公开(公告)号：US20100059266A1

公开(公告)日：2010-03-11

申请号：US12405729

申请日：2009-03-17

申请人： Won Hee YOO ,  Byeung Gyu CHANG ,  Taek Jung LEE ,  Yong Suk KIM

发明人： Won Hee YOO ,  Byeung Gyu CHANG ,  Taek Jung LEE ,  Yong Suk KIM

IPC分类号： H05K1/11 ,  C03B25/00

CPC分类号： H05K3/4629 ,  B32B18/00 ,  C04B37/005 ,  C04B2237/04 ,  C04B2237/32 ,  C04B2237/52 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/595 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1126 ,  H05K2203/1476

摘要： Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.

摘要翻译： 提供一种制造陶瓷多层电路基板的方法。 形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。 烧制的陶瓷块彼此对准。 制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。 每个接合生片被插入在彼此相对的一对陶瓷块之间。 陶瓷块和接合生片结合，然后烧制。