-
公开(公告)号：US20220349833A1
公开(公告)日：2022-11-03
申请号：US17242569
申请日：2021-04-28
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.
-
公开(公告)号：US20230358790A1
公开(公告)日：2023-11-09
申请号：US17737682
申请日：2022-05-05
Applicant: Applied Materials, Inc.
Inventor： David Coumou , Xiaopu Li , Michelle SanPedro
IPC: G01R19/00 , G01R19/25 , G01R19/165 , G01R15/18
CPC classification number: G01R19/0007 , G01R19/2513 , G01R19/16533 , G01R15/18
Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.
-
Patent Agency Ranking
公开(公告)号：US12061215B2
公开(公告)日：2024-08-13
申请号：US17737682
申请日：2022-05-05
Applicant: Applied Materials, Inc.
Inventor： David Coumou , Xiaopu Li , Michelle SanPedro
IPC: G01R19/00 , G01R15/18 , G01R19/165 , G01R19/25
CPC classification number: G01R19/0007 , G01R15/18 , G01R19/16533 , G01R19/2513
Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.
-
公开(公告)号：US20230168210A1
公开(公告)日：2023-06-01
申请号：US18101869
申请日：2023-01-26
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
CPC classification number: G01N21/9501 , G01B11/0616 , G01N21/211
Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.
-
公开(公告)号：US20240393373A1
公开(公告)日：2024-11-28
申请号：US18787862
申请日：2024-07-29
Applicant: Applied Materials, Inc.
Inventor： David Coumou , Xiaopu Li , Michelle SanPedro
IPC: G01R19/00 , G01R15/18 , G01R19/165 , G01R19/25
Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.
-
公开(公告)号：US11927543B2
公开(公告)日：2024-03-12
申请号：US18101869
申请日：2023-01-26
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
CPC classification number: G01N21/9501 , G01B11/0616 , G01N21/211
Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.
-
公开(公告)号：US11619594B2
公开(公告)日：2023-04-04
申请号：US17242569
申请日：2021-04-28
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.
-
-
-
-
-
-
Search Results
7
records
(took 0.011 seconds)
