Abstract:
A heat sink includes a plurality of metal fins interconnected together. Each metal fin includes a main plate, a flange extending forwardly from the main plate and an interlocking unit formed on the flange. The interlocking unit includes an engaging ear and a hook. The ear extends rearwards from a rear edge of the flange and defines a locking hole therein. The flange defines a cutout adjacent to a front edge thereof. The cutout is aligned with the ear and recessed rearwards from the front edge of the flange. The hook extends forwardly from the flange and is located within the cutout. The ear of a fin is engaged in the cutout of an adjacent rear fin. The hook of the adjacent rear fin is engaged in the locking hole of the engaging ear of the fin.
Abstract:
A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.
Abstract:
A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.
Abstract:
A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.
Abstract:
A probe burn resistant interface apparatus and method for testing an electronic device use a probe made of a shape memory alloy which upon overheating of the probe during functionality testing of an electronic device contracts the probe to disengage the probe from a contact electrically connected to the electronic device and stop current flow through the probe. Upon cooling of the probe, engagement of the probe with the contact is reestablished. The probe in an example embodiment is a wire which has a core made of a shape memory alloy and a layer of a highly elastic metal, for example copper, on an outer surface of the core to aid return of the probe from its contracted state to its initial state upon cooling an overheated probe for reestablishing electrical connection of the probe with the electronic device being tested.