摘要:
There are provided a semiconductor device and a method for manufacturing the same in which a thin film polysilicon film having a small parasitic capacitance which is required for attaining the high-speed operation and high reliability can be used as a resistance element, the process margin can be increased without increasing the number of manufacturing steps, and defects due to leakage between the resistance element and the underlying substrate can be eliminated so as to ensure the high manufacturing yield. In a semiconductor device having a conductive film formed over the surface of a semiconductor substrate with a first insulating film disposed therebetween and a metal wiring layer connected to the conductive film via a contact hole formed in a second insulating film which is formed on the conductive film, an etching stopper film having a selective etching ratio with respect to the second insulating film is formed in an area directly below the contact hole with a third insulating film disposed therebetween.
摘要:
The element separation region has a section on its surface, where the first resist pattern and second resist pattern overlap with each other. The overlapping section is not etched even while removing the dummy oxide films formed in the first and second regions divided by the element separation region. Therefore, a sufficient thickness of the element separation region is kept. Further, by providing the overlapping section, the formation of sources of generating dust, namely, fine recesses and projections on the element separation region, can be prevented if an masking error occurs. Consequently, the step of removing the dust generating sources is not necessary, thereby reducing the number of manufacturing steps.
摘要:
The memory cells connected to the word lines in the odd-numbered rows differ from the memory cells connected to the word lines in the even-numbered rows in characteristics. A dummy cell DMC1 has the same characteristics as those of the memory cells connected to the word lines in the odd-numbered rows, and a dummy cell DMC2 has the same characteristics as those of the memory cells connected to the word lines in the even-numbered rows. Because the dummy cell DMC1 is selected together with a word line in an odd-numbered row, and the dummy cell DMC2 is selected together with a word line in an even-numbered row, a suitable reference potential can be supplied in accordance with the selected memory cell. A sense amplifier compares the potential on the bit line to which the selected memory cell is connected with the potential supplied from the selected dummy cell. Therefore, the sense amplifier can sense the potential at the selected memory cell accurately.
摘要:
In a semiconductor device, a first gate electrode and isolation layers are formed on a first gate insulation layer on a p-type silicon semiconductor substrate, and a second gate electrode is formed on the first gate electrode with a second gate insulation layer interposed therebetween. The first gate electrode is constituted by a first polycrystalline silicon layer, a second polycrystalline silicon layer and an etching stopper thin film interposed therebetween. The first gate electrode is formed by anisotropic-etching or selectively etching the second polycrystalline silicon layer, so that the etching stopper is maintained.