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公开(公告)号：US5606888A
公开(公告)日：1997-03-04
申请号：US502647
申请日：1995-07-14
Applicant: Dimitry Grabbe
Inventor： Dimitry Grabbe
CPC classification number: B21D28/002 , B21D19/08 , B21D22/04
Abstract: A method of forming relatively hard materials is disclosed. The method includes providing tooling for performing the forming operation on a strip (10) of relatively hard material. The tooling includes a forming tool (22) and a mating die (24) coupled to a high speed stamping and forming machine (70). The tooling and machine are arranged so that the forming operation is performed within a time period that is less than the stress relaxation time constant for the material being formed.
Abstract translation: 公开了形成相对硬的材料的方法。 该方法包括提供用于在相对硬的材料的条带（10）上进行成形操作的模具。 工具包括成形工具（22）和与高速冲压成型机（70）相连的配合模具（24）。 工具和机器被布置成使得成形操作在小于所形成材料的应力松弛时间常数的时间段内进行。
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公开(公告)号：US5380210A
公开(公告)日：1995-01-10
申请号：US218863
申请日：1994-03-28
Applicant: Dimitry Grabbe , Iosif Korsunsky , Michael F. Laub
Inventor： Dimitry Grabbe , Iosif Korsunsky , Michael F. Laub
CPC classification number: H01R13/2435 , H01R12/52 , H01R12/714
Abstract: A connector for electrically connecting circuit members having a high density of contact pads located in an area array, the connector having an area array specific holder that is simple to produce for retainably positioning mass-produced standardized contact modules containing a deformable contact within a module body for interconnecting the contact pads, where the contact is constructed to be supportingly engaged by the module body to provide sufficient opposing spring force to effect a wiping interconnection between the contact and the contact pads.
Abstract translation: 一种用于电连接具有位于区域阵列中的高密度接触焊盘的电路构件的连接器，所述连接器具有易于制造的面积阵列特定的保持器，用于保持定位批量生产的标准化接触模块，其包含模块体内的可变形接触 用于互连接触垫，其中接触构造成由模块主体支撑地接合以提供足够的相对的弹簧力，以实现接触件和接触垫之间的擦拭互连。
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公开(公告)号：US4687278A
公开(公告)日：1987-08-18
申请号：US891709
申请日：1986-07-31
Applicant: Dimitry Grabbe , Iosif Korsunsky
Inventor： Dimitry Grabbe , Iosif Korsunsky
IPC: H01R13/11 , H01R13/115 , H01R13/193
CPC classification number: H01R13/114 , H01R13/111 , H01R13/113 , H01R13/193
Abstract: A contact socket having ends and an intermediate portion for receiving a contact pin. The intermediate portion has a plurality of resilient beams which are designed to provide the necessary contact force while maintaining the insertion force at a low level. The beams are also designed to allow for improper insertion of the pin into the contact socket without damaging the resilient beams so that no permanent set of the beams takes place.
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34.发明授权
公开(公告)号：US4630875A
公开(公告)日：1986-12-23
申请号：US814511
申请日：1985-12-18
Applicant: Iosif Korsunsky , Dimitry Grabbe
Inventor： Iosif Korsunsky , Dimitry Grabbe
IPC: H05K7/10 , H01R9/09 , H01R13/62 , H01R13/635
CPC classification number: H05K7/1007
Abstract: Chip carrier socket 2 comprises a socket body 24 having a rectangular base 30 and walls 34 extending normally from the edges 32 of the base. The walls can be pivotally moved inwardly of the recess which is defined by the walls after a chip carrier 12 has been placed in the recess. A frame 28 is provided in surrounding relationship to the walls 34 and is movable relative thereto between a first position and a second position. When the frame 28 is moved to the second position, the walls 34 are moved inwardly thereby to move the contact terminals 26 in the walls against terminal pads 20 on the leadless chip carrier 12. The frame 28 also may have an ejector means integral therewith which will eject the chip carrier from the socket when the frame is moved from a second position to the first position. The frame may also cam the walls outwardly to permit placement of the chip carrier in the recess under ZIF conditions.
Abstract translation: 芯片承载座2包括具有矩形底座30的插座主体24和从基座的边缘32正常延伸的壁34。 在芯片托架12已经放置在凹槽中之后，壁可以由凹槽限定的凹槽向内枢转运动。 框架28围绕壁34提供，并且可在第一位置和第二位置之间相对于框架28移动。 当框架28移动到第二位置时，壁34向内移动，从而将壁中的接触端子26移动到无引线芯片载体12上的端子垫20上。框架28还可以具有与其成一体的顶出装置 当框架从第二位置移动到第一位置时，将从插座中弹出芯片载体。 框架还可以向外凸出壁，以允许芯片载体在ZIF条件下放置在凹部中。
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