公开(公告)号：US07622308B2

公开(公告)日：2009-11-24

申请号：US12044346

申请日：2008-03-07

Applicant: Lawrence Hendler ,  Kuo-Chin Lin ,  Svante Bjarne Wold

Inventor： Lawrence Hendler ,  Kuo-Chin Lin ,  Svante Bjarne Wold

IPC: H01L21/00

CPC classification number: G05B23/0254 ,  G05B17/02 ,  G05B2219/1112 ,  G05B2219/32187 ,  G05B2219/32201 ,  G05B2219/45031 ,  G05B2223/02 ,  Y02P90/22 ,  Y02P90/86

Abstract: A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps (“Step e”). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (“Step f”). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data.

Abstract translation: 在制造过程（“步骤a”）的最终处理步骤结束时，用于监测制造过程的方法特征在于获得半导体晶片的度量数据。 对于用于制造半导体晶片的第一工艺步骤的多个工艺变量获取数据（“步骤b”）。 基于测量数据和用于第一处理步骤（“步骤c”）的多个处理变量的获取数据，创建第一处理步骤的第一数学模型。 对于用于制造半导体晶片的至少第二工艺步骤重复步骤b和c（“步骤d”）。 基于计量学数据和用于n个处理步骤（“步骤e”）中的每一个的多个处理变量的数据创建第n个数学模型。 基于测量数据和由步骤c，d和e创建的模型（“步骤f”）创建顶级数学模型。 步骤f的顶级数学模型基于对测量数据具有实质性影响的过程变量。

公开(公告)号：US07559801B1

公开(公告)日：2009-07-14

申请号：US12219170

申请日：2008-07-17

Applicant: Kuo-Chin Lin ,  Feng Zhu ,  Xing-Yu Hu

Inventor： Kuo-Chin Lin ,  Feng Zhu ,  Xing-Yu Hu

IPC: H01R13/648

CPC classification number: H01R24/50 ,  H01R13/6594 ,  H01R2103/00

Abstract: An audio jack connector connected with a printed circuit board includes a dielectric housing, a connecting terminal, at least one grounding terminal and a shell. The dielectric housing defines a passageway therethrough. The connecting terminal is received in the passageway of the dielectric housing. The grounding terminal is fixed on the dielectric housing. The grounding terminal has a contact portion exposed outside the dielectric housing and a connecting portion for being connected with the printed circuit board. The shell encloses the dielectric housing and detachably contacts the contact portion of the grounding terminal. As the grounding terminal is separated with the shell, the grounding terminal and the shell can be made independently, which can not only save materials but also reduce the reject rate of the audio jack connector.

Abstract translation: 与印刷电路板连接的音频插孔连接器包括绝缘壳体，连接端子，至少一个接地端子和壳体。 绝缘壳体限定通过其的通道。 连接端子被容纳在电介质外壳的通道中。 接地端子固定在绝缘外壳上。 接地端子具有暴露在介电壳体外部的接触部分和用于与印刷电路板连接的连接部分。 壳体包围绝缘壳体，并可拆卸地接触接地端子的接触部分。 由于接地端子与壳体分离，接地端子和外壳可独立制作，既可节省材料，又可降低音频插座连接器的废品率。

公开(公告)号：US07465193B2

公开(公告)日：2008-12-16

申请号：US11697268

申请日：2007-04-05

Applicant: Kuo-Chin Lin ,  Hua-Lian Li ,  Feng Zhu ,  Hsin-Min Chao

Inventor： Kuo-Chin Lin ,  Hua-Lian Li ,  Feng Zhu ,  Hsin-Min Chao

IPC: H01R13/648

CPC classification number: H01R13/6582 ,  H01R12/725

Abstract: A shielded surface mount connector mounted to a PCB includes a housing, a plurality of terminals and a shelter enclosing the housing. The housing provides a first protruding portion and a second protruding portion. The first and second protruding portions extend downwards respectively to form a first pillar and a second pillar. The shelter provides a first shielding portion and a second shielding portion for covering the first and second protruding portions respectively. The edges of the shielding portions extend downwards respectively to form a first inserting portion and a second inserting portion. As mentioned above, by inserting the first and second pillars and the two inserting portions into the corresponding holes of a PCB, the shielded surface mount connector is mounted to the edge of the PCB, which makes the electronic products much thinner due to the present invention, and saves more space of the PCB for other designs.

Abstract translation: 安装到PCB的屏蔽表面安装连接器包括壳体，多个端子和围绕壳体的遮蔽物。 壳体提供第一突出部分和第二突出部分。 第一和第二突出部分别向下延伸以形成第一支柱和第二支柱。 防护罩提供第一遮蔽部分和用于分别覆盖第一和第二突出部分的第二屏蔽部分。 屏蔽部分的边缘分别向下延伸以形成第一插入部分和第二插入部分。 如上所述，通过将第一和第二柱和两个插入部分插入到PCB的相应孔中，屏蔽表面安装连接器安装到PCB的边缘，这使得由于本发明而使电子产品更薄 ，并为其他设计节省了PCB的更多空间。

公开(公告)号：US20080248675A1

公开(公告)日：2008-10-09

申请号：US11697268

申请日：2007-04-05

Applicant: Kuo-Chin Lin ,  Hua-Lian Li ,  Feng Zhu ,  Hsin-Min Chao

Inventor： Kuo-Chin Lin ,  Hua-Lian Li ,  Feng Zhu ,  Hsin-Min Chao

IPC: H01R13/62

CPC classification number: H01R13/6582 ,  H01R12/725

Abstract: A shielded surface mount connector mounted to a PCB includes a housing, a plurality of terminals and a shelter enclosing the housing. The housing provides a first protruding portion and a second protruding portion. The first and second protruding portions extend downwards respectively to form a first pillar and a second pillar. The shelter provides a first shielding portion and a second shielding portion for covering the first and second protruding portions respectively. The edges of the shielding portions extend downwards respectively to form a first inserting portion and a second inserting portion. As mentioned above, by inserting the first and second pillars and the two inserting portions into the corresponding holes of a PCB, the shielded surface mount connector is mounted to the edge of the PCB, which makes the electronic products much thinner due to the present invention, and saves more space of the PCB for other designs.

Abstract translation: 安装到PCB的屏蔽表面安装连接器包括壳体，多个端子和围绕壳体的遮蔽物。 壳体提供第一突出部分和第二突出部分。 第一和第二突出部分别向下延伸以形成第一支柱和第二支柱。 防护罩提供第一遮蔽部分和用于分别覆盖第一和第二突出部分的第二屏蔽部分。 屏蔽部分的边缘分别向下延伸以形成第一插入部分和第二插入部分。 如上所述，通过将第一和第二柱和两个插入部分插入到PCB的相应孔中，屏蔽表面安装连接器安装到PCB的边缘，这使得由于本发明而使电子产品更薄 ，并为其他设计节省了PCB的更多空间。

公开(公告)号：USD572195S1

公开(公告)日：2008-07-01

申请号：US29270789

申请日：2007-01-04

Applicant: Kuo Chin Lin ,  Feng Zhu ,  Hua Lian Li

Designer： Kuo Chin Lin ,  Feng Zhu ,  Hua Lian Li

公开(公告)号：USD570784S1

公开(公告)日：2008-06-10

申请号：US29270216

申请日：2006-12-19

Applicant: Kuo Chin Lin ,  Hsin Min Chao ,  Hua Lian Li ,  Feng Zhu

Designer： Kuo Chin Lin ,  Hsin Min Chao ,  Hua Lian Li ,  Feng Zhu

公开(公告)号：US07341472B2

公开(公告)日：2008-03-11

申请号：US11453818

申请日：2006-06-16

Applicant: Hsin-Min Chao ,  Kuo-Chin Lin

Inventor： Hsin-Min Chao ,  Kuo-Chin Lin

IPC: H01R13/627

CPC classification number: H01R13/6275 ,  H01R9/032 ,  H01R13/6581 ,  H01R13/6591

Abstract: A plug connector with latch means includes a casing, a mating portion and a latch means. The latch means consists of a lock member and a press member. The lock member has a lock arm, the front end of the lock arm projects sideward and defines a pawl, the back end projects sideward and defines a projection. The front end of the press member bends inward to define a press portion, the back end bends inward to define a blocking portion. To disengage the plug connector from the mating connector, the casing is pulled, the press member is driven to move backward along with the casing and the press portion presses the projection of the lock member, the projection is driven to move inward and drives the pawl move into the inlay cavity, thereby, the plug connector with latch means disengages from the mating connector easily.

Abstract translation: 具有闩锁装置的插头连接器包括壳体，配合部分和闩锁装置。 闩锁装置由锁定构件和按压构件组成。 锁定构件具有锁定臂，锁定臂的前端侧向突出并限定棘爪，后端侧向突出并且限定突起。 按压构件的前端向内弯曲以形成按压部分，后端向内弯曲以限定阻挡部分。 为了使插头连接器与配合连接器脱开，壳体被拉动，推动构件被驱动以与壳体一起向后移动，并且按压部分按压锁定构件的突起，突起被驱动向内移动并驱动棘爪 移动到镶嵌腔中，由此，具有闩锁装置的插头连接器容易地与配合连接器脱离接合。

公开(公告)号：USD552553S1

公开(公告)日：2007-10-09

申请号：US29270213

申请日：2006-12-19

Applicant: Kuo Chin Lin ,  Bo Liu ,  Feng Zhu

Designer： Kuo Chin Lin ,  Bo Liu ,  Feng Zhu

公开(公告)号：US07125280B1

公开(公告)日：2006-10-24

申请号：US11405611

申请日：2006-04-18

Applicant: Shih-An Lee ,  Kuo-Chin Lin ,  Kai-Hsiang Chang

Inventor： Shih-An Lee ,  Kuo-Chin Lin ,  Kai-Hsiang Chang

IPC: H01R3/00

CPC classification number: H01R13/717 ,  H01R13/6594 ,  H01R13/7175 ,  H01R24/62 ,  H01R43/18

Abstract: An electrical connector assembly for soldering with a PCB and connecting to a plug includes an insulating housing containing a terminal module and a LED module. The terminal module includes a base containing a plurality of terminals. Each terminal has a body, a contacting portion extended upwardly from one end of the body for mating with the plug, a soldering portion bent rearwards from the other end of the body for soldering with the PCB. The LED module includes a pair of conduction terminals. Each conduction terminal has a post, a contacting portion extended frontward from one end of the post for connecting to a LED element, a soldering portion bent rearwards from the other end of the post for soldering with the PCB. Additionally, the soldering portions of the terminals and the conduction terminals are arranged at same plane for soldering with the PCB by surface mount technology.

Abstract translation: 用于与PCB焊接并连接到插头的电连接器组件包括包含端子模块和LED模块的绝缘壳体。 终端模块包括包含多个终端的基座。 每个端子具有主体，从主体的一端向上延伸以与插头配合的接触部分，从主体的另一端向后弯曲的焊接部分，用于与PCB焊接。 LED模块包括一对导电端子。 每个导电端子具有柱，从柱的一端向前延伸以连接到LED元件的接触部分，从柱的另一端向后弯曲的焊接部分，用于与PCB焊接。 此外，端子和导电端子的焊接部分布置在与PCB通过表面贴装技术焊接在同一平面上。

公开(公告)号：US20060111804A1

公开(公告)日：2006-05-25

申请号：US11229153

申请日：2005-09-16

Applicant: Kuo-Chin Lin

Inventor： Kuo-Chin Lin

IPC: G06F19/00

CPC classification number: G05B19/4184 ,  G05B2219/31357 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/86

Abstract: A method for detecting a fault condition of a manufacturing process involving acquiring data and developing a model based on a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The method also involves identifying which of the manufacturing related variables have a substantial affect on the model for detecting faulty outputs of the manufacturing process. The method also involves updating the model by using the manufacturing related variables identified as having a substantial affect on the model to improve the ability of the model to detect faulty outputs of the manufacturing process.