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    DETERMINING SUBSTRATE PROFILE PROPERTIES USING MACHINE LEARNING
    1.
    发明申请
    DETERMINING SUBSTRATE PROFILE PROPERTIES USING MACHINE LEARNING 有权

    公开(公告)号：US20230062206A1

    公开(公告)日：2023-03-02

    申请号：US18046872

    申请日：2022-10-14

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Thomas Li ,  Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

    IPC: G03F7/20

    Abstract: Spectral data associated with a first prior substrate and/or a second prior substrate is obtained. A metrology measurement value associated with the first portion of the first prior substrate is determined based on one or more metrology measurement values measured for at least one of a second portion of the first prior substrate or a third portion of a second prior substrate. Training data for training a machine learning model to predict metrology measurement values of a current substrate is generated. Generating the training data includes generating a first training input including the spectral data associated with the first prior substrate and generating a first target output for the first training input, the first target output including the determined metrology measurement value associated with the first portion of the first prior substrate. The training data is provided to train the machine learning model.

    System and method for electrostatically chucking a substrate to a carrier
    2.
    发明授权
    System and method for electrostatically chucking a substrate to a carrier 有权

    公开(公告)号：US11196360B2

    公开(公告)日：2021-12-07

    申请号：US16655168

    申请日：2019-10-16

    Applicant: Applied Materials, Inc.

    Inventor： Alexander N. Lerner ,  Kim Ramkumar Vellore ,  Steven Trey Tindel

    IPC: H02N13/00 ,  C23C16/458 ,  H01L51/56 ,  H01L51/00 ,  H01L21/683 ,  H01L21/67

    Abstract: A chucking station comprises a chuck, a power supply, and one or more pumping elements. The chuck comprises a plurality of first vacuum ports configured to interface with a surface of a substrate and a plurality of second vacuum ports configured to interface with a surface of a carrier. The chuck further comprises a first electrical pin configured to be in electrical communication with a first electrode of the carrier, and a second electrical pin configured to be in electrical communication with a second electrode of the carrier. The power supply is configured to apply a chucking voltage and a de-chucking voltage to the first and second electrical pins. The one or more pumping elements is coupled to the first and second vacuum ports and configured to generate a vacuum between the substrate and the chuck and a vacuum between the carrier and the chuck.

    Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
    3.
    发明授权
    Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency 有权

    公开(公告)号：US10916464B1

    公开(公告)日：2021-02-09

    申请号：US16552967

    申请日：2019-08-27

    Applicant: Applied Materials, Inc.

    Inventor： Kim Ramkumar Vellore ,  Alexander N. Lerner ,  Steven Trey Tindel

    IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/683 ,  H01L21/687

    Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.

    SUBSTRATE MEASUREMENT SUBSYSTEM
    6.
    发明申请
    SUBSTRATE MEASUREMENT SUBSYSTEM 有权

    公开(公告)号：US20220028716A1

    公开(公告)日：2022-01-27

    申请号：US17379677

    申请日：2021-07-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

    IPC: H01L21/67 ,  G01N21/25 ,  G01N21/95 ,  G01B11/00

    Abstract: A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.

    Filter isolation for equipment front end module
    7.
    发明授权
    Filter isolation for equipment front end module 有权

    公开(公告)号：US12140339B2

    公开(公告)日：2024-11-12

    申请号：US18046290

    申请日：2022-10-13

    Applicant: APPLIED MATERIALS, INC.

    Inventor： James Christopher Hansen ,  Steven Trey Tindel ,  Paul B. Reuter

    IPC: F24F3/16 ,  B01D46/00 ,  B01D50/00 ,  F24F3/163 ,  H01L21/67 ,  H01L21/673

    Abstract: Disclosed herein are systems and methods for reducing startup time of an equipment front end module (EFEM). The EFEM may include an EFEM chamber formed between a plurality of walls, an upper plenum above the EFEM chamber, the upper plenum in fluid communication with the EFEM chamber, a plurality of ducts that provide a return gas flow path enabling recirculation of gas from the EFEM chamber to the upper plenum, one or more filters that separate the upper plenum from the EFEM chamber, an isolation gate configured to block the return gas flow path responsive to the isolation gate being actuated to a closed position to isolate the one or more filters from an ambient environment responsive to a gas being flowed through the upper plenum when the EFEM chamber is opened to the ambient environment.

    FILTER ISOLATION FOR REDUCED STARTUP TIME IN LOW RELATIVE HUMIDITY EQUIPMENT FRONT END MODULE
    8.
    发明公开
    FILTER ISOLATION FOR REDUCED STARTUP TIME IN LOW RELATIVE HUMIDITY EQUIPMENT FRONT END MODULE 审中-公开

    公开(公告)号：US20230321583A1

    公开(公告)日：2023-10-12

    申请号：US17716927

    申请日：2022-04-08

    Applicant: Applied Materials, Inc.

    Inventor： Steven Trey Tindel ,  Paul B. Reuter

    IPC: B01D46/42 ,  B01D46/00

    CPC classification number: B01D46/42 ,  B01D46/0002 ,  B01D2271/02

    Abstract: Disclosed herein are systems and methods for reducing startup time of an equipment front end module (EFEM). The EFEM may include an EFEM chamber formed between a plurality of walls, an upper plenum at a top of the EFEM, the upper plenum in fluid communication with the EFEM chamber, a plurality of ducts that provide a return gas flow path enabling recirculation of gas from the EFEM chamber to the upper plenum, one or more filters in fluid communication with the upper plenum and the EFEM chamber and at least one isolation component configured to removably attach to the EFEM to isolate at least the one or more filters from an ambient environment when the EFEM is opened to the ambient environment.

    DETECTING AND CORRECTING SUBSTRATE PROCESS DRIFT USING MACHINE LEARNING
    9.
    发明申请
    DETECTING AND CORRECTING SUBSTRATE PROCESS DRIFT USING MACHINE LEARNING 有权

    公开(公告)号：US20220066411A1

    公开(公告)日：2022-03-03

    申请号：US17379728

    申请日：2021-07-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

    IPC: G05B19/401 ,  G06N20/00 ,  G06N5/04

    Abstract: Methods and systems for detecting and correcting substrate process drift using machine learning are provided. Data associated with processing each of a first set of substrates at a manufacturing system according to a process recipe is provided as input to a trained machine learning model. One or more outputs are obtained from the trained machine learning model. An amount of drift of a first set of metrology measurement values for the first set of substrates from a target metrology measurement value is determined from the one or more outputs. Process recipe modification identifying one or more modifications to the process recipe is also determined. For each modification, an indication of a level of confidence that a respective modification to the process recipe satisfies a drift criterion for a second set of substrates is determined. In response to an identification of the respective modification with a level of confidence that satisfies a level of confidence criterion, the process recipe is updated based on the respective modification.

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