专利检索 ap:("Tao Tong" OR "Ronan Letoquin" OR "Bernd Keller" OR "Theodore Lowes" OR "Eric Tarsa" OR "Mark Youmans") AND inv:"Ronan Letoquin" 第 3 页

21.

发明申请
Method of uniform phosphor chip coating and led package fabricated using method 有权
标题翻译：使用方法制造的均匀磷光体芯片涂层和LED封装的方法

公开(公告)号：US20080079017A1

公开(公告)日：2008-04-03

申请号：US11881683

申请日：2007-07-27

申请人： Ban Loh , Nicholas Medendorp , Peter Andrews , Yankun Fu , Micheal Laughner , Ronan Letoquin

发明人： Ban Loh , Nicholas Medendorp , Peter Andrews , Yankun Fu , Micheal Laughner , Ronan Letoquin

IPC分类号： H01L33/00

CPC分类号： H01L33/58 , H01L33/505 , H01L33/54 , H01L2224/48091 , H01L2924/19107 , H01L2933/0041 , H01L2933/005 , H01L2924/00014

摘要： Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.

摘要翻译： 制造LED封装的方法包括提供LED芯片并用液体介质覆盖其至少一部分。提供光学元件并放置在液体介质上。允许光学元件沉降至所需水平并且液体介质固化。还公开了使用所公开的方法制造的LED封装。