公开(公告)号：US20190098855A1

公开(公告)日：2019-04-04

申请号：US16192673

申请日：2018-11-15

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Atsushi Morishima

IPC: A01H5/10 ,  C12N15/82 ,  A01H6/54 ,  A01H1/02

CPC classification number: A01H5/10 ,  A01H1/02 ,  A01H6/542 ,  C12N15/8245 ,  C12N15/8247 ,  C12N15/8251 ,  C12N15/8271 ,  C12N15/8274 ,  C12N15/8275 ,  C12N15/8278 ,  C12N15/8279 ,  C12N15/8286 ,  C12N15/8289 ,  H05K1/025 ,  H05K1/114 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/0776 ,  H05K2201/09227 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/0979

Abstract: Apparatuses and methods including conductive vias of a printed circuit board are described. An example apparatus includes a first layer including a first conductive plate; a component on the first layer, a second layer including a second conductive plate that may be coupled to an external power source; a third layer between the first layer and the second layer, the third layer including a third conductive plate; a first via coupling the first conductive plate to the second conductive plate; and a second via coupled to the first conductive plate. The first conductive plate includes a first portion coupled to the first via and the first conductive plate further includes a second portion coupled to the second via between the first portion and the component. The second via is coupled to either the second conductive plate or the third conductive plate.

公开(公告)号：US20180235076A1

公开(公告)日：2018-08-16

申请号：US15737876

申请日：2016-07-04

Applicant: NEC Corporation

Inventor： Kazuhiro KASHIWAKURA ,  Ayako UEMURA

IPC: H05K1/02 ,  H05K3/46 ,  H05K9/00 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/11 ,  H05K3/46 ,  H05K9/0064 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09609 ,  H05K2201/10

Abstract: An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

公开(公告)号：US09634369B2

公开(公告)日：2017-04-25

申请号：US14312931

申请日：2014-06-24

Applicant: Hiroshi Toyao

Inventor： Hiroshi Toyao

IPC: H01P5/12 ,  H01P3/02 ,  H01P1/20 ,  H01P3/08 ,  H01P5/02 ,  H01P7/08 ,  H01Q9/04 ,  H05K1/02 ,  H01P1/201 ,  H01P3/00 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01P3/026 ,  H01P1/2005 ,  H01P1/2013 ,  H01P3/006 ,  H01P3/081 ,  H01P5/028 ,  H01P7/082 ,  H01Q9/04 ,  H05K1/0236 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09309

Abstract: A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

公开(公告)号：US09583901B2

公开(公告)日：2017-02-28

申请号：US14501321

申请日：2014-09-30

Applicant: Rosemount Inc.

Inventor： Christopher Eriksen ,  Michael Barth

IPC: H01R25/00 ,  H01R13/52 ,  H05K3/34 ,  H01R9/24 ,  H05K7/02 ,  H01R12/58 ,  H01R13/719 ,  H01R12/55

CPC classification number: H01R25/006 ,  H01L2224/73265 ,  H01R9/2466 ,  H01R12/55 ,  H01R12/585 ,  H01R13/5202 ,  H01R13/719 ,  H01R24/68 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K7/026 ,  H05K2201/09027 ,  H05K2201/09309 ,  H05K2201/10015 ,  H05K2201/10303

Abstract: A seal board includes a circuit board with vias, conductor pins, and solder joints. The solder joints connect and seal each conductor pin to a single via, such that each conductor pin extends through the via and extends from a first side of the circuit board and a second side of the circuit board. The seal board is mounted to cover an opening in a bulkhead that separates a first compartment (such as a terminal block compartment) from a second compartment (such as an electronics or feature board compartment). The seal board provides electrical paths between the compartments while protecting components within one of the compartments from the surrounding environment.

Abstract translation: 密封板包括具有通孔，导体引脚和焊点的电路板。 焊接点将每个导体销连接并密封到单个通孔，使得每个导体引脚延伸穿过通孔并从电路板的第一侧和电路板的第二侧延伸。 密封板被安装成覆盖隔离第一隔室（例如端子排隔室）与第二隔室（例如电子设备或特征板隔室）的隔板中的开口。 密封板在隔室之间提供电气路径，同时保护隔室内的部件与周围环境保持一致。

公开(公告)号：US20160309559A1

公开(公告)日：2016-10-20

申请号：US15136599

申请日：2016-04-22

Applicant: ARKALUMEN INC.

Inventor： Gerald Edward BRIGGS

IPC: H05B33/08

CPC classification number: H05B33/0827 ,  F21K9/60 ,  F21K99/00 ,  F21S4/20 ,  F21V23/005 ,  F21V23/04 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0857 ,  H05K1/05 ,  H05K2201/09309 ,  H05K2201/09972 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine.

Abstract translation: 公开了一种基于LED的照明装置。 在照明装置中使用的光引擎可以使用印刷电路板，并且具有可由控制单元独立控制的多个LED组。 连接到每个LED组的电源输入和返回路径可以在不同的层上实现，以允许紧凑的占地面积可以与具有相对较少修改的传统荧光灯罩一起使用。 LED可以包括具有第一颜色的LED的子集和具有与在光引擎上交织的所述第一颜色不同的第二颜色的LED的子集。

公开(公告)号：US20160192489A1

公开(公告)日：2016-06-30

申请号：US14962634

申请日：2015-12-08

Applicant: FUJITSU LIMITED

Inventor： Yuki KANAI ,  Takashi IMAMOTO

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/144 ,  G06F1/189 ,  G06F1/26 ,  H05K1/0265 ,  H05K1/113 ,  H05K1/141 ,  H05K2201/042 ,  H05K2201/09309 ,  H05K2201/0979 ,  H05K2201/10242 ,  H05K2201/10303

Abstract: A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite side of the top surface, and a plurality of first through holes and a plurality of second through holes capable of being electrically connected with the processor by penetrating through the first board from the top surface to the bottom surface; a second board arranged at a position distant from the bottom surface of the first board and provided with a power supply device; a first conductor mounted on the bottom surface of the first board and electrically connects the plurality of first through holes and the power supply device, and a second conductor mounted on the bottom surface of the first board and electrically connects the plurality of second through holes and the power supply device.

Abstract translation: 电源板包括：第一板，其包括可在其上安装处理器的顶表面，位于顶表面相对侧的底表面，以及多个第一通孔和多个第二通孔 能够通过从顶表面穿透第一板到底表面而与处理器电连接; 布置在远离所述第一板的底表面的位置并且设置有电源装置的第二板; 第一导体，其安装在所述第一板的底表面上，并且电连接所述多个第一通孔和所述电源装置;以及第二导体，其安装在所述第一板的底表面上，并且电连接所述多个第二通孔和 电源装置。

公开(公告)号：US09347631B2

公开(公告)日：2016-05-24

申请号：US14606013

申请日：2015-01-26

Applicant: ARKALUMEN INC.

Inventor： Gerald Edward Briggs

IPC: F21S9/00 ,  H01L33/48 ,  H05B37/02 ,  H05B33/08 ,  F21S4/00 ,  H01L25/075 ,  H05K1/05 ,  F21K99/00 ,  F21V23/00 ,  F21V23/04 ,  H01L33/62 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H05B33/0827 ,  F21K9/60 ,  F21K99/00 ,  F21S4/20 ,  F21V23/005 ,  F21V23/04 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0857 ,  H05K1/05 ,  H05K2201/09309 ,  H05K2201/09972 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use a multi-layer metal core printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification.

公开(公告)号：US09343398B2

公开(公告)日：2016-05-17

申请号：US14497825

申请日：2014-09-26

Applicant: Invensas Corporation

Inventor： Yong Chen ,  Zhuowen Sun ,  Kyong-Mo Bang

IPC: H01L23/498 ,  H05K1/02

CPC classification number: H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/181 ,  H05K1/0262 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09336 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A microelectronic package can include a substrate and a microelectronic element. The substrate can include terminals comprising at least first power terminals and other terminals in an area array at a surface of the substrate. The substrate can also include a power plane element electrically coupled to the first power terminals. The area array can have a peripheral edge and a continuous gap between the terminals extending inwardly from the peripheral edge in a direction parallel to the surface. The terminals on opposite sides of the gap can be spaced from one another by at least 1.5 times a minimum pitch of the terminals. The power plane element can extend within the gap from at least the peripheral edge at least to the first power terminals. Each first power terminal can be separated from the peripheral edge by two or more of the other terminals.

Abstract translation: 微电子封装可以包括衬底和微电子元件。 衬底可以包括在衬底的表面处的区域阵列中至少包括第一电源端子和其他端子的端子。 基板还可以包括电耦合到第一电源端子的功率平面元件。 区域阵列可以具有周边边缘和在平行于表面的方向上从周边边缘向内延伸的端子之间的连续间隙。 间隙的相对侧上的端子可以彼此间隔开至少1.5倍的端子的最小间距。 功率平面元件可以在间隙内从至少外围边缘至少延伸到第一电源端子。 每个第一电源端子可以通过两个或更多其它端子与外围边缘分离。

公开(公告)号：US09330992B2

公开(公告)日：2016-05-03

申请号：US14196736

申请日：2014-03-04

Applicant: Renesas Electronics Corporation

Inventor： Kazuyuki Nakagawa

IPC: H01L23/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K1/11 ,  H01L23/367 ,  H05K1/02 ,  H01L23/00

CPC classification number: H01L23/12 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/116 ,  H05K2201/09309 ,  H05K2201/09718 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05432 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device is provided with improved resistance to noise. Conductive planes are respectively formed over wiring layers. One wiring layer is provided with a through hole land integrally formed with a through hole wiring. In other wiring layers located over the wiring layer with the through hole land, openings are respectively formed in the conductive planes. The area of each of the openings is larger than the plane area of the through hole land.

Abstract translation: 半导体器件具有改善的抗噪声能力。 导电平面分别形成在布线层上。 一个布线层设置有与通孔布线一体形成的通孔区域。 在位于具有通孔焊盘的布线层上方的其它布线层中，在导电平面中分别形成开口。 每个开口的面积大于通孔平台的平面面积。

公开(公告)号：US20160093997A1

公开(公告)日：2016-03-31

申请号：US14501321

申请日：2014-09-30

Applicant: Rosemount Inc.

Inventor： Christopher Eriksen ,  Michael Barth

IPC: H01R25/00 ,  H01R13/719 ,  H01R13/52

CPC classification number: H01R25/006 ,  H01L2224/73265 ,  H01R9/2466 ,  H01R12/55 ,  H01R12/585 ,  H01R13/5202 ,  H01R13/719 ,  H01R24/68 ,  H05K1/115 ,  H05K3/3447 ,  H05K3/429 ,  H05K7/026 ,  H05K2201/09027 ,  H05K2201/09309 ,  H05K2201/10015 ,  H05K2201/10303

Abstract: A seal board includes a circuit board with vias, conductor pins, and solder joints. The solder joints connect and seal each conductor pin to a single via, such that each conductor pin extends through the via and extends from a first side of the circuit board and a second side of the circuit board. The seal board is mounted to cover an opening in a bulkhead that separates a first compartment (such as a terminal block compartment) from a second compartment (such as an electronics or feature board compartment). The seal board provides electrical paths between the compartments while protecting components within one of the compartments from the surrounding environment.

Abstract translation: 密封板包括具有通孔，导体引脚和焊点的电路板。 焊接点将每个导体销连接并密封到单个通孔，使得每个导体引脚延伸穿过通孔并从电路板的第一侧和电路板的第二侧延伸。 密封板被安装成覆盖隔离第一隔室（例如端子排隔室）与第二隔室（例如电子设备或特征板隔室）的隔板中的开口。 密封板在隔室之间提供电气路径，同时保护隔室内的部件与周围环境保持一致。