摘要:
A multilayer ceramic capacitor that includes a laminate which has a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated. The dielectric layers are a perovskite type structure containing Ba, Sr, Zr, Ti and Hf, and optionally Ca, and further include V, wherein (number of moles of Sr)/(number of moles of Ba+number of moles of Ca+number of moles of Sr) is 0.6 to 0.95, (number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98, thicknesses of the dielectric layers are 1 μm or less, and an average particle size of dielectric particles constituting the dielectric layers is 0.8 μm or less.
摘要:
A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.
摘要:
A multilayer ceramic capacitor that includes a laminate which has a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated. The dielectric layers are a perovskite type structure containing Ba, Sr, Zr, Ti and Hf, and optionally Ca, and further include V, wherein (number of moles of Sr)/(number of moles of Ba+number of moles of Ca+number of moles of Sr) is 0.6 to 0.95, (number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98, thicknesses of the dielectric layers are 1 μm or less, and an average particle size of dielectric particles constituting the dielectric layers is 0.8 μm or less.
摘要:
An electrostatic chuck 10 includes a disc-shaped alumina ceramic base 12, and a heater electrode 14 and an electrostatic electrode 16 that are embedded in the alumina ceramic base 12. An upper surface of the alumina ceramic base 12 functions as a wafer-receiving surface 12a. The heater electrode 14 is formed in a pattern shape, for example, in the manner of a single brush stroke so as to be arranged over the entire surface of the alumina ceramic base 12. When a voltage is applied to the heater electrode 14, the heater electrode 14 generates heat, and heats a wafer W. This heater electrode 14 contains TiSi2 as a main component.
摘要:
Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
摘要:
Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.
摘要:
A honeycomb structure obtained by bonding, into one piece, a plurality of honeycomb segments (2) each having a plurality of passages (6) surrounded by cell walls and extending in the axial direction of the segment. In the honeycomb structure, a material A (3) having compressive elasticity is provided between a side surface (21) of at least one honeycomb segment [2(a)] not constituting the outermost peripheral surface (23) of the honeycomb structure (1) and a side surface of the honeycomb segment [(2(b)) adjacent thereto. A honeycomb structure assembly (8) obtained by providing a material B (5) having compressive elasticity on the outermost peripheral surface (23) of the honeycomb structure (1) in a compressed state and thereby compression-holding the resulting honeycomb structure in a metallic container (11). A honeycomb structure using materials having compressive elasticity (B) is resistant to breakage, and has superior durability and reliability, by reducing the thermal stress generated therein during use by a sharp temperature change of inflow gas, a local heat of reaction and a local heat of combustion.
摘要:
A method of fabricating a sintered ceramic composite body having at last one hollow portion therein is disclosed. According to this method, at least one green ceramic body in the form of a sheet or plate and an adhesive sheet made of a ceramic powder and a binder resin are provided. The adhesive sheet is capable of adhering to the green ceramic body after drying and is shaped to provide a hollow portion in association with green ceramic body. The adhesion body and the green ceramic body are brought into intimate contact with each other so that a hollow portion is established therebetween. The resulting composite body is pressed and sintered to obtain a sintered ceramic composite body having the hollow portion therein. The binder preferably includes acrylic resin(s) and/or vinyl resin(s) having a molecular weight of 300,000 to 800,000 and a glass transition temperature of -30.degree. C. or below.
摘要:
A ceramic bonded body may include a first member, a second member, a joining layer between the first member and the second member, and a covering layer which covers the joining layer and is located over the first member and the second member. The first member and the second member may include aluminum nitride-based ceramic. The joining layer and the covering layer may include at least aluminum, calcium, yttrium, and oxygen where, in 100 mass % of all of the constituents configuring the joining layer and the covering layer, the aluminum is 21 mass % or more converted to oxides, the calcium is 21 mass % or more converted to oxides, and the sum of the aluminum and the calcium converted to oxides is 86 mass % or more. The covering layer has a content of yttrium converted to oxides greater than that of the joining layer.
摘要:
Multilayer ceramic chip capacitors which satisfy COG requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a barium strontium zirconate matrix doped with other metal oxides such as TiO2, CaO, B2O3, and MgO in various combinations.