DEVICES USING ABRUPT METAL-INSULATOR TRANSITION LAYER AND METHOD OF FABRICATING THE DEVICE
    21.
    发明申请
    DEVICES USING ABRUPT METAL-INSULATOR TRANSITION LAYER AND METHOD OF FABRICATING THE DEVICE 失效
    使用破坏金属绝缘体过渡层的器件和制造器件的方法

    公开(公告)号:US20090230428A1

    公开(公告)日:2009-09-17

    申请号:US11721069

    申请日:2005-12-05

    IPC分类号: H01L29/78 H01L21/336

    CPC分类号: H01L49/003 H01L29/452

    摘要: The abrupt metal-insulator transition device includes: an abrupt metal insulator transition material layer including an energy gap of less than or equal to 2 eV and holes within a hole level; and two electrodes contacting the abrupt metal-insulator transition material layer. Here, each of the two electrodes is formed by thermally treating a stack layer of a first layer formed on the abrupt metal-insulator transition material layer and comprising Ni or Cr, a second layer formed on the first layer and comprising In, a third layer formed on the second layer and comprising Mo or W, and a fourth layer formed on the third layer and comprising Au.

    摘要翻译: 突变金属 - 绝缘体转换装置包括:突然的金属绝缘体过渡材料层,其包括小于或等于2eV的能隙和孔内的孔; 并且两个电极接触突变的金属 - 绝缘体转移材料层。 这里,两个电极中的每一个通过热处理形成在突变金属 - 绝缘体转移材料层上并包含Ni或Cr的第一层的叠层形成,第二层形成在第一层上并包括In的第三层,第三层 形成在第二层上并且包含Mo或W,以及形成在第三层上并包含Au的第四层。