摘要:
A polymer composite is provided for a water treatment. The polymer composite with excellent workability is capable of adsorbing impurities in water, being rapidly separated from the water using magnetic forces. The polymer composite includes secondary aggregates. The secondary aggregates are formed of clumped particles, the particles being magnetic particles covered with a polymer. The polymer composite has porous structures suitable for adsorbing underwater impurities.
摘要:
An adsorbent includes: at least one of an inorganic particle and a metallic particle as a core; at least two kinds of polymers, which cover a surface of the core, with respective different surface tensions; and a convex-concave surface structure formed due to a difference in surface tension between the at least two kinds of polymers.
摘要:
An oil adsorbent includes a plurality of particles, each being constituted from at least one of an inorganic particle and an organic particle as a core and a polymer covering the core. The plurality of particles are aggregated to form an aggregate so that a porosity of the aggregate is 70% or more.
摘要:
The present invention provides a resin composition for sealing a semiconductor device. The resin composition is in liquid state at room temperature, and can be supplied from a dispenser. The composition is advantageous in regard to molding time, viscosity, moldability and adhesion. This resin composition indispensably comprises a bisphenol type epoxy resin having a polymerization degree of 3 or less, a particular phenol resin or a particular acid anhydride, a catalyst (A) such as 1-cyanoethyl-2-undecylimidazolium trimellitate, a catalyst (B) such as 1-cyanoethyl-2-ethyl-4-methylimidazol, and spherical fused silica particles. The weight ratio (A/B) between the catalysts (A) and (B) is in the range of 9/1 to 4/6.