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Patent Agency Ranking
公开(公告)号：US10041810B2
公开(公告)日：2018-08-07
申请号：US15176665
申请日：2016-06-08
Applicant: Allegro MicroSystems, LLC
Inventor： Ravi Vig , Paul A. David , Eric G. Shoemaker
Abstract: Magnetic field sensors can sense speed of movement and direction of movement of a ferromagnetic object. The magnetic field sensors employ both planar Hall effect elements and vertical Hall effect elements to generate two-state signals in two different signal paths with relative phases that are ninety degrees apart, the ninety degrees having sufficient margin to aid in detection of the direction of motion. Other magnetic field sensors use at least four vertical Hall effect elements to identify a speed of rotation and a direction of rotation of a moving ferromagnetic object.
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公开(公告)号：US20170356762A1
公开(公告)日：2017-12-14
申请号：US15176668
申请日：2016-06-08
Applicant: Allegro MicroSystems, LLC
Inventor： Paul A. David , Ravi Vig
Abstract: A back-biased magnetic field sensor can have one or more vertical Hall effect elements arranged within a substrate region of a substrate, wherein magnetic fields are oriented substantially vertical to the substrate within the substrate region when a ferromagnetic object is not proximate. When the ferromagnetic object becomes proximate, the magnetic field sensor can sense at least the proximity, and, in some embodiments, can also localize a position of the ferromagnetic object relative to the magnetic field sensor.
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公开(公告)号：US09494660B2
公开(公告)日：2016-11-15
申请号：US13749776
申请日：2013-01-25
Applicant: Allegro Microsystems, LLC
Inventor： Paul David , William P. Taylor , P. Karl Scheller , Ravi Vig , Andreas P. Friedrich
IPC: G01R33/00 , H01L23/495
CPC classification number: G01R33/00 , G01R33/0011 , G01R33/0047 , H01L23/49562 , H01L23/49589 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分。 在一些实施例中，至少一个无源部件附接到至少两个引线的管芯附接部分。
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公开(公告)号：US20140320124A1
公开(公告)日：2014-10-30
申请号：US13871131
申请日：2013-04-26
Applicant: ALLEGRO MICROSYSTEMS, LLC
Inventor： Paul David , Ravi Vig , William P. Taylor , Andreas P. Friedrich
IPC: G01R33/09
CPC classification number: G01R33/093 , G01R33/0047 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00 , H01L2924/00012
Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads and a separately formed ferromagnetic element, such as a magnet, is disposed adjacent to the lead frame.
Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分，并且分开形成的铁磁元件（例如磁体）被布置成与引线框架相邻。
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公开(公告)号：US20130249546A1
公开(公告)日：2013-09-26
申请号：US13749776
申请日：2013-01-25
Applicant: ALLEGRO MICROSYSTEMS, LLC
Inventor： Paul David , William P. Taylor , P. Karl Scheller , Ravi Vig , Andreas P. Friedrich
IPC: G01R33/00
CPC classification number: G01R33/00 , G01R33/0011 , G01R33/0047 , H01L23/49562 , H01L23/49589 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分。 在一些实施例中，至少一个无源部件附接到至少两个引线的管芯附接部分。
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