CONNECTING STRUCTURE AND METHOD THEREOF
    21.
    发明申请
    CONNECTING STRUCTURE AND METHOD THEREOF 审中-公开
    连接结构及其方法

    公开(公告)号:US20080011906A1

    公开(公告)日:2008-01-17

    申请号:US11773972

    申请日:2007-07-06

    IPC分类号: F16L5/00

    CPC分类号: F16L3/08

    摘要: A connecting structure for connecting a pipe-shaped element including a base and at least a lock element is provided. The base includes a first clamper, a second clamper and a spacer. The first clamper and the second clamper are connected together on one side while a gap is maintained between the first clamper and the second clamper on the other side to form a groove that connects with the spacer. One end of the pipe-shaped element is disposed inside the spacer. The first clamper has at least a lock hole and the second clamper has at least a corresponding second lock hole. The pipe-shaped element disposed inside the spacer is tightly assembled to the base by the lock element through the first lock hole and the second lock hole. Furthermore, a connecting method for connecting the pipe-shaped element is also provided.

    摘要翻译: 提供了一种用于连接包括基座和至少锁定元件的管状元件的连接结构。 基座包括第一夹持器,第二夹持器和间隔件。 第一夹持器和第二夹持器在一侧连接在一起,而在第一夹持器和另一侧的第二夹持器之间保持间隙,以形成与间隔件连接的凹槽。 管状元件的一端设置在间隔件的内部。 第一夹持器至少具有锁定孔,并且第二夹持器具有至少相应的第二锁定孔。 设置在间隔件内的管状元件通过锁定元件通过第一锁定孔和第二锁定孔紧密组装到基座。 此外,还提供了用于连接管状元件的连接方法。

    Fastening member for use in a heat-dissipating device
    22.
    发明申请
    Fastening member for use in a heat-dissipating device 审中-公开
    用于散热装置的紧固件

    公开(公告)号:US20070115642A1

    公开(公告)日:2007-05-24

    申请号:US11602399

    申请日:2006-11-21

    申请人: Ching Ho

    发明人: Ching Ho

    IPC分类号: H05K7/20

    摘要: A heat-dissipating device includes: a base plate for disposing on a mounting surface, a plurality of cooling fins extending vertically from the base plate to define a first channel and a second channel on an upper surface of the base plate, and a fastening member. The fastening member includes a first portion disposed in the first channel and having an engaging element for engaging a lower surface of the base plate adjacent to one end thereof, a second portion disposed in the second channel and extending integrally from the first portion, and a third portion extending integrally from the second portion. The first and second portions are located in a plane, which cooperates with the third portion to define an angle. The third portion has a hook for securing the base plate onto the mounting surface.

    摘要翻译: 一种散热装置,包括:基板,用于设置在安装表面上;多个散热片,从所述基板垂直延伸,以限定所述基板的上表面上的第一通道和第二通道;以及紧固构件 。 紧固构件包括设置在第一通道中的第一部分,并且具有接合元件,用于接合基板的与其一端相邻的下表面,第二部分设置在第二通道中并且从第一部分整体延伸, 第三部分从第二部分整体延伸。 第一和第二部分位于与第三部分配合以限定角度的平面中。 第三部分具有用于将基板固定到安装表面上的钩。

    CLIP ASSEMBLY
    23.
    发明申请
    CLIP ASSEMBLY 审中-公开
    剪辑组装

    公开(公告)号:US20070111594A1

    公开(公告)日:2007-05-17

    申请号:US11538065

    申请日:2006-10-03

    申请人: Chih Chun Huang

    发明人: Chih Chun Huang

    IPC分类号: H01R13/73

    摘要: A clip assembly for clipping a heatsink module on the first or second circuit board is provided. The first and second circuit boards respectively have first and second mounting holes located around the first and second device. The clip assembly includes a base, mounting parts and a clipper. The base located on the first or second circuit board has an opening, first clipping portions, third and fourth mounting holes. The first or second device is disposed in the opening and the heatsink module is in contact with the first or second device. The mounting parts pass through the corresponding first and third mounting holes or through the corresponding second and fourth mounting holes for fixing the base on the first or second circuit board. The clipper has second clipping portions to clasp first clipping portions so as to clip the heatsink module on the base.

    摘要翻译: 提供了用于在第一或第二电路板上限制散热器模块的夹子组件。 第一和第二电路板分别具有位于第一和第二装置周围的第一和第二安装孔。 夹子组件包括底座,安装部件和剪刀。 位于第一或第二电路板上的基座具有开口,第一夹持部分,第三和第四安装孔。 第一或第二装置设置在开口中,并且散热模块与第一或第二装置接触。 安装部件通过相应的第一和第三安装孔或通过相应的第二和第四安装孔,用于将基座固定在第一或第二电路板上。 裁板器具有第二夹持部分,以夹紧第一夹持部分,以将散热器模块夹在底座上。

    Heat dissipating structure including a position-adjusting unit
    24.
    发明授权
    Heat dissipating structure including a position-adjusting unit 有权
    散热结构包括位置调节单元

    公开(公告)号:US07944688B2

    公开(公告)日:2011-05-17

    申请号:US12332032

    申请日:2008-12-10

    IPC分类号: H05K7/20 F28F7/00 H01L23/34

    CPC分类号: G06F1/20

    摘要: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.

    摘要翻译: 用于热源的散热结构包括位置调节单元,第一散热元件,第二散热元件和第一导热元件。 位置调整单元具有弹性元件。 第一散热元件与位置调节单元连接。 第二散热元件与热源接触。 第一导热元件的一端与第一散热元件接触,第一导热元件的另一端与第二散热元件接触。 位置调整单元通过弹性元件调节第一散热元件相对于第二散热元件的位置。

    Heat dissipating module
    25.
    发明授权
    Heat dissipating module 有权
    散热模块

    公开(公告)号:US07755900B2

    公开(公告)日:2010-07-13

    申请号:US12273496

    申请日:2008-11-18

    申请人: Hsueh-Lung Cheng

    发明人: Hsueh-Lung Cheng

    IPC分类号: H05K7/20 G06F1/20

    CPC分类号: G06F1/20

    摘要: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.

    摘要翻译: 提供了包括第一散热器,第二散热器,连接器,枢轴和热管的散热模块。 第一散热器设置在电路板上并接触热源。 第二散热器具有第一枢转孔和限制开口。 连接器具有第一连接部分和第二连接部分。 第一连接部固定地连接到第一散热器。 第二连接部具有与第一枢转孔对应的限制突起和第二枢转孔。 枢轴穿过第一枢转孔和第二枢转孔,并且枢转地连接到连接器和第二散热器。 限制突起突出到限制开口中以限制第二散热器相对于连接器的旋转角度。

    LED HEAT DISSPATION MODULE
    26.
    发明申请
    LED HEAT DISSPATION MODULE 审中-公开
    LED散热模块

    公开(公告)号:US20090116240A1

    公开(公告)日:2009-05-07

    申请号:US12260093

    申请日:2008-10-29

    申请人: Ching Ho

    发明人: Ching Ho

    IPC分类号: F21V29/00

    摘要: An LED heat dissipation module including a heat pipe, an LED and a heat sink is provided. The heat pipe has at least a flat portion having a surface. The LED is provided at the surface of the flat portion of the heat pipe. The heat sink is coupled to the heat pipe. The heat dissipation efficiency of the LED heat dissipation module is increased.

    摘要翻译: 提供了包括热管,LED和散热器的LED散热模块。 热管具有至少一个具有表面的平坦部分。 LED设置在热管的平坦部分的表面。 散热器与热管相连。 LED散热模块的散热效率提高。

    DISPLAY DEVICE
    27.
    发明申请
    DISPLAY DEVICE 审中-公开
    显示设备

    公开(公告)号:US20090009974A1

    公开(公告)日:2009-01-08

    申请号:US12164830

    申请日:2008-06-30

    IPC分类号: H05K7/20

    CPC分类号: G02F1/133382

    摘要: A display device includes a display panel, a back light module, a heat dissipation plate and a heat pipe. The display panel has a display surface. The back light module is coupled to the display panel, and this back light module includes a control circuit board. The heat dissipation plate contacts the control circuit board. The heat pipe contacts the heat dissipation plate. The length direction of the heat pipe is not parallel with a horizontal direction, and it is also not perpendicular to the display surface.

    摘要翻译: 显示装置包括显示面板,背光模块,散热板和热管。 显示面板具有显示面。 背光模块耦合到显示面板,该背光模块包括控制电路板。 散热板接触控制电路板。 热管接触散热板。 热管的长度方向与水平方向不平行,也不垂直显示面。

    LIGHT EMITTING DIODE LIGHT SOURCE DEVICE
    28.
    发明申请
    LIGHT EMITTING DIODE LIGHT SOURCE DEVICE 审中-公开
    发光二极管光源装置

    公开(公告)号:US20080315219A1

    公开(公告)日:2008-12-25

    申请号:US12142807

    申请日:2008-06-20

    申请人: Ching Ho

    发明人: Ching Ho

    IPC分类号: H01L33/00

    摘要: A light emitting diode (LED) light source device includes a plurality of LED modules, a base and a clip. The base has a first base body, a second base body, and a third base body. The second base body and the third base body extend from two sides of the first base body and are corresponding to each other. The LED modules are provided at inside surfaces of the first base body, the second base body and the third base body. The clip holds the LED modules and fastens the second base body and the third base body to enable the LED modules to be tightly assembled at the base.

    摘要翻译: 发光二极管(LED)光源装置包括多个LED模块,基座和夹子。 底座具有第一基体,第二基体和第三基体。 第二基体和第三基体从第一基体的两侧延伸并彼此对应。 LED模块设置在第一基体,第二基体和第三基体的内表面。 夹持器保持LED模块并固定第二基体和第三基体,以使得LED模块能够紧密地组装在基座上。

    THERMALLY ENHANCED BATTERY MODULE
    29.
    发明申请
    THERMALLY ENHANCED BATTERY MODULE 审中-公开
    热增压电池模块

    公开(公告)号:US20080259569A1

    公开(公告)日:2008-10-23

    申请号:US12105286

    申请日:2008-04-18

    申请人: Chia-Te Lin

    发明人: Chia-Te Lin

    IPC分类号: H05K7/20

    摘要: A thermally enhanced battery module including a casing, at least a cell and a heat dissipation fin is provided. The casing has at least an opening, and the cell and the heat dissipation fin are both disposed in the casing. The cell has a contact surface, and the heat dissipation fin has an inner surface and an outer surface. Part of the inner surface contacts the contact surface of the cell. The outer surface has a plurality of notches and contacts the casing. At least one notch is exposed through the opening. The heat generated by the cell is capable of being dissipated by the heat dissipation fin and the opening in the invention to avoid overheating or decreasing the charging or discharging efficiency.

    摘要翻译: 提供一种热增强型电池模块,其包括壳体,至少一个电池和散热片。 壳体至少具有开口,并且电池和散热片均设置在壳体中。 电池具有接触表面,散热片具有内表面和外表面。 内表面的一部分接触电池的接触表面。 外表面具有多个凹口并接触壳体。 至少有一个凹口暴露在开口处。 电池产生的热能够通过本发明的散热片和开口消散,以避免过热或降低充电或放电效率。

    Active noise elimination electronic system
    30.
    发明申请
    Active noise elimination electronic system 审中-公开
    主动消除噪声电子系统

    公开(公告)号:US20080192949A1

    公开(公告)日:2008-08-14

    申请号:US12068266

    申请日:2008-02-05

    申请人: Kun Yu Lin

    发明人: Kun Yu Lin

    IPC分类号: G10K11/16

    CPC分类号: G10K11/178 G10K2210/104

    摘要: An active noise elimination electronic system is disclosed. The electronic system includes a housing, a first electronic device, a noise receiver, an error sensor, a sound actuator, and a microprocessor. The first electronic device is arranged in the housing. The noise receiver is arranged in the housing and is close to the first electronic device for collecting first noise generated by the first electronic device. The error sensor is arranged in the housing for collecting a feedback noise which is different from the first noise. The microprocessor is coupled to the noise receiver, the error sensor and the sound actuator, and controls the sound actuator to produce a second noise which phase is inverse the first noise according to the first noise and the feedback noise.

    摘要翻译: 公开了一种有源噪声消除电子系统。 电子系统包括壳体,第一电子设备,噪声接收器,误差传感器,声音致动器和微处理器。 第一电子装置布置在壳体中。 噪声接收器布置在壳体中并且靠近第一电子设备,用于收集由第一电子设备产生的第一噪声。 误差传感器布置在外壳中,用于收集与第一噪声不同的反馈噪声。 微处理器耦合到噪声接收器,误差传感器和声音致动器,并且控制声音致动器以产生根据第一噪声和反馈噪声相位相反第一噪声的第二噪声。