公开(公告)号：US3993411A

公开(公告)日：1976-11-23

申请号：US549440

申请日：1975-02-12

申请人： Guy L. Babcock ,  Walter M. Bryant ,  Constantine A. Neugebauer ,  James F. Burgess

发明人： Guy L. Babcock ,  Walter M. Bryant ,  Constantine A. Neugebauer ,  James F. Burgess

IPC分类号： C04B37/02 ,  H05K1/03 ,  H05K3/38

CPC分类号： C04B37/02 ,  C04B37/021 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6584 ,  C04B2235/6586 ,  C04B2237/06 ,  C04B2237/08 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/40 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/54 ,  C04B2237/60 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/74 ,  H05K1/0306 ,  H05K3/38 ,  Y10S228/903 ,  Y10T403/478 ,  Y10T403/74

摘要： A direct bond between metallic members and non-metallic members is achieved at elevated temperatures in a controlled reactive atmosphere without resorting to the use of electroless plating, vacuum deposition or intermediate metals. A metal member such as copper, for example, is placed in contact with a non-metallic substrate, such as alumina, the metal member and the substrate are heated to a temperature slightly below the melting of the metal, e.g., between approximately 1065.degree. and 1080.degree. C. for copper, with the heating being performed in a reactive atmosphere, such as an oxidizing atmosphere, for a sufficient time to create a copper-copper oxide eutectic melt which, upon cooling, bonds the copper to the substrate. Various metals, non-metals and reactive gases are described for direct bonding.

摘要翻译： 金属构件和非金属构件之间的直接结合在受控的反应气氛中在升高的温度下实现，而不需要使用无电镀，真空沉积或中间金属。 诸如铜的金属构件例如被放置成与诸如氧化铝的非金属基底接触，金属构件和基底被加热到略低于金属熔化的温度，例如约1065度 对于铜，在反应性气氛如氧化气氛中进行加热足够的时间以产生铜 - 铜 - 氧化物共晶熔体，其在冷却时将铜结合到基底上。 描述了用于直接粘合的各种金属，非金属和反应性气体。