公开(公告)号：US20230230849A1

公开(公告)日：2023-07-20

申请号：US17661940

申请日：2022-05-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Shen Cheng ,  Chia-Lun Chang ,  Hao-Jan Pei ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L21/48 ,  H01L25/10 ,  B23K26/362

CPC classification number: H01L21/481 ,  B23K26/362 ,  H01L21/4853 ,  H01L25/105 ,  H01L24/96

Abstract: A method includes forming an insulating layer over a package. The package has a plurality of locations where openings are subsequently formed. A first laser shot is performed, location by location, on each of the locations across the package. A first laser spot of the first laser shot overlaps with each of the locations. The first laser shot removes a first portion of the insulating layer below the first laser spot. Another laser shot is performed, location by location, on each of the locations across the package. Another laser spot of the another laser shot overlaps with each of the locations. The another laser shot removes another portion of the insulating layer below the another laser spot. Performing the another laser shot, location by location, on each of the locations across the package is repeated multiple times, until desired portions of the insulating layer are removed.

公开(公告)号：US20220367408A1

公开(公告)日：2022-11-17

申请号：US17815713

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chia-Shen Cheng ,  Hao-Jan Pei ,  Philip Yu-Shuan Chung ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

公开(公告)号：US20220028823A1

公开(公告)日：2022-01-27

申请号：US16935465

申请日：2020-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Shen Cheng ,  Wei-Yu Chen ,  Philip Yu-Shuan Chung ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu

IPC: H01L23/00

Abstract: A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.

公开(公告)号：US11002927B2

公开(公告)日：2021-05-11

申请号：US16281090

申请日：2019-02-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Lun Chang ,  Ching-Hua Hsieh ,  Cheng-Ting Chen ,  Hsiu-Jen Lin ,  Hsuan-Ting Kuo ,  Chia-Shen Cheng ,  Chih-Chiang Tsao

IPC: G02B6/42 ,  H01L21/683 ,  H01L21/56 ,  G02B6/43 ,  H01L23/538 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H05K1/18 ,  H05K1/02

Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

公开(公告)号：US10903090B2

公开(公告)日：2021-01-26

申请号：US16414763

申请日：2019-05-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Ting Chen ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Wei-Yu Chen ,  Chia-Lun Chang ,  Chia-Shen Cheng ,  Cheng-Shiuan Wong

IPC: H01L21/02 ,  H01L21/56 ,  H01L21/78 ,  H01L23/28 ,  H01L23/544

Abstract: A method of forming a package structure includes the following processes. A die is attached to a polymer layer. An encapsulant is formed over the polymer layer to encapsulate sidewalls of the die. A RDL structure is formed on the encapsulant and the die. A conductive terminal is electrically connected to the die through the RDL structure. A light transmitting film is formed on the polymer layer. An alignment process is performed, and the alignment process uses an optical equipment to see through the light transmitting film to capture the alignment information included in the polymer layer. A singulating process is performed to singulate the package structure according to the alignment information.

公开(公告)号：US20200271873A1

公开(公告)日：2020-08-27

申请号：US16281090

申请日：2019-02-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Lun Chang ,  Ching-Hua Hsieh ,  Cheng-Ting Chen ,  Hsiu-Jen Lin ,  Hsuan-Ting Kuo ,  Chia-Shen Cheng ,  Chih-Chiang Tsao

IPC: G02B6/42 ,  H05K1/02 ,  H01L23/538 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/683 ,  H01L21/56 ,  G02B6/43 ,  H05K1/18

Abstract: In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

公开(公告)号：US20240387346A1

公开(公告)日：2024-11-21

申请号：US18366255

申请日：2023-08-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chiang Tsao ,  Chao-Wei Chiu ,  Hsin Liang Chen ,  Chia-Shen Cheng ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments include a device. The device includes an interposer, a package substrate, and conductive connectors bonding the package substrate to the interposer. Each of the conductive connectors have convex sidewalls. A first subset of the conductive connectors are disposed in a center of the package substrate in a top-down view. A second subset of the conductive connectors are disposed in an edge/corner of the package substrate in the top-down view. Each of the second subset of the conductive connectors have a greater height than each of the first subset of the conductive connectors.

公开(公告)号：US11482491B2

公开(公告)日：2022-10-25

申请号：US15877398

申请日：2018-01-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chih-Hua Chen ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Yu-Chih Huang ,  Yu-Peng Tsai ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Jen-Jui Yu

IPC: H01L23/528 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/522 ,  H01L23/538 ,  H01L21/683

Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

公开(公告)号：US12040309B2

公开(公告)日：2024-07-16

申请号：US17815713

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chia-Shen Cheng ,  Hao-Jan Pei ,  Philip Yu-Shuan Chung ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/49822 ,  H01L24/17 ,  H01L2224/175 ,  H01L2224/81224 ,  H01L2924/3511

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

公开(公告)号：US20240153842A1

公开(公告)日：2024-05-09

申请号：US18404504

申请日：2024-01-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hao-Jan Pei ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Cheng-Ting Chen ,  Chia-Lun Chang ,  Chih-Wei Lin ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chung-Shi Liu

IPC: H01L23/373 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/50 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L23/3736 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/83 ,  H01L25/105 ,  H01L23/49816 ,  H01L2924/15311

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.