公开(公告)号：US20080179383A1

公开(公告)日：2008-07-31

申请号：US11699046

申请日：2007-01-29

申请人： Hitoshi Sakurai ,  Yoichi Kukimoto

发明人： Hitoshi Sakurai ,  Yoichi Kukimoto

IPC分类号： B23K31/02 ,  B23K35/363

CPC分类号： H05K3/3484 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K2201/0266 ,  Y10T428/1486

摘要： A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

摘要翻译： 一种焊料组合物，其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法，在由坝围绕的开口部内填充电极上的焊膏组合物，并加热填充的焊膏组合物，使得 焊料粘附到电极的表面。 该焊膏组合物含有焊料粉末，该焊料粉末的粒径分布为粒径小于10μm的粒子的含量为16％以上，粒径为10μm以下的粒子的总和为 10μm以上且小于20μm的粒径为90％以上。 由此，能够抑制突起缺陷的发生，通过使用该堤坝的焊料预涂法，能够以高产率形成均匀高度的焊料凸块。

公开(公告)号：US07291517B2

公开(公告)日：2007-11-06

申请号：US11248183

申请日：2005-10-13

申请人： Hitoshi Sakurai ,  Kimihiro Abe ,  Norio Matsumoto

发明人： Hitoshi Sakurai ,  Kimihiro Abe ,  Norio Matsumoto

IPC分类号： H01L21/00

CPC分类号： H01L24/12 ,  H01L21/31133 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the surface of the electrodes. Subsequently, in removing the resin mask layer, at least one selected from glycol ethers and aminoalcohols is used. Thereby, the resin mask layer is removed after heating process. This makes it possible to easily remove the heat-processed resin mask layer in a short period of time without damaging solder resist and solder bumps on the substrate.

摘要翻译： 使用作为感光性树脂的干膜抗蚀剂，在基板的电极周围形成树脂掩模层。 将焊料沉淀组合物施加到基板上，并加热该焊料沉淀组合物以在焊料的表面上沉淀焊料。 随后，在除去树脂掩模层时，使用选自二醇醚和氨基醇中的至少一种。 由此，在加热处理之后，除去树脂掩模层。 这使得可以在短时间内容易地除去热处理树脂掩模层，而不会损坏基板上的阻焊剂和焊料凸块。

公开(公告)号：US20060110907A1

公开(公告)日：2006-05-25

申请号：US11248183

申请日：2005-10-13

申请人： Hitoshi Sakurai ,  Kimihiro Abe ,  Norio Matsumoto

发明人： Hitoshi Sakurai ,  Kimihiro Abe ,  Norio Matsumoto

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L21/31133 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the surface of the electrodes. Subsequently, in removing the resin mask layer, at least one selected from glycol ethers and aminoalcohols is used. Thereby, the resin mask layer is removed after heating process. This makes it possible to easily remove the heat-processed resin mask layer in a short period of time without damaging solder resist and solder bumps on the substrate.

摘要翻译： 使用作为感光性树脂的干膜抗蚀剂，在基板的电极周围形成树脂掩模层。 将焊料沉淀组合物施加到基板上，并加热该焊料沉淀组合物以在焊料的表面上沉淀焊料。 随后，在除去树脂掩模层时，使用选自二醇醚和氨基醇中的至少一种。 由此，在加热处理之后，除去树脂掩模层。 这使得可以在短时间内容易地除去热处理树脂掩模层，而不会损坏基板上的阻焊剂和焊料凸块。

公开(公告)号：US5674374A

公开(公告)日：1997-10-07

申请号：US348119

申请日：1994-11-28

申请人： Hitoshi Sakurai ,  Satoshi Yuasa

发明人： Hitoshi Sakurai ,  Satoshi Yuasa

IPC分类号： C25D3/56 ,  C25D3/60 ,  C25D3/32

CPC分类号： C25D3/60

摘要： A Sn--Bi alloy plating bath comprises at least one compound selected from the group consisting of polyoxy monocarboxylic acids, polyoxy lactones, polycarboxylic acids and salts thereof. A plating method comprises the step of applying a Sn--Bi alloy plating film to a substrate in the foregoing plating bath. The plating bath permits the formation of a Sn--Bi alloy plating film having a bismuth content ranging from 0.1 to 75% over a wide current density range. Moreover, the plating bath never forms precipitates, does not become turbid, does not cause any change of the bath composition and is, therefore, quite stable even when it is stored over a long period of time.

摘要翻译： Sn-Bi合金镀液包含至少一种选自聚氧单羧酸，聚氧内酯，多元羧酸及其盐的化合物。 电镀方法包括在上述镀浴中将Sn-Bi合金镀膜涂敷在基板上的工序。 电镀浴允许在宽电流密度范围内形成具有0.1至75％的铋含量的Sn-Bi合金电镀膜。 此外，电镀浴不会形成析出物，不会变得混浊，不会引起浴组合物的任何变化，因此即使在长时间储存​​时也是相当稳定的。