公开(公告)号：US06776691B2

公开(公告)日：2004-08-17

申请号：US09971692

申请日：2001-10-09

申请人： Matsuomi Nishimura ,  Mikichi Ban ,  Kazuo Takahashi ,  Osamu Ikeda

发明人： Matsuomi Nishimura ,  Mikichi Ban ,  Kazuo Takahashi ,  Osamu Ikeda

IPC分类号： B24B100

CPC分类号： H01L21/67028 ,  B08B3/00 ,  B08B3/04 ,  B08B2203/005 ,  B24B37/04 ,  B24B57/02 ,  Y10T29/49165

摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.

摘要翻译： 能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。 抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。 通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

公开(公告)号：US06332835B1

公开(公告)日：2001-12-25

申请号：US09193858

申请日：1998-11-18

申请人： Matsuomi Nishimura ,  Mikichi Ban ,  Kazuo Takahashi ,  Osamu Ikeda

发明人： Matsuomi Nishimura ,  Mikichi Ban ,  Kazuo Takahashi ,  Osamu Ikeda

IPC分类号： B24B700

CPC分类号： H01L21/67028 ,  B08B3/00 ,  B08B3/04 ,  B08B2203/005 ,  B24B37/04 ,  B24B57/02 ,  Y10T29/49165

摘要： A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.

摘要翻译： 能够有效且高效地除去钾等碱金属的研磨装置，通过研磨剂和用于清洗抛光物的清洗单元，一体地研磨用于研磨物体的研磨单元。 抛光单元和清洁单元具有用于将内部空气与外部空气隔离的装置，并且清洁单元具有通过使热纯水或纯水蒸汽与抛光对象接触来清洁抛光对象的装置。 通过清洗方法，在通过这种抛光装置抛光之后，使热纯水与抛光物体接触而不干燥。

公开(公告)号：US6165050A

公开(公告)日：2000-12-26

申请号：US303647

申请日：1999-05-03

申请人： Mikichi Ban ,  Matsuomi Nishimura ,  Kazuo Takahashi

发明人： Mikichi Ban ,  Matsuomi Nishimura ,  Kazuo Takahashi

IPC分类号： B24B37/04 ,  B24B49/00 ,  H01L21/302

CPC分类号： H01L21/67219 ,  B24B37/04 ,  B24B49/00 ,  H01L21/67271 ,  H01L21/67745

摘要： In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out of an unloading unit as products. The defective articles are classified in a discriminating device in conformity with the kinds of defects and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.

摘要翻译： 为了回收有缺陷的物品，从装载单元运送的晶片以指定的顺序被输送到晶片储存单元，抛光单元，预漂洗单元，漂洗单元，脱水脱水单元和干燥单元，以及 在缺陷检查装置中，有缺陷的物品被分类，其余的作为产品从卸载单元中取出。 有缺陷的物品根据缺陷的种类分类在鉴别装置中，并通过返回管道返回到抛光单元，漂洗单元或干燥单元。

公开(公告)号：US5904611A

公开(公告)日：1999-05-18

申请号：US840627

申请日：1997-04-25

申请人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura

发明人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura

IPC分类号： B24B37/34 ,  B24B55/00 ,  B24B1/00

CPC分类号： B24B37/345 ,  B24B55/00

摘要： A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.

摘要翻译： 精密抛光装置具有设置有抛光装置的第一密封室，能够通过第二密封室与第一密封室连通的第三密封室，第一和第二打开 - 关闭装置，用于交替地放置第一和第二密封室 与第二密封室连通的第三密封室，以及用于控制第一和第二密封室的气氛压力的大气压力控制装置，使得第一密封室的气氛压力可能变得低于大气 至少第一打开 - 关闭装置打开时，第二密封室的压力。

公开(公告)号：US06149500A

公开(公告)日：2000-11-21

申请号：US304629

申请日：1999-05-04

申请人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura

发明人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura

IPC分类号： B24B37/34 ,  B24B55/00 ,  B24B1/00

CPC分类号： B24B37/345 ,  B24B55/00

摘要： A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.

摘要翻译： 精密抛光装置具有设置有抛光装置的第一密封室，能够通过第二密封室与第一密封室连通的第三密封室，第一和第二打开 - 关闭装置，用于交替地放置第一和第二密封室 与第二密封室连通的第三密封室，以及用于控制第一和第二密封室的气氛压力的大气压力控制装置，使得第一密封室的气氛压力可能变得低于大气压力 的至少第一开闭装置被打开。

公开(公告)号：US06629882B2

公开(公告)日：2003-10-07

申请号：US09970302

申请日：2001-10-04

申请人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura ,  Shinzo Uchiyama ,  Takashi Kamono

发明人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura ,  Shinzo Uchiyama ,  Takashi Kamono

IPC分类号： B24B2900

CPC分类号： B24B37/105 ,  B24B47/10 ,  B24B49/12 ,  H01L21/00 ,  H01L21/68764

摘要： The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

公开(公告)号：US06390903B1

公开(公告)日：2002-05-21

申请号：US09044147

申请日：1998-03-19

申请人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura ,  Shinzo Uchiyama ,  Takashi Kamono

发明人： Kazuo Takahashi ,  Mikichi Ban ,  Matsuomi Nishimura ,  Shinzo Uchiyama ,  Takashi Kamono

IPC分类号： B24B2900

CPC分类号： B24B37/105 ,  B24B47/10 ,  B24B49/12 ,  H01L21/00 ,  H01L21/68764

摘要： The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

公开(公告)号：US6012966A

公开(公告)日：2000-01-11

申请号：US851538

申请日：1997-05-05

申请人： Mikichi Ban ,  Matsuomi Nishimura ,  Kazuo Takahashi

发明人： Mikichi Ban ,  Matsuomi Nishimura ,  Kazuo Takahashi

IPC分类号： B24B37/04 ,  B24B49/00 ,  H01L21/302

CPC分类号： H01L21/67219 ,  B24B37/04 ,  B24B49/00 ,  H01L21/67271 ,  H01L21/67745

摘要： In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out as products out of an unloading unit. The defective articles are classified in a discriminating device in conformity with the kinds of the defects thereof, and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.

摘要翻译： 为了回收有缺陷的物品，从装载单元运送的晶片以指定的顺序被输送到晶片储存单元，抛光单元，预漂洗单元，漂洗单元，脱水脱水单元和干燥单元，以及 在缺陷检查装置中，对不合格物品进行分类，其余部分作为产品从卸载单元中取出。 有缺陷的物品根据其缺陷的种类被分类在鉴别装置中，并通过返回管道返回到抛光单元，漂洗单元或干燥单元。

公开(公告)号：US6093081A

公开(公告)日：2000-07-25

申请号：US848159

申请日：1997-04-29

申请人： Masaru Nyui ,  Mikichi Ban ,  Kazuo Takahashi

发明人： Masaru Nyui ,  Mikichi Ban ,  Kazuo Takahashi

IPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/06 ,  G05B19/401 ,  H01L21/66

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  G05B19/401 ,  H01L22/26 ,  G05B2219/37398 ,  G05B2219/37576 ,  G05B2219/45026 ,  G05B2219/45199 ,  G05B2219/50067

摘要： A polishing method of polishing the surface of a layer provided on the surface of a substrate includes a surface configuration measuring step of detecting surface information at a plurality of locations on the layer and obtaining the surface configuration of the layer, the surface configuration of the layer being obtained by measuring a distance from a reference surface set relative to the surface of the layer, a film thickness distribution measuring step of detecting the film thicknesses at a plurality of locations on the layer and obtaining the film thickness distribution of the layer, a determining step of determining whether the surface configuration and film thickness distribution of the layer are within a preset allowable range and a polishing controlling step of continuing or stopping the polishing on the basis of a result of the determination in the determining step.

摘要翻译： 抛光设置在基板表面上的层的表面的抛光方法包括：表面构造测量步骤，用于检测该层上多个位置处的表面信息，并获得该层的表面形状，该层的表面形状 通过测量相对于所述层的表面设置的参考表面的距离获得的膜厚度分布测量步骤，用于检测所述层上的多个位置处的膜厚度并获得所述层的膜厚度分布，确定 确定层的表面形状和膜厚分布是否处于预设允许范围内的步骤;以及基于确定步骤中的确定结果继续或停止抛光的抛光控制步骤。

公开(公告)号：US06503361B1

公开(公告)日：2003-01-07

申请号：US09090803

申请日：1998-06-04

申请人： Masaru Nyui ,  Mikichi Ban

发明人： Masaru Nyui ,  Mikichi Ban

IPC分类号： C23F104

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12

摘要： This specification discloses a polishing method of polishing the surface of a film layer provided on the surface of a substrate by polishing means with both of them driven relative to each other, having a position detecting step of detecting a predetermined position on the surface of the film layer, a first measuring step of applying momentary light from a light source to the predetermined position, and detecting the light beam from the predetermined position by a light receiving element to thereby measure the film thickness at the predetermined position, and a controlling step of controlling the polishing state by using data obtained in the first measuring step. The specification also discloses a polishing apparatus using such polishing method.

摘要翻译： 该说明书公开了一种抛光方法，其通过抛光装置抛光设置在基板的表面上的膜层的表面，两者都被相对于彼此驱动，具有位置检测步骤，该位置检测步骤检测膜的表面上的预定位置 第一测量步骤，将来自光源的瞬时光施加到预定位置，并且由光接收元件检测来自预定位置的光束，从而测量预定位置处的膜厚度;以及控制步骤， 通过使用在第一测量步骤中获得的数据的抛光状态。 本说明书还公开了使用这种抛光方法的抛光装置。