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公开(公告)号：US20060183408A1
公开(公告)日：2006-08-17
申请号：US11271242
申请日：2005-11-10
申请人： Alpay Yilmaz , Gerald Alonzo
发明人： Alpay Yilmaz , Gerald Alonzo
IPC分类号： B24B1/00
CPC分类号： H01L21/67276 , H01L21/67778
摘要： Methods for transferring substrates in a system with a factory interface robot between at least one FOUP, a buffer coupled to a parasitic device and an inbound and outbound transfer station coupled to a processing tool are provided. In one embodiment, a method for transferring substrates includes transferring a first substrate on an end effector of a robot from a FOUP to a buffer station serving a parasitic device, moving the substrate from the buffer station into the parasitic device, picking up a second substrate on the end effector, compensating for a residence time of the first substrate in the parasitic device, transferring the second substrate to parasitic device from the end effector to the buffer station serving the parasitic device, and picking up the first substrate from the buffer station.
摘要翻译： 提供了在至少一个FOUP，耦合到寄生装置的缓冲器和耦合到处理工具的入站和出站传送站之间的工厂接口机器人的系统中传送衬底的方法。 在一个实施例中，用于传送衬底的方法包括将机器人的末端执行器上的第一衬底从FOUP传送到服务于寄生器件的缓冲站，将衬底从缓冲站移动到寄生器件中，拾取第二衬底 在末端执行器上补偿第一衬底在寄生器件中的停留时间，将第二衬底从端部执行器传送到寄生器件到用于寄生器件的缓冲器，并从缓冲器拾取第一衬底。
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公开(公告)号：US20050176349A1
公开(公告)日：2005-08-11
申请号：US10988647
申请日：2004-11-15
申请人： Alpay Yilmaz , Simon Yavelberg , Toshikazu Tomita , Hui Chen , Noel Manto , David Lischka , Hung Chen
发明人： Alpay Yilmaz , Simon Yavelberg , Toshikazu Tomita , Hui Chen , Noel Manto , David Lischka , Hung Chen
CPC分类号： B24B37/345
摘要： Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.
摘要翻译： 提供了用于转移衬底的负载杯的实施例。 负载杯包括具有基板支撑件和去夹紧喷嘴的基座组件。 在将基板从抛光头转移到基板支撑件的过程中，去夹紧喷嘴定位成使流体在基板的抛光头和背面之间流动。
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