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公开(公告)号:US20180120093A1
公开(公告)日:2018-05-03
申请号:US15798484
申请日:2017-10-31
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd.
发明人: Lei Zhou , Dandan Zhang , Roberto Francisco-Yi Lu , Qinglong Zeng
IPC分类号: G01B11/06 , G05B19/401
CPC分类号: G01B11/06 , G01B11/0691 , G01B21/042 , G01B2210/44 , G05B19/401
摘要: A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. The motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thus, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without debugging online, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.
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公开(公告)号:US10352687B2
公开(公告)日:2019-07-16
申请号:US15798513
申请日:2017-10-31
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd.
发明人: Lei Zhou , Dandan Zhang , Roberto Francisco-Yi Lu , Qinglong Zeng
IPC分类号: G01B11/06
摘要: An online thickness detection platform having a first laser sensor and a second laser sensor that detect a thickness of a product passing between the first arm and the second arm of a C-type frame on which the first laser sensor and a second laser sensor, respectively are adjustably mounted. The first laser sensor and the second laser sensor do not contact the product during detecting the thickness of the product. Because the thickness of the product is detected online, the thickness of the product is monitored in real-time. When the thickness of the product exceeds or falls below an allowed value range, production of the product is stopped, thereby avoiding producing a large number of unqualified products with a thickness out of the allowed value range and waste is prevented.
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公开(公告)号:US20180120095A1
公开(公告)日:2018-05-03
申请号:US15798513
申请日:2017-10-31
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co. Ltd.
发明人: Lei Zhou , Dandan Zhang , Roberto Francisco-Yi Lu , Qinglong Zeng
IPC分类号: G01B11/06
CPC分类号: G01B11/0691 , G01B2210/44
摘要: An online thickness detection platform having a first laser sensor and a second laser sensor that detect a thickness of a product passing between the first arm and the second arm of a C-type frame on which the first laser sensor and a second laser sensor, respectively are adjustably mounted. The first laser sensor and the second laser sensor do not contact the product during detecting the thickness of the product. Because the thickness of the product is detected online, the thickness of the product is monitored in real-time. When the thickness of the product exceeds or falls below an allowed value range, production of the product is stopped, thereby avoiding producing a large number of unqualified products with a thickness out of the allowed value range and waste is prevented.
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公开(公告)号:US20200023526A1
公开(公告)日:2020-01-23
申请号:US16587192
申请日:2019-09-30
发明人: Zhiyong Dai , Lvhai Hu , Yingcong Deng , Qinglong Zeng , Wei Kang
摘要: An automatic pick-up equipment adapted to pick up components having different shapes includes a base mounted on a manipulator of a robot, a first pick-up device mounted on the base and including a pair of first gripping mechanisms opposite to each other, and a second pick-up device mounted on the base and including a pair of second gripping mechanisms opposite to each other and a rotation mechanism. The first gripping mechanisms are configured to linearly reciprocate relative to each other to grip a first component. The second gripping mechanisms are configured to pivotally reciprocate relative to each other to grip a second component. The rotation mechanism is configured to drive the second gripping mechanisms to rotate relative to the base to change a posture of the second component.
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公开(公告)号:US20160128243A1
公开(公告)日:2016-05-05
申请号:US14928224
申请日:2015-10-30
申请人: Tyco Electronics (Shanghai) Co. Ltd. , Tyco Electronics (Shenzhen) Co. Ltd , Shenzhen AMI Technology Co., Ltd
发明人: Yingcong Deng , Dandan Zhang , Roberto Francisco-Yi Lu , Yaodong Wu , Zhenliang Chen , Zhao Li , Jin Su , Zhi Li , Qinglong Zeng
CPC分类号: B23Q16/06 , B23Q7/1426 , H05K13/021
摘要: An automatic component loading system is disclosed. The automatic component loading system has a loading device, a conveying device having a plurality of first pin receiving slots and a plurality of first component receiving trays positioned around a circumference of the conveying device, and a position correcting device having at least one pin that corresponds with the plurality of first pin receiving slots.
摘要翻译: 公开了一种自动部件装载系统。 所述自动部件装载系统具有装载装置,具有多个第一销接收槽的输送装置和围绕所述输送装置的圆周定位的多个第一部件接收托盘,以及位置校正装置,其具有至少一个对应于 与多个第一销接收槽。
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公开(公告)号:US11471967B2
公开(公告)日:2022-10-18
申请号:US16713185
申请日:2019-12-13
申请人: Tyco Electronics (Shanghai) Co. Ltd. , Measurement Specialties (China) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人: Yingcong Deng , Jeffrey Rochette , Qiyu Cai , Yang Zhou , Wenzhao Liao , Yumin Lan , Yanbing Fu , Yun Liu , Dandan Zhang , Qinglong Zeng
摘要: A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.
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公开(公告)号:US20200094339A1
公开(公告)日:2020-03-26
申请号:US16685462
申请日:2019-11-15
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人: Fengchun Xie , Dandan Zhang , Roberto-Francisco Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
摘要: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
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公开(公告)号:US10658807B2
公开(公告)日:2020-05-19
申请号:US15606056
申请日:2017-05-26
发明人: Zhiyong Dai , Lvhai Hu , Yingcong Deng , Lei Zhou , Yun Liu , Qinglong Zeng , Wei Kang
摘要: A terminal bending tool comprises a plate, a plurality of receiving grooves, and a plurality of rollers. The plate extends in a first horizontal direction. The receiving grooves are disposed in the plate in a row along the first horizontal direction. The rollers are pivotally mounted in the receiving grooves. A terminal is received and positioned in a first receiving groove and is in contact with an outer circumferential surface of a first roller. When the terminal bending tool is moved in a vertical direction perpendicular to the first horizontal direction, the first roller rotates and moves along a surface of the terminal while pressing and bending the terminal.
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公开(公告)号:US10512172B2
公开(公告)日:2019-12-17
申请号:US15335965
申请日:2016-10-27
申请人: Tyco Electronics (Dongguan) Co., Ltd. , Tyco Electronics (Shanghai) Co., Ltd , Shenzhen AMI Technology Co. Ltd , TE Connectivity Germany GmbH
摘要: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.
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公开(公告)号:US11141807B2
公开(公告)日:2021-10-12
申请号:US16685462
申请日:2019-11-15
申请人: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人: Fengchun Xie , Dandan Zhang , Roberto-Francisco Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
IPC分类号: B23K1/00 , B23K3/00 , B23K3/06 , B23K1/08 , B23K101/38
摘要: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
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