公开(公告)号：US11964918B2

公开(公告)日：2024-04-23

申请号：US17142315

申请日：2021-01-06

Applicant: UT-Battelle, LLC

Inventor： Christian M. Petrie ,  Brian C. Jolly ,  Kurt A. Terrani ,  Michael P. Trammell

IPC: C04B35/63 ,  C04B35/565 ,  C04B37/02 ,  C04B37/04 ,  G01D11/24

CPC classification number: C04B37/021 ,  C04B35/565 ,  C04B35/63 ,  C04B37/042 ,  G01D11/245 ,  C04B2235/3826 ,  C04B2235/6026 ,  C04B2237/365 ,  C04B2237/403 ,  C04B2237/408 ,  C04B2237/62

Abstract: An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000° C.

公开(公告)号：US11929193B2

公开(公告)日：2024-03-12

申请号：US17054806

申请日：2019-06-25

Applicant: TDK Electronics AG

Inventor： Michael Naderer

IPC: H01C7/04 ,  C04B35/01 ,  C04B35/64 ,  C04B37/02 ,  C04B41/00 ,  C04B41/48 ,  C04B41/50 ,  C04B41/83 ,  C04B41/86 ,  H01C17/065 ,  H01C17/28

CPC classification number: H01C7/043 ,  C04B35/016 ,  C04B35/64 ,  C04B37/021 ,  C04B41/009 ,  C04B41/48 ,  C04B41/5022 ,  C04B41/83 ,  C04B41/86 ,  H01C17/06533 ,  H01C17/281 ,  C04B2235/3217 ,  C04B2235/3244 ,  C04B2235/3268 ,  C04B2235/3281 ,  C04B2237/34 ,  C04B2237/408

Abstract: An NTC compound, a thermistor and a method for producing a thermistor are disclosed. In an embodiment an NTC compound includes a ceramic material of a Mn—Ni—O system as a main constituent, wherein the Mn—Ni—O system has a general composition NixMn2O4-δ, wherein y corresponds to a molar fraction of Ni of a total metal content of the ceramic material of the Mn—Ni—O system, which is defined as c(Ni):(c(Ni)+c(Mn)), and wherein the following applies: 0.500

公开(公告)号：US20160369813A1

公开(公告)日：2016-12-22

申请号：US14900509

申请日：2014-06-20

Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG

Inventor： Stefan SCHIBLI ,  Ulrich HAUSCH

IPC: F04D29/52 ,  F04D3/00 ,  F04D29/18 ,  B22F1/00 ,  B22F3/00 ,  A61M1/10 ,  B22F7/00 ,  B22F7/06 ,  C22C32/00 ,  B28B1/24 ,  C04B37/02 ,  A61M1/12 ,  F04D29/02 ,  B22F3/16

CPC classification number: F04D29/528 ,  A61M1/101 ,  A61M1/1012 ,  A61M1/1015 ,  A61M1/1031 ,  A61M1/122 ,  B22F1/0059 ,  B22F3/004 ,  B22F3/16 ,  B22F5/10 ,  B22F7/008 ,  B22F7/06 ,  B22F2301/25 ,  B22F2302/253 ,  B22F2304/10 ,  B22F2998/10 ,  B28B1/24 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/408 ,  C22C29/00 ,  C22C32/00 ,  C22C32/0021 ,  F04D3/00 ,  F04D13/0606 ,  F04D29/026 ,  F04D29/181 ,  F05B2240/142 ,  F05B2240/30 ,  F05B2280/10304 ,  F05B2280/2004 ,  F05D2300/10 ,  F05D2300/17 ,  F05D2300/20

Abstract: One aspect of the invention relates to a pump device, comprising i. an impeller; ii. a pump housing which at least partly surrounds an interior region, having an inlet and an outlet, wherein the impeller is located within the interior region of the pump housing; wherein the pump housing comprises at least one first subregion and at least one further subregion; wherein the first subregion comprises a ceramic, wherein the further subregion comprises a metal, wherein at least one part of the first subregion and at least one part of the further subregion are connected to one another. One aspect of the invention further relates to a housing which comprises the features described for the pump housing.One aspect of the invention also relates to a method for producing a pump housing.

Abstract translation: 本发明的一个方面还涉及一种用于制造泵壳体的方法。

公开(公告)号：US09096471B2

公开(公告)日：2015-08-04

申请号：US13511261

申请日：2010-11-26

Applicant: Daisuke Suzuki ,  Shigeru Oyama ,  Atsushi Otaki

Inventor： Daisuke Suzuki ,  Shigeru Oyama ,  Atsushi Otaki

IPC: C04B37/02 ,  B23K11/16 ,  H01L23/373

CPC classification number: C04B37/021 ,  C04B2235/666 ,  C04B2235/963 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/52 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12535 ,  H01L2924/00

Abstract: A layered material 1 includes two metal sheets 2,3 and one ceramic sheet 4, wherein the metal sheets 2,3 and the ceramic sheet 4 are stacked so that the ceramic sheet 4 is disposed between the two metal sheets 2,3, and then bonded together through spark plasma sintering. The difference in melting temperature between the metal sheets 2 and 3 is 140° C. or less. The layered material 1 is produced by stacking two metallic sheets 2,3 that have a difference in melting temperature of 140° C. or less and the ceramic sheet 4 so that the ceramic sheet 4 is placed between the both metal sheets 2,3, then disposing the stacked structure of the metal sheet 2,3 and the ceramic sheet 4 between a pair of electrodes in a spark plasma sintering device, and bonding the metal sheets 2,3 and the ceramic sheet 4 by applying a pulse current between the electrodes while maintaining the conduction between the electrodes.

Abstract translation: 层叠材料1包括两个金属片2,3和一个陶瓷片4，其中金属片2,3和陶瓷片4被堆叠，使得陶瓷片4设置在两个金属片2,3之间，然后 通过放电等离子体烧结结合在一起。 金属片2和3之间的熔融温度差为140℃以下。 层叠材料1通过层叠熔融温度为140℃以下的两个金属片2,3和陶瓷片4而制成，使得陶瓷片4位于两个金属片2,3之间， 然后将金属片2,3和陶瓷片4的堆叠结构设置在放电等离子体烧结装置中的一对电极之间，并通过在电极之间施加脉冲电流来接合金属片2,3和陶瓷片4 同时保持电极之间的导通。

公开(公告)号：US20150008573A1

公开(公告)日：2015-01-08

申请号：US14374396

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Yuichi Sawai ,  Takashi Naito ,  Takuya Aoyagi ,  Tadashi Fujieda ,  Mutsuhiro Mori

IPC: H01L23/373 ,  H01L33/64 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L23/3736 ,  B23K35/26 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/408 ,  C22C5/06 ,  C22C13/00 ,  H01L21/52 ,  H01L23/3731 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1432 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/12014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: Bondability and heat conductivity of a bonded body in which some of metal, ceramic, or semiconductor are bonded to each other are improved. In the bonded body in which a first member and a second member each comprise one of metal, ceramic, or semiconductor are bonded to each other, the second member is bonded to the first member by way of an adhesive member disposed to the surface of the first member, and the adhesive member contains a V2O5-containing glass and metal particles. In a semiconductor module having a base metal, a ceramic substrate, a metal wiring, and a semiconductor chip, the ceramic substrate is bonded to the base metal by way of a first adhesive member disposed to the surface of the base metal, the metal wiring is bonded to the ceramic substrate by way of a second adhesive member disposed to the surface of the ceramic substrate, the semiconductor chip is bonded to the metal wiring by way of a third adhesive member disposed to the surface of the metal wiring, and the first adhesive member, the second adhesive member, and the third adhesive member each comprise a V2O5-containing glass and metal particles.

Abstract translation: 其中一些金属，陶瓷或半导体彼此结合的接合体的结合性和导热性得到改善。 在其中每个包括金属，陶瓷或半导体中的一个的第一构件和第二构件彼此结合的接合体中，第二构件通过设置在第二构件的表面上的粘合构件接合到第一构件 第一构件，并且粘合构件含有含V2O5的玻璃和金属颗粒。 在具有基底金属，陶瓷基板，金属布线和半导体芯片的半导体模块中，陶瓷基板通过设置在基板金属的表面上的第一粘合部件接合到基底金属，金属布线 通过设置在陶瓷基板的表面上的第二粘合部件与陶瓷基板接合，半导体芯片通过设置在金属布线表面的第三粘合部件与金属布线接合，第一 粘合剂构件，第二粘合构件和第三粘合构件各自包含含V 2 O 5的玻璃和金属颗粒。

公开(公告)号：US08899470B2

公开(公告)日：2014-12-02

申请号：US12080213

申请日：2008-04-01

Applicant: David M. Lineman ,  Wenchao Wang ,  Randy D. Ziegenhagen

Inventor： David M. Lineman ,  Wenchao Wang ,  Randy D. Ziegenhagen

IPC: B23K31/02 ,  B23K20/00 ,  C04B37/02 ,  C03B7/04

CPC classification number: C04B37/026 ,  C03B5/43 ,  C03B7/02 ,  C03B7/04 ,  C04B37/025 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2237/068 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/408 ,  C04B2237/52 ,  C04B2237/61 ,  C04B2237/62 ,  Y10S228/903 ,  Y10T156/10 ,  Y10T428/24339 ,  Y10T428/249953 ,  Y10T428/252

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract translation: 公开了一种用于将金属组分机械地结合到陶瓷材料的方法，包括提供金属组分，所述金属组分包含连接到所述金属组分的一个表面的至少第一部分的锚固材料; 提供具有第一表面和第二表面的陶瓷材料，其中所述陶瓷材料限定从所述第一表面延伸到所述第二表面的至少一个导管，其中所述至少一个导管具有由所述第一表面限定的第一开口端， 由第二表面限定的第二开口端，连续侧壁和横截面积; 定位陶瓷材料，使得至少一个导管的至少一部分与锚定材料的至少一部分重叠对齐; 以及将粘合剂施加到所述至少一个导管的至少一部分中。

公开(公告)号：US20140331718A1

公开(公告)日：2014-11-13

申请号：US14444482

申请日：2014-07-28

Applicant: CORNING INCORPORATED

Inventor： David Myron Lineman ,  Wenchao Wang ,  Randy Dean Ziegenhagen

IPC: C03B7/02 ,  C04B37/02

CPC classification number: C04B37/026 ,  C03B5/43 ,  C03B7/02 ,  C03B7/04 ,  C04B37/025 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2237/068 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/408 ,  C04B2237/52 ,  C04B2237/61 ,  C04B2237/62 ,  Y10S228/903 ,  Y10T156/10 ,  Y10T428/24339 ,  Y10T428/249953 ,  Y10T428/252

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract translation: 公开了一种用于将金属组分机械地结合到陶瓷材料的方法，包括提供金属组分，所述金属组分包含连接到所述金属组分的一个表面的至少第一部分的锚固材料; 提供具有第一表面和第二表面的陶瓷材料，其中所述陶瓷材料限定从所述第一表面延伸到所述第二表面的至少一个导管，其中所述至少一个导管具有由所述第一表面限定的第一开口端， 由第二表面限定的第二开口端，连续侧壁和横截面积; 定位陶瓷材料，使得至少一个导管的至少一部分与锚定材料的至少一部分重叠对齐; 以及将粘合剂施加到所述至少一个导管的至少一部分中。

公开(公告)号：US08607440B2

公开(公告)日：2013-12-17

申请号：US13120804

申请日：2009-07-27

Applicant: Toshiaki Fujita ,  Kazutaka Fujiwara ,  Takashi Yamaguchi

Inventor： Toshiaki Fujita ,  Kazutaka Fujiwara ,  Takashi Yamaguchi

IPC: H01K7/02 ,  H01K7/04

CPC classification number: H01C7/008 ,  C04B35/42 ,  C04B35/62685 ,  C04B37/021 ,  C04B2235/3208 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3267 ,  C04B2235/6021 ,  C04B2235/9623 ,  C04B2237/345 ,  C04B2237/408 ,  C04B2237/62 ,  C04B2237/84 ,  H01C7/04

Abstract: Disclosed is a manufacturing method for a thermistor element having a step wherein a thermistor raw material powder formed from a metal oxide, an organic binder powder, and a solvent are mixed and kneaded to form a clay, a step wherein the clay is extrusion-molded by means of a molding die to form a rod-shaped, green molded body having multiple through-holes, a step wherein the rod-shaped green molded body is dried to form a rod-shaped dried molded body, a step wherein the rod-shaped dried formed body is cut to a prescribed length to form a cut molded body having through-holes, and a step wherein lead wires are introduced into the through-holes of the cut molded body and firing is then performed to form a metal oxide sintered body for thermistor use from the cut molded body.

Abstract translation: 公开了一种具有以下步骤的热敏电阻元件的制造方法：其中将由金属氧化物，有机粘合剂粉末和溶剂形成的热敏电阻原料粉末混合并捏合以形成粘土，其中将粘土挤出成型 通过成型模具形成具有多个通孔的棒状的绿色成形体，将棒状的生坯成型体干燥形成棒状的干燥成形体的工序， 将成形干燥的成形体切割成规定长度以形成具有通孔的切割成型体，以及将导线引入切割成型体的通孔并进行烧成以形成金属氧化物烧结体的步骤 用于从切割成型体使用热敏电阻的主体。

公开(公告)号：US08254422B2

公开(公告)日：2012-08-28

申请号：US12536361

申请日：2009-08-05

Applicant: Madhav Datta ,  Brandon Leong ,  Mark McMaster

Inventor： Madhav Datta ,  Brandon Leong ,  Mark McMaster

IPC: H01S3/04

CPC classification number: F28F7/02 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/40 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/74 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/38 ,  H05K3/4629 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/064 ,  Y10T428/24612 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.

Abstract translation: 微型交换组件被配置为冷却一个或多个发热装置，例如集成电路或激光二极管。 微型交换组件包括热耦合到第一表面的第一陶瓷组件，以及在与第二表面热耦合的第二陶瓷组件的情况下。 陶瓷组件包括一个或多个热导热焊盘，其被热耦合到发热器件，每个导电焊盘彼此电隔离。 陶瓷组件包括提供该电隔离的陶瓷层。 使用中间接合材料，陶瓷层的顶表面和底表面各自与导电层（例如铜）接合。 执行钎焊工艺以通过接合层将陶瓷层粘合到导电层。 接合层是接合材料，陶瓷层和导电层的复合物。

公开(公告)号：US20110048770A1

公开(公告)日：2011-03-03

申请号：US12693772

申请日：2010-01-26

Applicant: Markus Reiterer ,  Brad C. Tischendorf ,  Andrew Thom

Inventor： Markus Reiterer ,  Brad C. Tischendorf ,  Andrew Thom

IPC: H01B17/30 ,  B22F7/04

CPC classification number: H01B19/00 ,  A61N1/3754 ,  B22F3/225 ,  B22F5/10 ,  B22F7/062 ,  B22F7/08 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/408 ,  C04B2237/62 ,  C22C14/00 ,  C22C19/007 ,  C22C19/03

Abstract: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.

Abstract translation: 提供馈通组件和制造馈通组件的方法。 方法包括使用金属注射成型模制包含钛的套圈，并且将套圈围绕绝缘体的至少一部分定位，所述绝缘体包括氧化铝。 方法还包括使用金属注射成型将套圈围绕绝缘体的至少一部分进行包覆模制，所述套圈包括钛，绝缘体包括氧化铝。 烧结使套圈密实，并在套圈和绝缘体之间提供密封。 绝缘体可以在烧结之前被烧制或未烧结。