公开(公告)号：US09445491B2

公开(公告)日：2016-09-13

申请号：US14231372

申请日：2014-03-31

Applicant: Apple Inc.

Inventor： Gregory N. Stephens ,  Matthew D. Hill ,  Scott A. Myers

IPC: H01R4/66 ,  H05K1/02 ,  H01R12/57 ,  H01R4/64

CPC classification number: H05K1/0215 ,  H01R4/64 ,  H01R12/57 ,  H01R2201/06 ,  H05K2201/10265 ,  Y10T29/4913

Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

Abstract translation: 所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件，例如接地弹簧，以及为部件提供机械保护。 更具体地，公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。 在一个实施例中，接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。

公开(公告)号：US20160072178A1

公开(公告)日：2016-03-10

申请号：US14822091

申请日：2015-08-10

Applicant: Apple Inc.

Inventor： Sammy M. Khalifa ,  Daniel Lau ,  Scott A. Myers ,  Richard A. Besen ,  Gregory N. Stephens

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/36 ,  H01Q13/10

Abstract: An antenna may be formed from a peripheral conductive housing structure in an electronic device that is separated from an antenna ground by a gap. An antenna feed may be formed from a metal trace on a flexible printed circuit that spans the gap. The metal trace may have a line segment that joins a wider pad portion of the trace at a junction. A stiffener on the flexible printed circuit may have a protrusion that overlaps the junction. A metal bracket attached to the peripheral housing structure may be soldered to the pad. A metal member with meandering paths may form a return path in the antenna. The meandering path may have parallel segments that extend along an inner surface of the peripheral conductive housing structure to prevent the metal member from rotating when a screw is used to screw the metal member to the peripheral conductive housing structure.

Abstract translation: 天线可以由电子设备中的外围导电壳体结构形成，该电子设备通过间隙与天线接地分离。 天线馈电可以由跨越间隙的柔性印刷电路上的金属迹线形成。 金属迹线可以具有在结处连接迹线的较宽焊盘部分的线段。 柔性印刷电路上的加强件可以具有与接合部重叠的突起。 附接到外围壳体结构的金属支架可以焊接到垫上。 具有曲折路径的金属构件可以在天线中形成返回路径。 曲折路径可以具有沿着周边导电外壳结构的内表面延伸的平行段，以防止金属构件在使用螺钉将金属构件螺合到外围导电外壳结构时旋转。

公开(公告)号：US20160057897A1

公开(公告)日：2016-02-25

申请号：US14805780

申请日：2015-07-22

Applicant: Apple Inc.

Inventor： Shayan Malek ,  James B. Smith ,  Gregory N. Stephens

IPC: H05K9/00

CPC classification number: H05K9/0024

Abstract: An electronic device may have electrical components mounted on substrates such as printed circuits. The electrical components may include magnetic components such as inductors. A metal shielding can may be provided with a magnetic shielding layer to shield the magnetic components. The magnetic shielding layer may be formed on an inner surface of the metal shielding can. The magnetic shielding layer may include a ferromagnetic layer that is attached to the inner surface by a layer of adhesive. An insulating coating may be formed on the lower surface of the ferromagnetic layer to prevent shorts. An insulating layer for the lower surface of the ferromagnetic layer may be formed form a layer of polymer that is attached to the ferromagnetic layer with adhesive. The shielding can with magnetic shielding may withstand solder reflow temperatures, allowing the shielding can to be soldered to a printed circuit to shield an electrical component.

Abstract translation: 电子设备可以具有安装在诸如印刷电路的基板上的电气部件。 电气部件可以包括诸如电感器的磁性部件。 金属屏蔽壳可以设置有磁屏蔽层以屏蔽磁性部件。 磁屏蔽层可以形成在金属屏蔽罐的内表面上。 磁屏蔽层可以包括通过一层粘合剂附着到内表面的铁磁层。 可以在铁磁层的下表面上形成绝缘涂层以防止短路。 用于铁磁层的下表面的绝缘层可以形成为用粘合剂附接到铁磁层的聚合物层。 具有磁屏蔽的屏蔽罐可以承受焊料回流温度，允许屏蔽罐焊接到印刷电路以屏蔽电气部件。

公开(公告)号：US20140177181A1

公开(公告)日：2014-06-26

申请号：US13726890

申请日：2012-12-26

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Gregory N. Stephens ,  Michael B. Wittenberg ,  Jared M. Kole ,  Warren Z. Jones

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K3/30 ,  H05K9/003 ,  H05K2201/09063 ,  H05K2201/10371 ,  H05K2201/10409 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure.

Abstract translation: 电气部件安装在电子设备壳体中的印刷电路上。 屏蔽罐结构可以包括具有导电垫片的金属板屏蔽罐层。 印刷电路可以具有开口。 螺丝穿过印刷电路中的开口和导电垫圈和金属板护罩罐层中的开口，以将屏蔽罐结构固定到壳体上。 当固定时，垫圈中的唇缘位于印刷电路基板和壳体之间。 垫圈可以由导电弹性体材料形成。 屏蔽罐盖和柔性印刷电路可以嵌入在导电弹性体材料内，其提供热传导路径以从盖下方的电气部件散发热量。 位于柔性印刷电路基板中的弯曲部的相对侧上的屏蔽罐构件可以通过导电弹性体桥接结构耦合。