公开(公告)号：US07893606B2

公开(公告)日：2011-02-22

申请号：US12555398

申请日：2009-09-08

Applicant: Yu-Kai Lin

Inventor： Yu-Kai Lin

IPC: H01J1/62

CPC classification number: H01B1/22 ,  H01B1/16 ,  H01J9/02 ,  H01J9/248 ,  H01J61/0675 ,  H01J61/305 ,  H01J65/046 ,  H05B33/28

Abstract: A conductive composition and applications thereof are provided. The conductive composition comprises a mixture consisting of a metal powder and a glass powder. The diameter of the metal powder ranges from about 1 μm to about 3 μm. The diameter of glass powder ranges from about 0.5 μm to about 1 μm. The weight percentage of the metal powder to the mixture is from about 60% to about 98%. The conductive composition could be used to manufacture the electrodes of a flat lamp.

Abstract translation: 提供导电组合物及其应用。 导电组合物包含由金属粉末和玻璃粉末组成的混合物。 金属粉末的直径为约1μm至约3μm。 玻璃粉末的直径为约0.5μm至约1μm。 金属粉末对混合物的重量百分比为约60％至约98％。 导电组合物可用于制造平板灯的电极。

公开(公告)号：US07843116B2

公开(公告)日：2010-11-30

申请号：US11034970

申请日：2005-01-14

Applicant: Yu-Kai Lin ,  Jiun-Han Wu ,  Yao-Ching Su ,  Po-Cheng Chen

Inventor： Yu-Kai Lin ,  Jiun-Han Wu ,  Yao-Ching Su ,  Po-Cheng Chen

IPC: G06F1/16 ,  H05K7/20

CPC classification number: H05K5/02 ,  H05K7/20963

Abstract: A Plasma Display Panel (PDP) apparatus, system and method, includes a circuit framework structure, chassis structure, panel structure, TCP structure, at least one thermal pad structure and an insulating structure. An integrated circuit is coupled to at least one thermal pad structure and the TCP structure, and the circuit framework structure is disposed external to the TCP structure. Therefore, efficient dissipation of heat that is generated during operation of the PDP structures may be obtained. In addition, the amount of accumulated heat in the PDP structure may be significantly reduced due the PDP apparatus and structure configuration, thereby increasing the PDP operational life.

Abstract translation: 等离子体显示面板（PDP）装置，系统和方法包括电路框架结构，底盘结构，面板结构，TCP结构，至少一个散热垫结构和绝缘结构。 集成电路耦合到至少一个热垫结构和TCP结构，并且电路框架结构设置在TCP结构的外部。 因此，可以获得在PDP结构的操作期间产生的热的有效散逸。 此外，由于PDP装置和结构构造，PDP结构中的累积热量可能会显着降低，从而增加了PDP的使用寿命。

公开(公告)号：US20100003884A1

公开(公告)日：2010-01-07

申请号：US12555398

申请日：2009-09-08

Applicant: Yu-Kai Lin

Inventor： Yu-Kai Lin

IPC: H01J9/00 ,  H01B1/22

CPC classification number: H01B1/22 ,  H01B1/16 ,  H01J9/02 ,  H01J9/248 ,  H01J61/0675 ,  H01J61/305 ,  H01J65/046 ,  H05B33/28

Abstract: A conductive composition and applications thereof are provided. The conductive composition comprises a mixture consisting of a metal powder and a glass powder. The diameter of the metal powder ranges from about 1 μm to about 3 μm. The diameter of glass powder ranges from about 0.5 μm to about 1 μm. The weight percentage of the metal powder to the mixture is from about 60% to about 98%. The conductive composition could be used to manufacture the electrodes of a flat lamp.

Abstract translation: 提供导电组合物及其应用。 导电组合物包含由金属粉末和玻璃粉末组成的混合物。 金属粉末的直径为约1μm至约3μm。 玻璃粉末的直径为约0.5μm至约1μm。 金属粉末对混合物的重量百分比为约60％至约98％。 导电组合物可用于制造扁平灯的电极。

公开(公告)号：US20090103302A1

公开(公告)日：2009-04-23

申请号：US12062850

申请日：2008-04-04

Applicant: Yu-Kai Lin ,  Ya-hsien Chang

Inventor： Yu-Kai Lin ,  Ya-hsien Chang

IPC: F21S6/00 ,  H05K1/18

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/09309 ,  H05K2201/10106

Abstract: A circuit board assembly and a backlight module comprising the circuit board assembly are provided. The circuit board assembly has a first surface and a second surface opposite to the first surface, and further comprises at least one laminate, a first conductive wiring structure and a coating. The first conductive wiring structure is formed on the first surface. The coating is formed on the coating area of the second surface, wherein the coating can conduct heat and provide electric insulation. Thus, the circuit board assembly is adapted to outwardly conduct heat from the laminate through the second surface and to promote the heat dissipation efficiency of the circuit board assembly.

Abstract translation: 提供了包括电路板组件的电路板组件和背光模组。 电路板组件具有与第一表面相对的第一表面和第二表面，并且还包括至少一个层压体，第一导电布线结构和涂层。 第一导电布线结构形成在第一表面上。 涂层形成在第二表面的涂覆区域上，其中涂层可以传导热量并提供电绝缘。 因此，电路板组件适于向外传导来自层压板的热量通过第二表面并且促进电路板组件的散热效率。

公开(公告)号：US20050266231A1

公开(公告)日：2005-12-01

申请号：US10992842

申请日：2004-11-22

Applicant: Yu-Kai Lin

Inventor： Yu-Kai Lin

IPC: B32B3/26 ,  G02F1/133 ,  H05K7/20

CPC classification number: G02F1/133385 ,  Y10T428/24479 ,  Y10T428/24488 ,  Y10T428/249981 ,  Y10T428/249982 ,  Y10T428/249984 ,  Y10T428/249986 ,  Y10T428/24999

Abstract: A display monitor includes a heat source, a metal frame and a heat sink disposed between the heat source and the metal frame in order to lower ambient temperature. The heat sink includes a metal layer and a sandwiching pad disposed on the metal layer. The sandwiching pad is made from a material doped with conductive powders.

Abstract translation: 显示监视器包括热源，金属框架和设置在热源和金属框架之间的散热器，以便降低环境温度。 散热器包括设置在金属层上的金属层和夹层垫。 夹层由掺有导电粉末的材料制成。

公开(公告)号：US07922362B2

公开(公告)日：2011-04-12

申请号：US12062850

申请日：2008-04-04

Applicant: Yu-Kai Lin ,  Ya-hsien Chang

Inventor： Yu-Kai Lin ,  Ya-hsien Chang

IPC: F21V29/00

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/09309 ,  H05K2201/10106

Abstract: A circuit board assembly and a backlight module comprising the circuit board assembly are provided. The circuit board assembly has a first surface and a second surface opposite to the first surface, and further comprises at least one laminate, a first conductive wiring structure and a coating. The first conductive wiring structure is formed on the first surface. The coating is formed on the coating area of the second surface, wherein the coating can conduct heat and provide electric insulation. Thus, the circuit board assembly is adapted to outwardly conduct heat from the laminate through the second surface and to promote the heat dissipation efficiency of the circuit board assembly.

Abstract translation: 提供了包括电路板组件的电路板组件和背光模组。 电路板组件具有与第一表面相对的第一表面和第二表面，并且还包括至少一个层压体，第一导电布线结构和涂层。 第一导电布线结构形成在第一表面上。 涂层形成在第二表面的涂覆区域上，其中涂层可以传导热量并提供电绝缘。 因此，电路板组件适于向外传导来自层压板的热量通过第二表面并且促进电路板组件的散热效率。

公开(公告)号：US07605528B2

公开(公告)日：2009-10-20

申请号：US11674687

申请日：2007-02-14

Applicant: Yu-Kai Lin

Inventor： Yu-Kai Lin

IPC: H01J1/62

CPC classification number: H01B1/22 ,  H01B1/16 ,  H01J9/02 ,  H01J9/248 ,  H01J61/0675 ,  H01J61/305 ,  H01J65/046 ,  H05B33/28

Abstract: A conductive composition and applications thereof are provided. The conductive composition comprises metal powder and glass powder. The diameter of metal powder ranges from 1 μm to 3 μm. The diameter of glass powder ranges from 0.5 μm to 1 μm. Weight percentage of the metal powder is from 60% to 98%. The conductive composition could be applied to manufacture the electrodes of a flat lamp.

Abstract translation: 提供导电组合物及其应用。 导电组合物包括金属粉末和玻璃粉末。 金属粉末的直径为1〜3μm。 玻璃粉末的直径为0.5μm至1μm。 金属粉末的重量百分数为60％〜98％。 导电组合物可用于制造平板灯的电极。

公开(公告)号：US20090104833A1

公开(公告)日：2009-04-23

申请号：US12342168

申请日：2008-12-23

Applicant: Yu-Kai Lin

Inventor： Yu-Kai Lin

IPC: H01J9/00

CPC classification number: H05K7/20963

Abstract: A plasma display device having a laminar attachment structure capable of increasing attachment of a heat-dissipating plate to a plasma display panel. Through a laminar attachment structure with a plurality of small pieces of thermal pad or adhesive double tape and a closed loop of thermal pad or adhesive double tape accommodating the plurality of small pieces as well as by means of vacuum pumping, the air within the closed loop is drawn out when the heat-dissipating plate is combined to the plasma display panel so as to reduce bubbles formed between the heat-dissipating plate and the plasma display panel and to increase tight attachment therebetween.

Abstract translation: 一种等离子体显示装置，其具有能够增加散热板与等离子体显示面板的连接的层状连接结构。 通过具有多个小块热垫或粘合双带的层状连接结构以及容纳多个小块的热垫或粘合双面胶带的闭环以及通过真空泵送，闭环内的空气 当将散热板组合到等离子体显示面板时被拉出，以便减少在散热板和等离子体显示面板之间形成的气泡并增加它们之间的紧密附着。

公开(公告)号：US07477016B2

公开(公告)日：2009-01-13

申请号：US10722495

申请日：2003-11-28

Applicant: Yu-Kai Lin

Inventor： Yu-Kai Lin

IPC: H01J17/49

CPC classification number: H05K7/20963

Abstract: A plasma display device having a laminar attachment structure capable of increasing attachment of a heat-dissipating plate to a plasma display panel. Through a laminar attachment structure with a plurality of small pieces of thermal pad or adhesive double tape and a closed loop of thermal pad or adhesive double tape accommodating the plurality of small pieces as well as by means of vacuum pumping, the air within the closed loop is drawn out when the heat-dissipating plate is combined to the plasma display panel so as to reduce bubbles formed between the heat-dissipating plate and the plasma display panel and to increase tight attachment therebetween.

Abstract translation: 一种等离子体显示装置，其具有能够增加散热板与等离子体显示面板的连接的层状连接结构。 通过具有多个小块热垫或粘合双带的层状连接结构以及容纳多个小块的热垫或粘合双面胶带的闭环以及通过真空泵送，闭环内的空气 当将散热板组合到等离子体显示面板时被拉出，以便减少在散热板和等离子体显示面板之间形成的气泡并增加它们之间的紧密附着。

公开(公告)号：US07467877B2

公开(公告)日：2008-12-23

申请号：US11532110

申请日：2006-09-15

Applicant: Chung Peng ,  Chih-Kuang Chen ,  Shin-Chin Tseng ,  Yu-Kai Lin ,  Shen-Hong Chou

Inventor： Chung Peng ,  Chih-Kuang Chen ,  Shin-Chin Tseng ,  Yu-Kai Lin ,  Shen-Hong Chou

IPC: F21S13/14

CPC classification number: G02F1/133603 ,  F21K9/00 ,  F21Y2105/12 ,  G02F2001/133613

Abstract: A light source for a backlight unit is disclosed. The light source includes a plurality of light emitting diode modules arranged in a manner corresponding to an array, in which each of the light emitting diode modules includes a plurality of light emitting diodes. The array includes a plurality of columns and rows. Preferably, the light emitting diodes of the light emitting diode module of any two adjacent columns are arranged in a different manner, and the light emitting diodes of the light emitting diode module of any two adjacent rows are arranged in a different manner.

Abstract translation: 公开了一种用于背光单元的光源。 光源包括以对应于阵列的方式布置的多个发光二极管模块，其中每个发光二极管模块包括多个发光二极管。 阵列包括多个列和行。 优选地，任何两个相邻列的发光二极管模块的发光二极管以不同的方式布置，并且任何两个相邻行的发光二极管模块的发光二极管以不同的方式布置。