RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME
    24.
    发明申请
    RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME 审中-公开
    树脂组合物和半导体器件的改进

    公开(公告)号:US20090230570A1

    公开(公告)日:2009-09-17

    申请号:US12401095

    申请日:2009-03-10

    IPC分类号: H01L23/29 C09D163/02

    摘要: The present invention provides a resin composition for sealing a semiconductor device. The resin composition is in liquid state at room temperature, and can be supplied from a dispenser. The composition is advantageous in regard to molding time, viscosity, moldability and adhesion. This resin composition indispensably comprises a bisphenol type epoxy resin having a polymerization degree of 3 or less, a particular phenol resin or a particular acid anhydride, a catalyst (A) such as 1-cyanoethyl-2-undecylimidazolium trimellitate, a catalyst (B) such as 1-cyanoethyl-2-ethyl-4-methylimidazol, and spherical fused silica particles. The weight ratio (A/B) between the catalysts (A) and (B) is in the range of 9/1 to 4/6.

    摘要翻译: 本发明提供一种用于密封半导体器件的树脂组合物。 树脂组合物在室温下处于液态,并且可以由分配器供应。 组合物在成型时间,粘度,成型性和粘附性方面是有利的。 该树脂组合物不可缺少地包含聚合度为3以下的双酚型环氧树脂,特定的酚醛树脂或特定的酸酐,诸如1-氰基乙基-2-十一烷基咪唑鎓偏苯三酸酯的催化剂(A),催化剂(B) 例如1-氰基乙基-2-乙基-4-甲基咪唑和球形熔融二氧化硅颗粒。 催化剂(A)和(B)之间的重量比(A / B)在9/1〜4/6的范围内。