ULTRASONIC IMAGING APPARATUS AND ULTRASONIC IMAGING METHOD

    公开(公告)号:US20240168143A1

    公开(公告)日:2024-05-23

    申请号:US17778119

    申请日:2021-06-07

    CPC classification number: G01S7/52019 A61B8/145 A61B8/54

    Abstract: The present disclosure provides an ultrasonic imaging method and apparatus. The apparatus includes an ultrasonic signal emission source and a receiving array including ultrasonic signal receiving circuits; the method includes: turning on the source to perform emission of ultrasonic waves toward an object to be detected and causing the ultrasonic waves to propagate through the object, a depth-wise direction of which is along a propagation direction of the ultrasonic waves; after a first predetermined time period having elapsed since the source was turned on, turning on the receiving array to receive reflected echoes returning from a first section plane of the object to be detected perpendicular to the depth-wise direction; thereafter, turning off the receiving array, storing the reflected echoes by the ultrasonic signal receiving circuits and acquiring reflected echo signals, and successively reading the reflected echo signals from the ultrasonic signal receiving circuits during a reading time period.

    ULTRASONIC SENSOR, METHOD FOR PREPARING ULTRASONIC SENSOR, AND DISPLAY APPARATUS

    公开(公告)号:US20220406086A1

    公开(公告)日:2022-12-22

    申请号:US17776638

    申请日:2021-05-31

    Abstract: An ultrasonic sensor, a preparation method of the ultrasonic sensor, and a display apparatus are provided. The ultrasonic sensor includes a texture recognition region and a contrast region. The contrast region is located on at least one side of the texture recognition region. The texture recognition region includes at least one recognizing unit, and the contrast region includes at least one contrast unit. The at least one recognizing unit includes a first dielectric material layer, and the at least one contrast unit includes a second dielectric material layer. The first dielectric material layer and the second dielectric material layer are made of a same material. The first dielectric material layer exhibits piezoelectric properties. A piezoelectric strain constant of the first dielectric material layer is greater than a piezoelectric strain constant of the second dielectric material layer.

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