HEAT SINK
    31.
    发明申请
    HEAT SINK 失效
    散热器

    公开(公告)号:US20100132919A1

    公开(公告)日:2010-06-03

    申请号:US12483266

    申请日:2009-06-12

    CPC classification number: H01L23/3672 H01L2924/0002 H01L2924/00

    Abstract: A heat sink includes a plurality of metal fins interconnected together. Each metal fin includes a main plate, a flange extending forwardly from the main plate and an interlocking unit formed on the flange. The interlocking unit includes an engaging ear and a hook. The ear extends rearwards from a rear edge of the flange and defines a locking hole therein. The flange defines a cutout adjacent to a front edge thereof. The cutout is aligned with the ear and recessed rearwards from the front edge of the flange. The hook extends forwardly from the flange and is located within the cutout. The ear of a fin is engaged in the cutout of an adjacent rear fin. The hook of the adjacent rear fin is engaged in the locking hole of the engaging ear of the fin.

    Abstract translation: 散热器包括互连在一起的多个金属翅片。 每个金属翅片包括主板,从主板向前延伸的凸缘和形成在凸缘上的互锁单元。 互锁单元包括接合耳朵和钩子。 耳从法兰的后边缘向后延伸并且在其中限定锁定孔。 凸缘限定与其前边缘相邻的切口。 切口与耳朵对准,并从法兰的前边缘向后凹。 钩从法兰向前延伸并位于切口内。 翅片的耳朵接合在相邻后鳍的切口中。 相邻的后翅片的钩接合在翅片的接合耳朵的锁定孔中。

    Mounting device for mounting heat sink onto electronic component
    32.
    发明授权
    Mounting device for mounting heat sink onto electronic component 失效
    用于将散热器安装到电子元件上的安装装置

    公开(公告)号:US07639504B2

    公开(公告)日:2009-12-29

    申请号:US12119514

    申请日:2008-05-13

    CPC classification number: H01L23/4093 H01L2924/0002 H01L2924/00

    Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

    Abstract translation: 一种用于将散热器(20)安装到其上设置有发热电子部件(30)的印刷电路板(40)的安装装置(10),包括安装框架(100),两个紧固支腿(104)和 四个弹性臂(105)。 安装框架包括设置在第一安装臂上方的两个第一安装臂(101)和两个第二安装臂(102)。 第一安装臂邻接在电路板上。 夹紧腿与第二安装臂连接并插入印刷电路板以附接到印刷电路板。 弹性臂与第二安装臂连接,并向发热电子部件向散热片施加向下的弹性力。

    HEAT DISSIPATION DEVICE
    33.
    发明申请
    HEAT DISSIPATION DEVICE 失效
    散热装置

    公开(公告)号:US20090310306A1

    公开(公告)日:2009-12-17

    申请号:US12409499

    申请日:2009-03-24

    CPC classification number: H01L23/467 F28F3/02 H01L2924/0002 H01L2924/00

    Abstract: A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.

    Abstract translation: 散热装置包括散热器和布置在其上的冷却风扇。 冷却风扇包括电机定子和安装在电机定子周围的叶轮。 电动机定子布置在散热器的中间。 散热器包括基部和从基部向上延伸的多个翅片。 散热器限定切割翅片的多个凹口。 凹口在冷却风扇的电动机定子正下方的散热片的中间成角度。

    MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT
    34.
    发明申请
    MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT 失效
    用于将散热器安装在电子部件上的安装装置

    公开(公告)号:US20090244863A1

    公开(公告)日:2009-10-01

    申请号:US12110341

    申请日:2008-04-27

    Abstract: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.

    Abstract translation: 一种用于将散热器(40)安装在其上安装有发热电子部件(50)的印刷电路板(60)上的安装装置(10)。 安装装置包括安装框架(101)和附接到安装框架的两个弹性夹子(102)。 安装框架包括设置在第一安装臂上方的两个第一安装臂(1011)和两个第二安装臂(1012)。 第一安装臂被配置为附接到印刷电路板。 弹性夹被构造成夹在安装框架的第二安装臂和散热器之间。 弹性夹具各自包括两个弹性臂(1023),其构造成用于提供朝向发热电子部件推动散热器的弹性力。

    Method and apparatus for resisting probe burn using shape memory alloy probe during testing of an electronic device
    35.
    发明授权
    Method and apparatus for resisting probe burn using shape memory alloy probe during testing of an electronic device 失效
    在电子设备测试期间使用形状记忆合金探针来抵抗探针烧伤的方法和装置

    公开(公告)号:US06577147B2

    公开(公告)日:2003-06-10

    申请号:US09946622

    申请日:2001-09-06

    Applicant: Jun Ding Jin Pan

    Inventor: Jun Ding Jin Pan

    CPC classification number: G01R31/2886

    Abstract: A probe burn resistant interface apparatus and method for testing an electronic device use a probe made of a shape memory alloy which upon overheating of the probe during functionality testing of an electronic device contracts the probe to disengage the probe from a contact electrically connected to the electronic device and stop current flow through the probe. Upon cooling of the probe, engagement of the probe with the contact is reestablished. The probe in an example embodiment is a wire which has a core made of a shape memory alloy and a layer of a highly elastic metal, for example copper, on an outer surface of the core to aid return of the probe from its contracted state to its initial state upon cooling an overheated probe for reestablishing electrical connection of the probe with the electronic device being tested.

    Abstract translation: 用于测试电子装置的探针耐烧蚀接口装置和方法使用由形状记忆合金制成的探针,其在电子装置的功能测试期间在探针的过热期间使探针收缩,以将探针与电连接到电子装置 装置并停止通过探头的电流。 在探针冷却时,重新建立探头与触点的接合。 示例性实施例中的探针是在芯的外表面上具有由形状记忆合金和高弹性金属(例如铜)形成的芯的线,以帮助探针从其收缩状态返回到 其在冷却过热探头时的初始状态,用于重新建立探头与正在测试的电子设备的电连接。

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