公开(公告)号：US20220213344A1

公开(公告)日：2022-07-07

申请号：US17550146

申请日：2021-12-14

Applicant: The Boeing Company

Inventor： Om Prakash ,  Megha Sahu

IPC: C09D163/00 ,  C09J163/00

Abstract: Curable compositions are provided. In embodiments, a curable composition comprises curable prepolymers selected from the group consisting of epoxy prepolymers and silicone prepolymers, and a curing rate modifier that increases a rate of crosslinking reactions between the curable prepolymers as compared to a comparative curable composition without the curing rate modifier, wherein the curing rate modifier does not cure the curable composition in the absence of a hardener present in the curable composition, a catalyst present in the curable composition, water, or a combination thereof. Methods of using the curable compositions are also provided.

公开(公告)号：US11214350B2

公开(公告)日：2022-01-04

申请号：US16257261

申请日：2019-01-25

Applicant: THE BOEING COMPANY

Inventor： Om Prakash ,  Megha Sahu ,  Shantanu Bhattacharya ,  Sanjay Kumar ,  Pulak Bhushan

IPC: B64C1/40 ,  B33Y10/00 ,  B33Y80/00 ,  B64D33/02 ,  G10K11/172

Abstract: A sound attenuation panel that includes an incident wall and a frame unit connected to the incident wall. The incident wall defines an aperture therethrough. The frame unit includes multiple spoke members spaced apart from one another and radially extending from one or more central hub openings of the frame unit. The one or more central hub openings align with the aperture of the incident wall. The frame unit defines channels between adjacent pairs of the spoke members. The channels fluidly connect to the one or more central hub openings. The frame unit is configured to receive sound waves into the central hub opening through the aperture of the incident wall to dissipate the sound waves through the channels between the spoke members.

公开(公告)号：US20210206115A1

公开(公告)日：2021-07-08

申请号：US16736411

申请日：2020-01-07

Applicant: The Boeing Company

Inventor： Megha Sahu ,  Om Prakash

IPC: B29C64/393 ,  B33Y40/20 ,  B33Y50/02 ,  B33Y30/00 ,  C23C14/04 ,  C23C14/20 ,  C23C14/34 ,  C23C14/54

Abstract: A hybrid additive manufacturing system a build chamber, a polymer additive manufacturing system housed within the build chamber and a physical vapor deposition (PVD) system housed within the build chamber. A controller is configured to issue control signals to the polymer additive manufacturing system and PVD system for layered deposition of polymer and PVD layers in a multilayer part.

公开(公告)号：US10926461B2

公开(公告)日：2021-02-23

申请号：US16146405

申请日：2018-09-28

Applicant: The Boeing Company

Inventor： Om Prakash ,  Megha Sahu

IPC: B29C64/165 ,  B29C64/106 ,  B33Y10/00 ,  B33Y80/00 ,  B22F1/00 ,  B22F3/11 ,  B29C64/245 ,  B22F3/105 ,  B33Y70/00 ,  B33Y30/00

Abstract: A method of additive manufacturing is provided. The method includes depositing a layer of polymeric material from which an additively manufactured part is produced. The method also includes depositing a slurry upon the layer of polymeric material, wherein the slurry includes a conductive material that imparts conductive properties to the layer of polymeric material.