公开(公告)号：US20220415739A1

公开(公告)日：2022-12-29

申请号：US17898299

申请日：2022-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/31

Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.

公开(公告)号：US20220128768A1

公开(公告)日：2022-04-28

申请号：US17568510

申请日：2022-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Huang-Hsien CHANG ,  Po Ju WU ,  Yu Cheng CHEN ,  Wen-Long LU

IPC: G02B6/36 ,  G02B6/44 ,  G02B6/42

Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.

公开(公告)号：US20210217677A1

公开(公告)日：2021-07-15

申请号：US16738763

申请日：2020-01-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/31 ,  H01L27/01 ,  H01L49/02 ,  H01L21/56

Abstract: A semiconductor package includes a substrate, an electronic component and a first dilatant layer. The electronic component is disposed on the substrate. The electronic component has a top surface, a bottom surface opposite to the top surface and a lateral surface extending between the top surface and the bottom surface. The first dilatant layer is disposed on the top surface of the electronic component and extends along the lateral surface of the electronic component.

公开(公告)号：US20210202395A1

公开(公告)日：2021-07-01

申请号：US16728789

申请日：2019-12-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/18 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L25/00

Abstract: A semiconductor package structure includes a first semiconductor die, a second semiconductor die, a third semiconductor die and an external contact. The second semiconductor die is disposed adjacent to the first semiconductor die. The third semiconductor die electrically connects the first semiconductor die and the second semiconductor die. The external contact is electrically connected to the third semiconductor die. An electrical path between the third semiconductor die and the external contact extends through a space between the first semiconductor die and the second semiconductor die.

公开(公告)号：US20210098677A1

公开(公告)日：2021-04-01

申请号：US16588666

申请日：2019-09-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L35/30 ,  H01L35/32 ,  H01L23/38

Abstract: A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.

公开(公告)号：US20210098180A1

公开(公告)日：2021-04-01

申请号：US16588655

申请日：2019-09-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01F27/28

Abstract: An inductor structure includes a carrier, a coil structure, an isolation structure and a ferromagnetism structure. The carrier has an upper surface. The coil structure is disposed adjacent to the upper surface of the carrier. The isolation structure covers the upper surface and the coil structure. The ferromagnetism structure is disposed on the isolation structure.

公开(公告)号：US20210028144A1

公开(公告)日：2021-01-28

申请号：US16521531

申请日：2019-07-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/00 ,  H01L21/762

Abstract: A semiconductor device package includes a first substrate having a first surface, a first electrical contact disposed on the first surface of the first substrate, a second substrate having a second surface facing the first surface of the first substrate, and a second electrical contact disposed on the second surface of the second substrate. The first electrical contact has a base portion and a protrusion portion. The second electrical contact covers at least a portion of the protrusion portion of the first electrical contact. The second electrical contact has a first surface facing the first substrate and a second surface facing the second substrate. A slope of a first interface between the second electrical contact and the protrusion portion of the first electrical contact adjacent to the first surface of the second electrical contact is substantially the same as a slope of a second interface between the second electrical contact and the protrusion portion of the first electrical contact adjacent to the second surface of the second electrical contact. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20190355664A1

公开(公告)日：2019-11-21

申请号：US15985472

申请日：2018-05-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/532 ,  H01L23/00

Abstract: An electronic device includes a first substrate, a first conductor, a first insulation layer, a second substrate, a second conductor, a second insulation layer. The first substrate has a first surface. The first conductor is disposed on the first surface of the first substrate. The first insulation layer is on the first conductor. The second substrate has a second surface facing toward the first surface of the first substrate. The second conductor is disposed on the second surface of the second substrate. The second insulation layer is on the second conductor. The first insulation layer is in contact with a sidewall of the second conductor. The second insulation layer is in contact with a sidewall of the first conductor. A coefficient of thermal expansion (CTE) of the first insulation layer is greater than a CTE of the first conductor.

公开(公告)号：US20190206824A1

公开(公告)日：2019-07-04

申请号：US15858714

申请日：2017-12-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/29 ,  H01L21/56 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/683

Abstract: A semiconductor package structure includes a first semiconductor die, a second semiconductor die, a plurality of conductive elements, a first encapsulant and a second encapsulant. The second semiconductor die is disposed on the first semiconductor die. The conductive elements each comprises a first portion and a second portion and are disposed around the first semiconductor die and the second semiconductor die. The first encapsulant surrounds the first semiconductor die and the respective first portions of the conductive elements. The second encapsulant covers a portion of a top portion of the first semiconductor die and surrounds the respective second portions of the conductive elements.

公开(公告)号：US20190013289A1

公开(公告)日：2019-01-10

申请号：US15645975

申请日：2017-07-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Kuang FANG ,  Wen-Long LU

IPC: H01L23/00 ,  H01L21/56

Abstract: A semiconductor device package includes an electronic component, a first set of conductive wires electrically connected to the electronic component, and an insulation layer surrounding the first set of conductive wires. The insulation layer exposes a portion of the first set of the conductive wires. The insulation layer is devoid of a filler.