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公开(公告)号:US11619594B2
公开(公告)日:2023-04-04
申请号:US17242569
申请日:2021-04-28
Applicant: Applied Materials, Inc.
Inventor: Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.
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公开(公告)号:US20220026817A1
公开(公告)日:2022-01-27
申请号:US17379707
申请日:2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A method for training a machine learning model to predict metrology measurements of a current substrate being processed at a manufacturing system is provided. Training data for the machine learning model is generated. A first training input including historical spectral data and/or historical non-spectral data associated with a surface of a prior substrate previously processed at the manufacturing system is generated. A first target output for the first training input is generated. The first target output includes historical metrology measurements associated with the prior substrate previously processed at the manufacturing system. Data is provided to train the machine learning model on (i) a set of training inputs including the first training input, and (ii) a set of target outputs including a first target output.
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