Sealing for OLED devices
    21.
    发明授权
    Sealing for OLED devices 有权
    OLED器件密封

    公开(公告)号:US06933537B2

    公开(公告)日:2005-08-23

    申请号:US09968164

    申请日:2001-09-28

    CPC分类号: H01L51/5246 H01L51/524

    摘要: Disclosed is a technique for increasing the shelf life of devices, such as OLED which requires hermetic sealing from moisture and oxygen with out increasing the bonding width. In one embodiment, the permeation path of moisture or oxygen is increased without increasing the bonding width. This is achieved by using a grooved interface between the cap and substrate on which the components of the device are formed. The grooved interface can comprise various geometric shapes.

    摘要翻译: 公开了一种用于增加诸如OLED的器件的保质期的技术,其需要通过增加接合宽度而从湿气和氧气密封。 在一个实施方案中,水分或氧气的渗透路径增加而不增加粘合宽度。 这通过使用在其上形成有器件的部件的帽和衬底之间的开槽界面来实现。 带槽的接口可以包括各种几何形状。

    Encapsulation of electroluminescent devices with shaped spacers
    23.
    发明授权
    Encapsulation of electroluminescent devices with shaped spacers 失效
    具有成型间隔物的电致发光器件的封装

    公开(公告)号:US07419842B2

    公开(公告)日:2008-09-02

    申请号:US11674098

    申请日:2007-02-12

    IPC分类号: H01L21/00

    摘要: A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.

    摘要翻译: 公开了封装装置的方法。 间隔物颗粒随机地位于装置区域中,以防止当将压力施加到盖子上时,安装在基板上的盖子与活性组分接触,从而保护活性成分免受损坏。 间隔物颗粒包括基部和上部,基部至少等于或大于上部。

    Encapsulating a device
    26.
    发明申请
    Encapsulating a device 有权
    封装设备

    公开(公告)号:US20050136571A1

    公开(公告)日:2005-06-23

    申请号:US11046389

    申请日:2005-01-27

    申请人: Ewald Guenther

    发明人: Ewald Guenther

    摘要: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

    摘要翻译: 公开了一种用于电气设备的封装。 在装置的非有源区域中设置盖支撑件,以防止包装件由于在包装中引起的机械应力而与装置的活动部件接触。

    Procedure for encapsulation of electronic devices
    27.
    发明授权
    Procedure for encapsulation of electronic devices 有权
    电子设备封装程序

    公开(公告)号:US06803245B2

    公开(公告)日:2004-10-12

    申请号:US09968567

    申请日:2001-09-28

    IPC分类号: H01L2100

    CPC分类号: H01L21/50 H01L51/5246

    摘要: An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.

    摘要翻译: 公开了一种用于有机发光二极管(OLED)器件的封装程序,特别是对于薄且因此柔性的衬底。 该装置密封,防止环境和机械损坏。 该方法包括使用薄的盖盖保持器和衬底保持器,其被设计成处理薄的衬底而不损坏它们。 薄的基板确保OLED器件具有足够的机械灵活性,并提供小于0.5mm的总体厚度。

    Barrier stack
    28.
    发明授权
    Barrier stack 失效
    障碍堆叠

    公开(公告)号:US06737753B2

    公开(公告)日:2004-05-18

    申请号:US09968189

    申请日:2001-09-28

    IPC分类号: H01L2348

    摘要: A barrier stack for sealing devices is described. The barrier stack includes at least first and second base layers bonded together with a high barrier adhesive. A base layer includes a flexible support coated on at least one major surface with a barrier layer. The adhesive advantageously seals defects, such as pinholes in the barrier layer, thus improving the barrier properties.

    摘要翻译: 描述了用于密封装置的阻挡层叠体。 阻挡层包括至少第一和第二基层与高阻隔粘合剂结合在一起。 基层包括涂覆在具有阻挡层的至少一个主表面上的柔性载体。 粘合剂有利地密封缺陷,例如阻挡层中的针孔,从而改善阻隔性能。