公开(公告)号：US20080116407A1

公开(公告)日：2008-05-22

申请号：US11641063

申请日：2006-12-19

Applicant: Yu-Ching Chang

Inventor： Yu-Ching Chang

IPC: F16L37/28

CPC classification number: F16L37/23 ,  F16L37/092 ,  F16L37/413

Abstract: A quick connector includes a main member, a housing, a sliding member and an elastic member. The main member has a chamber therein, two bores, a check valve and an elastic device urging the check valve sealing the bore. The housing has a big end, a small end and a sloping section. The big end is connected to the bore of the main member. The sliding member has an elongated bore, first and second ring portions, a plurality of apertures, and balls received in the apertures. The sliding member is inserted into the housing via the small end with the first ring portion out of the housing, the second ring portion in the housing and the sloping section of the housing between the first ring portion and the second ring portion. The elastic member urges the sliding member distal to the main member initially.

公开(公告)号：US20080023722A1

公开(公告)日：2008-01-31

申请号：US11878273

申请日：2007-07-23

Applicant: Yi-Sheng Lee ,  Chih-Hao Yu ,  Chin-Ming Cheng ,  Yu-Ping Hsieh ,  Yu-Ching Chang ,  Yi-Hong Huang

Inventor： Yi-Sheng Lee ,  Chih-Hao Yu ,  Chin-Ming Cheng ,  Yu-Ping Hsieh ,  Yu-Ching Chang ,  Yi-Hong Huang

IPC: H01L33/00 ,  H01L21/00

CPC classification number: F21V29/503 ,  F21K9/00 ,  F21V29/51 ,  F21V29/677 ,  F21V29/763 ,  F21V29/87 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H05K1/0203 ,  H05K3/107 ,  H05K2201/0919 ,  H05K2201/1028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting heat-dissipating device includes at least one light-emitting chip and a circuit board. The circuit board has at least one recess and at least one thermally conducting element disposed in the recess. The light-emitting chip is disposed on the thermally conducting element and connected to the circuit board via contact pads electrically connected to a circuit layout of the circuit board. In addition, the light-emitting chip is package by a filler on the circuit board. A packaging method of the light-emitting heat-dissipating device is also disclosed.

Abstract translation: 发光散热装置包括至少一个发光芯片和电路板。 电路板具有至少一个凹部和设置在凹部中的至少一个导热元件。 发光芯片设置在导热元件上，并通过电连接到电路板的电路布局的接触垫连接到电路板。 此外，发光芯片通过电路板上的填料封装。 还公开了一种发光散热装置的封装方法。