公开(公告)号：US20130293277A1

公开(公告)日：2013-11-07

申请号：US13932812

申请日：2013-07-01

Applicant: STMicroelectronics (Tours) SAS

Inventor： Martial Boulin

IPC: H03K19/0175

CPC classification number: H03K19/017509 ,  H03K17/96

Abstract: A circuit for converting the state of a sensor into a signal interpretable by an electronic circuit, including: a comparator of the voltage level of an input terminal with respect to a reference level, the sensor being intended to be connected between a terminal of application of a first power supply voltage and the input terminal; a current-limiting element between said input terminal and the ground; and a switching element in series with the current source and intended to be controlled by a pulse train.

Abstract translation: 一种用于将传感器的状态转换为由电子电路解释的信号的电路，包括：输入端子相对于参考电平的电压电平的比较器，所述传感器旨在连接在应用的端子之间 第一电源电压和输入端; 所述输入端和地之间的限流元件; 以及与电流源串联并且由脉冲串控制的开关元件。

公开(公告)号：US20130192435A1

公开(公告)日：2013-08-01

申请号：US13754660

申请日：2013-01-30

Applicant: STMicroelectronics (Tours) SAS

Inventor： Vincent Jarry ,  Philippe Prunet ,  Thierry Feuillette

IPC: H01L21/463 ,  B28D5/04

CPC classification number: H01L21/463 ,  B28D5/042 ,  H01L21/67092 ,  Y10T83/0429 ,  Y10T83/343

Abstract: A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system.

Abstract translation: 一种用于切割在其上表面上设置有凹槽的晶片的装置，其具有由固定到框架的柔性膜支撑的下表面。 该装置包括用于定位凹槽并相对于切割系统定位框架的系统，以及用于将晶片定位在定位系统前面的定位装置，使得定位区域距离定位系统确定的距离。

公开(公告)号：US20130135970A1

公开(公告)日：2013-05-30

申请号：US13675847

申请日：2012-11-13

Applicant: STMicroelectronics (Tours) SAS ,  Universite Francois Rabelais

Inventor： Sophie Ngo ,  Arnaud Florence ,  Daniel Alquier ,  Edgard Jeanne

IPC: H04B11/00

CPC classification number: H04B11/00

Abstract: A data transmission device includes a coder configured to code the data into a multifrequency signal. A first array of ultrasonic transducers with a vibrating membrane is disposed on a first surface of a wafer. The first array configured to convert the signal into a multifrequency acoustic signal propagating in the wafer. A second array of ultrasonic transducers is disposed on a second surface of the wafer. The second array includes at least two assemblies of vibrating membrane ultrasonic transducers having resonance frequencies equal to two different frequencies of the multifrequency signal.

Abstract translation: 数据传输设备包括被配置为将数据编码为多频信号的编码器。 具有振动膜的第一阵列超声换能器设置在晶片的第一表面上。 第一阵列被配置为将信号转换成在晶片中传播的多频声信号。 超声波换能器的第二阵列设置在晶片的第二表面上。 第二阵列包括具有等于多频信号的两个不同频率的谐振频率的振动膜超声换能器的至少两个组件。