公开(公告)号：US20130192435A1

公开(公告)日：2013-08-01

申请号：US13754660

申请日：2013-01-30

Applicant: STMicroelectronics (Tours) SAS

Inventor： Vincent Jarry ,  Philippe Prunet ,  Thierry Feuillette

IPC: H01L21/463 ,  B28D5/04

CPC classification number: H01L21/463 ,  B28D5/042 ,  H01L21/67092 ,  Y10T83/0429 ,  Y10T83/343

Abstract: A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system.

Abstract translation: 一种用于切割在其上表面上设置有凹槽的晶片的装置，其具有由固定到框架的柔性膜支撑的下表面。 该装置包括用于定位凹槽并相对于切割系统定位框架的系统，以及用于将晶片定位在定位系统前面的定位装置，使得定位区域距离定位系统确定的距离。