Method of manufacturing semiconductor device using precision polishing
apparatus with detecting means
    21.
    发明授权
    Method of manufacturing semiconductor device using precision polishing apparatus with detecting means 失效
    使用具有检测装置的精密抛光装置制造半导体器件的方法

    公开(公告)号:US6165050A

    公开(公告)日:2000-12-26

    申请号:US303647

    申请日:1999-05-03

    摘要: In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out of an unloading unit as products. The defective articles are classified in a discriminating device in conformity with the kinds of defects and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.

    摘要翻译: 为了回收有缺陷的物品,从装载单元运送的晶片以指定的顺序被输送到晶片储存单元,抛光单元,预漂洗单元,漂洗单元,脱水脱水单元和干燥单元,以及 在缺陷检查装置中,有缺陷的物品被分类,其余的作为产品从卸载单元中取出。 有缺陷的物品根据缺陷的种类分类在鉴别装置中,并通过返回管道返回到抛光单元,漂洗单元或干燥单元。

    Chemical-mechanical polishing apparatus and method
    22.
    发明授权
    Chemical-mechanical polishing apparatus and method 失效
    化学机械抛光装置及方法

    公开(公告)号:US6162112A

    公开(公告)日:2000-12-19

    申请号:US883628

    申请日:1997-06-26

    IPC分类号: B24B37/04 B24B1/00

    CPC分类号: B24B37/105 B24B37/042

    摘要: A chemical-mechanical polishing apparatus for polishing a workpiece. The apparatus includes a rotatable table having a surface for holding a workpiece to be polished, a table drive mechanism for rotating the rotating table, a polishing tool rotatable around a rotation axis and being rectilinearly movable in an axial direction along the rotation axis, a polishing tool drive mechanism for rotating and rectilinearly moving the polishing tool, the polishing tool drive mechanism pressing the polishing tool against the workpiece to be polished at a predetermined pressure, a supply for supplying an abrasive material between the polishing tool and the workpiece to be polished, and a foreign substance removing device for removing a foreign substance on the surface of the table. The removing device is located rotationally downstream of the table relative to the polishing tool.

    摘要翻译: 一种用于抛光工件的化学机械抛光装置。 该设备包括:具有用于保持要抛光的工件的表面的旋转工作台,用于使旋转台旋转的工作台驱动机构,可绕旋转轴线旋转并可沿着旋转轴沿轴向直线移动的抛光工具;抛光 用于旋转和直线移动抛光工具的工具驱动机构,抛光工具驱动机构以预定压力将抛光工具压靠待抛光的工件,用于在抛光工具和待抛光工件之间供应磨料的供应, 以及用于去除桌子表面上的异物的异物去除装置。 移除装置相对于抛光工具旋转地位于桌子的下游。

    Precision polishing apparatus
    23.
    发明授权
    Precision polishing apparatus 失效
    精密抛光装置

    公开(公告)号:US5904611A

    公开(公告)日:1999-05-18

    申请号:US840627

    申请日:1997-04-25

    IPC分类号: B24B37/34 B24B55/00 B24B1/00

    CPC分类号: B24B37/345 B24B55/00

    摘要: A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.

    摘要翻译: 精密抛光装置具有设置有抛光装置的第一密封室,能够通过第二密封室与第一密封室连通的第三密封室,第一和第二打开 - 关闭装置,用于交替地放置第一和第二密封室 与第二密封室连通的第三密封室,以及用于控制第一和第二密封室的气氛压力的大气压力控制装置,使得第一密封室的气氛压力可能变得低于大气 至少第一打开 - 关闭装置打开时,第二密封室的压力。