-
公开(公告)号:US11002927B2
公开(公告)日:2021-05-11
申请号:US16281090
申请日:2019-02-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Lun Chang , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hsuan-Ting Kuo , Chia-Shen Cheng , Chih-Chiang Tsao
IPC: G02B6/42 , H01L21/683 , H01L21/56 , G02B6/43 , H01L23/538 , H01L25/18 , H01L23/31 , H01L23/00 , H01L25/00 , H05K1/18 , H05K1/02
Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.
-
公开(公告)号:US20200271873A1
公开(公告)日:2020-08-27
申请号:US16281090
申请日:2019-02-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Lun Chang , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hsuan-Ting Kuo , Chia-Shen Cheng , Chih-Chiang Tsao
IPC: G02B6/42 , H05K1/02 , H01L23/538 , H01L25/18 , H01L23/31 , H01L23/00 , H01L25/00 , H01L21/683 , H01L21/56 , G02B6/43 , H05K1/18
Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.
-