙（116 ）填充有透明模塑料。 发光二极管（LED）芯片（120）组装在第一焊盘上并由清洁化合物的第一容积（140）封装，第一容积被概述为第一透镜（141）。 传感器芯片（130）组装在第二垫上并由清洁化合物的第二体积（145）封装，第二体积被概述为第二透镜（146）。 不透明模塑料（150）填充第一和第二体积的透明化合物之间的空间，形成用于第一透镜和第二透镜的快门（151），并且形成从手指框架上升的壁以产生用于LED的封闭空腔。 焊料层（180）位于焊盘，引线和手指的第二引线框表面上。

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