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公开(公告)号:US20230168210A1
公开(公告)日:2023-06-01
申请号:US18101869
申请日:2023-01-26
Applicant: Applied Materials, Inc.
Inventor: Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
CPC classification number: G01N21/9501 , G01B11/0616 , G01N21/211
Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.
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公开(公告)号:US20230062206A1
公开(公告)日:2023-03-02
申请号:US18046872
申请日:2022-10-14
Applicant: APPLIED MATERIALS, INC.
Inventor: Thomas Li , Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
IPC: G03F7/20
Abstract: Spectral data associated with a first prior substrate and/or a second prior substrate is obtained. A metrology measurement value associated with the first portion of the first prior substrate is determined based on one or more metrology measurement values measured for at least one of a second portion of the first prior substrate or a third portion of a second prior substrate. Training data for training a machine learning model to predict metrology measurement values of a current substrate is generated. Generating the training data includes generating a first training input including the spectral data associated with the first prior substrate and generating a first target output for the first training input, the first target output including the determined metrology measurement value associated with the first portion of the first prior substrate. The training data is provided to train the machine learning model.
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公开(公告)号:US20220333989A1
公开(公告)日:2022-10-20
申请号:US17234940
申请日:2021-04-20
Applicant: Applied Materials, Inc.
Inventor: Blake Erickson , Keith Berding , Michael Kutney , Zhaozhao Zhu , Tsung Feng Wu , Michael D. Willwerth , Jeffrey Ludwig
Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.
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公开(公告)号:US12136557B2
公开(公告)日:2024-11-05
申请号:US18335899
申请日:2023-06-15
Applicant: APPLIED MATERIALS, INC.
Inventor: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.
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公开(公告)号:US12114083B2
公开(公告)日:2024-10-08
申请号:US18214417
申请日:2023-06-26
Applicant: Applied Materials, Inc.
Inventor: Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC classification number: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号:US20220028713A1
公开(公告)日:2022-01-27
申请号:US17379653
申请日:2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored. A determination is made based on the first set of measurements mapped to the second set of measurements for the substrate of whether to modify the first process recipe or a second process recipe for the substrate.
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公开(公告)号:US11284018B1
公开(公告)日:2022-03-22
申请号:US17021992
申请日:2020-09-15
Applicant: Applied Materials, Inc.
Inventor: Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号:US20220066411A1
公开(公告)日:2022-03-03
申请号:US17379728
申请日:2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
IPC: G05B19/401 , G06N20/00 , G06N5/04
Abstract: Methods and systems for detecting and correcting substrate process drift using machine learning are provided. Data associated with processing each of a first set of substrates at a manufacturing system according to a process recipe is provided as input to a trained machine learning model. One or more outputs are obtained from the trained machine learning model. An amount of drift of a first set of metrology measurement values for the first set of substrates from a target metrology measurement value is determined from the one or more outputs. Process recipe modification identifying one or more modifications to the process recipe is also determined. For each modification, an indication of a level of confidence that a respective modification to the process recipe satisfies a drift criterion for a second set of substrates is determined. In response to an identification of the respective modification with a level of confidence that satisfies a level of confidence criterion, the process recipe is updated based on the respective modification.
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公开(公告)号:US20200340858A1
公开(公告)日:2020-10-29
申请号:US16828609
申请日:2020-03-24
Applicant: Applied Materials, Inc.
Inventor: Philip Allan Kraus , Kelvin Chan , Travis Koh , Blake Erickson , Upendra Ummethala
Abstract: Embodiments disclosed herein include an optical sensor system. In an embodiment, the optical sensor system comprises a processing chamber and a sensor. In an embodiment, the sensor comprises a first diffraction grating oriented in a first direction, a second diffraction grating oriented in a second direction, and a detector for detecting electromagnetic radiation diffracted from the first grating and the second grating. In an embodiment, the optical sensor system further comprises an optical coupling element, where the optical coupling element optically couples an interior of the processing chamber to the sensor.
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公开(公告)号:US12191176B2
公开(公告)日:2025-01-07
申请号:US18335899
申请日:2023-06-15
Applicant: APPLIED MATERIALS, INC.
Inventor: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.
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