公开(公告)号：US20140361670A1

公开(公告)日：2014-12-11

申请号：US14296025

申请日：2014-06-04

Applicant: Apple Inc.

Inventor： Christopher D. Prest ,  Lucy E. Browning ,  Michael K. Pilliod ,  Theodore A. Waniuk

IPC: B22F7/00 ,  H05K5/02 ,  B22F1/02

CPC classification number: B22F7/008 ,  B22F1/02 ,  B22F1/025 ,  B22F7/002 ,  C22C1/101 ,  C22C1/1084 ,  C22C26/00 ,  C22C29/005 ,  C22C29/08 ,  C22C29/12 ,  C22C32/00 ,  C22C32/0021 ,  C22C32/0052 ,  C22C32/0068 ,  G04B37/22 ,  Y10T428/12153

Abstract: A metal matrix composite using as one of the components a precious metal is described. In one embodiment, the precious metal takes the form of gold and the metal matrix composite has a gold mass fraction in accordance with 18 k. The metal matrix composite can be formed by blending a precious metal (e.g., gold) powder and a ceramic powder, forming a mixture that is then compressed within a die having a near net shape of the metal matrix composite. The compressed mixture in the die is then heated to sinter the precious metal and ceramic powder. Other techniques for forming the precious metal matrix composite using HIP, and a diamond powder are also disclosed.

Abstract translation: 描述了使用贵金属作为组分之一的金属基质复合材料。 在一个实施方案中，贵金属采取金的形式，并且金属基质复合物具有根据18k的金质量分数。 金属基复合材料可以通过将贵金属（例如金）粉末和陶瓷粉末混合形成混合物，然后在具有金属基质复合材料的近净形状的模具内被压缩而形成。 然后将模具中的压缩混合物加热以烧结贵金属和陶瓷粉末。 还公开了使用HIP形成贵金属基质复合材料的其它技术和金刚石粉末。

公开(公告)号：US20140285956A1

公开(公告)日：2014-09-25

申请号：US14295110

申请日：2014-06-03

Applicant: Apple Inc.

Inventor： Peter N. Russell-Clarke ,  Michael K. Pilliod ,  Jonathan P. Ive

IPC: H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0004 ,  B24B7/241 ,  B24B7/242 ,  C03B23/245 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/045 ,  H04M1/0266 ,  H04M1/0268 ,  H05K5/0017 ,  H05K5/02 ,  H05K5/0234

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract translation: 电子设备可以具有玻璃外壳结构。 玻璃外壳结构可用于覆盖显示器和其它内部电子设备部件。 玻璃外壳结构可以具有使用玻璃熔合工艺连接的多个玻璃片。 周边玻璃构件可以沿着平面玻璃构件的边缘熔合以增强边缘的厚度。 可以通过加工加厚的边缘来形成圆形边缘特征。 凸起的熔融玻璃特征可以围绕平面玻璃构件中的开口。 多个平面玻璃构件可以熔合在一起以形成可以安装电子部件的五边框。 可以通过将玻璃结构融合到平面玻璃构件来形成凸起的支撑结构肋。 可以使用不透明掩模材料和有色玻璃来产生隐藏内部装置部件的玻璃外壳结构的部分。