Abstract:
A smart card reader 10 is disclosed having a base 12 which is profiled to have a card receiving area 20. Contacts 22,23 are disposed inside a contact receiving 32 of the base and are pivotable about a leg 40. Insertion of a smart card 60 causes the contacts 22,23 to pivot about the pivot point 42 in order to cause contact points 50 to engage contact pads of the smart card 60.
Abstract:
A connector (10) for interconnecting circuitry (12, 16) of two circuit boards (14, 18) which carry relatively high frequency signals, includes a receptacle connector (20) and a mating plug connector (24). The receptacle connector (20) includes shield plates (56) between each adjacent pair of signal contacts (58) and the mating plug connector (24) includes a central elongated ground plate (136) that electrically engages each of the shield plates (56). The ground plate (136) includes a plurality of leads (142) along its length that engage ground pads on the circuit board (18). The plug connector (24) includes an outer shield (146) that substantially surrounds the plug connector (24) and includes leads (148) that are attached to the leads (142) of the elongated ground plate (136).
Abstract:
A connector, method and alignment device for connecting single-mode optical fibers are provided. The connector is characterized by a deformable, elongated base for supporting two coaxial fibers and a meltable slug which secures the fibers to the base in a nondamageable manner upon melting and resolidification. The method addresses employing the connector to affix the fibers. The device, employed in combination with the connector, includes two translatable clamps to distort the connector base thereby aligning the fibers optical cores in a substantially coaxial relationship.
Abstract:
A multicontact electrical connector comprises an insulating housing having a substrate-receiving face. A trough-like opening extends into the face for reception of a substrate. In the housing are spaced-apart terminals having free ends which are proximate to the substrate-receiving face and fixed ends which are proximate to an inner end of the opening. Contact surfaces are on the free ends for contacting spaced-apart terminal pads on the substrate. Contact engagement camming means are provided for flexing the terminals and moving the free ends from the opening allowing the substrate to be placed in the opening under reduced insertion force conditions. As the free ends of the terminals are subsequently moved, the contact surfaces of the free ends will be resiliently biased against the terminal pads. Contact wipe camming means are provided to move the contact surfaces across the terminal pads as normal force occurs permitting a wiping action to take place. A locking means is provided to hold the substrate in place as the wiping action occurs. This assures that the contact surfaces and the terminal pads, where engagement therebetween takes place, are cleaned and a positive electrical connection is effected.
Abstract:
A device for producing a hermetically sealed chip carrier is taught. Briefly stated, a sealing or perimeter ring is formed on a substrate with an appropriate lead pattern and IC chip contained within this ring. Vias or ducts are disposed in the substrate with metal lead pedestals contained therein which provide electrical connection through the substrate and therefore between the lead pattern contained inside the sealing ring and the lead patterns on the outside of the sealing ring. This therefore allows for a continuous sealing ring such that a cap may be placed on top of the sealing ring and bonded by methods such as welding so as to form a hermetically sealed enclosure.
Abstract:
Disclosed is an electrical connector having an insulative housing and conductive connector wherein conductive connector has a distal end which is angled and generally rectangular in shape with the four corners of the rectangular shape of the distal end bent to receive a fusible material. The fusible material will generally be a solder ball. Also disclosed is a product made by the process of bending the rectangular shape of the distal end of the contact so as to receive a solder ball.
Abstract:
An apparatus and method of forming balls includes a metering device 2, a melting device 14 and a cooling device 20. The metering device 14 stamps a desired volume of solid material in the form of a slug 12 which passes through the melting device 14 where it is caused to levitate and transform state from a solid to a molten liquid. The molten liquid material 13 is released from the melting device 14 and descends through the cooling device 20 where it transforms state once again from a molten material to a solid material while maintaining a ball shape. A forming gas is passed over the molten material 13 in a direction opposite to the falling molten material 13. The balls 15 are finally cooled in a cooling bath 32.
Abstract:
An electrical connector 10 is disclosed for connecting two printed circuit boards 50,60. The electrical connector 10 features a insulative housing 12 having a plurality of contacts 18 disposed in contact-receiving slots 32. The contact-receiving slots 32 extend between the mating faces 22,24 and back to a curved end wall 30. A retainer pin 16 is pressed into a retaining slot 14 of the housing to hold the contacts 18 firmly against the curved end wall 30 at a center point 28. Upon mating, the contact will experience a wiping action across the pads 52,62 of each of the circuit boards.
Abstract:
An electrical connector assembly 2 for use in connecting parallel printed circuit boards includes a receptacle connector 4 and a plug connector 6. The receptacle connector 4 includes receptacle contacts 8, each of which includes a surface mount solder tail 16 and a mating contact section in the form of a resilient arm 26 on opposite sides of a sealing pad 18 that seals a contact insertion opening 38 when the receptacle contact 8 is fully inserted. The mating contact portion is therefore isolated from contaminating materials, such as solder flux during surface mount solder operations. The height of the connector assembly 2 can be adjusted by using plug connectors 6 of different heights with a universal receptacle connector 4. The height of the side walls 60 on the plug housing 12, between a plug mating section and contact retention section is changed for different plug connector heights. The length of the plug contact 10 can also changed because the plug contact solder tail 56 is bent into its final position after the plug contacts 10 are mounted on the plug housing 12.
Abstract:
A wire length having a very small diameter is terminated to a contact member by forming a groove in the contact member, disposing the wire length entirely within and along the groove, and striking the surface of the contact on both sides of the groove deforming the sides of the groove downwardly and inwardly into the groove firmly against the wire therein. The contact members can be made in lead frames on a carrier strip and have grooves formed therein, the wire can be placed in the grooves and terminated to the contact members in an automated assembly to make, for example, fuse components where wire segments bridge gaps between associated contact sections of pairs of the contact members, and the lead frames can have housings molded thereto while on the carrier strip.