公开(公告)号：US20170250094A1

公开(公告)日：2017-08-31

申请号：US15593197

申请日：2017-05-11

Applicant: Applied Materials, Inc.

Inventor： Steven VERHAVERBEKE ,  Han-Wen CHEN ,  Roman GOUK

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/08 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67034 ,  B08B3/08 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67742

Abstract: Embodiments of the invention generally relate to a method of cleaning a substrate and a substrate processing apparatus that is configured to perform the method of cleaning the substrate. More specifically, embodiments of the present invention relate to a method of cleaning a substrate in a manner that reduces or eliminates the negative effects of line stiction between semiconductor device features. Other embodiments of the present invention relate to a substrate processing apparatus that allows for cleaning of the substrate in a manner that reduces or eliminates line stiction between semiconductor device features formed on the substrate.

公开(公告)号：US20170098542A1

公开(公告)日：2017-04-06

申请号：US15268180

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  B08B3/04

CPC classification number: H01L21/02101 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/6719 ,  H01L21/68728 ,  H01L21/68785

Abstract: A substrate support apparatus is provided. The apparatus includes a circular base plate and one or more spacers disposed about a circumference of the base plate. The spacers may extend from a top surface of the base plate and a ring body may be coupled to the spacers. The ring body may be spaced from the base plate to define apertures between the base plate and the ring body. One or more support posts may be coupled to the base plate and extend therefrom. The support posts may be coupled to the base plate at positions radially inward from an inner surface of the ring body.

公开(公告)号：US20170098541A1

公开(公告)日：2017-04-06

申请号：US15268162

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  F26B21/14 ,  B08B7/00 ,  F26B5/04

Abstract: A method for processing a substrate is disclosed. The method includes delivering a solvent to a processing chamber and delivering a substrate to the processing chamber. The amount of solvent present in the processing chamber may be configured to submerse the substrate. Liquid CO2 may be delivered to the processing chamber and the liquid CO2 may be mixed with the solvent. Additional liquid CO2 may be delivered to the processing chamber in an amount greater than a volume of the processing chamber to displace the solvent. The liquid CO2 may be phase transitioned to supercritical CO2 in the processing chamber and the substrate may be dried by isothermally depressurizing the processing chamber and exhausting gaseous CO2 from the processing chamber.

公开(公告)号：US20140144462A1

公开(公告)日：2014-05-29

申请号：US14078373

申请日：2013-11-12

Applicant: Applied Materials, Inc.

Inventor： Steven VERHAVERBEKE ,  Han-Wen CHEN ,  Roman GOUK

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67034 ,  B08B3/08 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67742

Abstract: Embodiments of the invention generally relate to a method of cleaning a substrate and a substrate processing apparatus that is configured to perform the method of cleaning the substrate. More specifically, embodiments of the present invention relate to a method of cleaning a substrate in a manner that reduces or eliminates the negative effects of line stiction between semiconductor device features. Other embodiments of the present invention relate to a substrate processing apparatus that allows for cleaning of the substrate in a manner that reduces or eliminates line stiction between semiconductor device features formed on the substrate.

Abstract translation: 本发明的实施例一般涉及一种清洁基板的方法和一种被配置为执行清洁基板的方法的基板处理装置。 更具体地，本发明的实施例涉及一种以减少或消除半导体器件特征之间的线状静电的负面影响的方式来清洁衬底的方法。 本发明的其他实施例涉及一种基板处理装置，其能够以减少或消除在基板上形成的半导体器件特征之间的线状静电的方式来清洁基板。