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公开(公告)号:US12114083B2
公开(公告)日:2024-10-08
申请号:US18214417
申请日:2023-06-26
发明人: Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC分类号: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
摘要: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号:US20220028713A1
公开(公告)日:2022-01-27
申请号:US17379653
申请日:2021-07-19
发明人: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
摘要: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored. A determination is made based on the first set of measurements mapped to the second set of measurements for the substrate of whether to modify the first process recipe or a second process recipe for the substrate.
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公开(公告)号:US20230168210A1
公开(公告)日:2023-06-01
申请号:US18101869
申请日:2023-01-26
发明人: Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
CPC分类号: G01N21/9501 , G01B11/0616 , G01N21/211
摘要: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.
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公开(公告)号:US20230062206A1
公开(公告)日:2023-03-02
申请号:US18046872
申请日:2022-10-14
发明人: Thomas Li , Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
IPC分类号: G03F7/20
摘要: Spectral data associated with a first prior substrate and/or a second prior substrate is obtained. A metrology measurement value associated with the first portion of the first prior substrate is determined based on one or more metrology measurement values measured for at least one of a second portion of the first prior substrate or a third portion of a second prior substrate. Training data for training a machine learning model to predict metrology measurement values of a current substrate is generated. Generating the training data includes generating a first training input including the spectral data associated with the first prior substrate and generating a first target output for the first training input, the first target output including the determined metrology measurement value associated with the first portion of the first prior substrate. The training data is provided to train the machine learning model.
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公开(公告)号:US20220333989A1
公开(公告)日:2022-10-20
申请号:US17234940
申请日:2021-04-20
发明人: Blake Erickson , Keith Berding , Michael Kutney , Zhaozhao Zhu , Tsung Feng Wu , Michael D. Willwerth , Jeffrey Ludwig
摘要: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.
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公开(公告)号:US11284018B1
公开(公告)日:2022-03-22
申请号:US17021992
申请日:2020-09-15
发明人: Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
摘要: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号:US20220066411A1
公开(公告)日:2022-03-03
申请号:US17379728
申请日:2021-07-19
发明人: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
IPC分类号: G05B19/401 , G06N20/00 , G06N5/04
摘要: Methods and systems for detecting and correcting substrate process drift using machine learning are provided. Data associated with processing each of a first set of substrates at a manufacturing system according to a process recipe is provided as input to a trained machine learning model. One or more outputs are obtained from the trained machine learning model. An amount of drift of a first set of metrology measurement values for the first set of substrates from a target metrology measurement value is determined from the one or more outputs. Process recipe modification identifying one or more modifications to the process recipe is also determined. For each modification, an indication of a level of confidence that a respective modification to the process recipe satisfies a drift criterion for a second set of substrates is determined. In response to an identification of the respective modification with a level of confidence that satisfies a level of confidence criterion, the process recipe is updated based on the respective modification.
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公开(公告)号:US20200340858A1
公开(公告)日:2020-10-29
申请号:US16828609
申请日:2020-03-24
摘要: Embodiments disclosed herein include an optical sensor system. In an embodiment, the optical sensor system comprises a processing chamber and a sensor. In an embodiment, the sensor comprises a first diffraction grating oriented in a first direction, a second diffraction grating oriented in a second direction, and a detector for detecting electromagnetic radiation diffracted from the first grating and the second grating. In an embodiment, the optical sensor system further comprises an optical coupling element, where the optical coupling element optically couples an interior of the processing chamber to the sensor.
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公开(公告)号:US20240096715A1
公开(公告)日:2024-03-21
申请号:US18520369
申请日:2023-11-27
发明人: Keith Berding , Blake Erickson , Soumendra Barman , Zhaozhao Zhu
IPC分类号: H01L21/66 , H01J37/32 , H01L21/3213
CPC分类号: H01L22/26 , H01J37/32963 , H01L21/32136 , H01L21/32139 , H01J2237/334
摘要: An article includes a device, a first layer deposited on a surface of the device, and a second layer deposited on the first layer. The first layer includes a first sense material deposited on a first portion of the surface and a second sense material deposited on a second portion of the surface. The second layer includes a first etch material deposited on the first sense material and a second etch material deposited on the second sense material. Responsive to the second layer being etched during an etch process performed at a processing chamber of an electronics processing system, at least one of the first sense material or the second sense material can be detected at the surface of the device.
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公开(公告)号:US20230258500A1
公开(公告)日:2023-08-17
申请号:US18138914
申请日:2023-04-25
发明人: Blake Erickson , Keith Berding , Michael Kutney , Zhaozhao Zhu , Tsung Feng Wu , Michael D. Willwerth , Jeffrey Ludwig
CPC分类号: G01J3/32 , G01J3/0291 , G01N21/255 , G01N21/68 , G01N21/9501
摘要: An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.
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