ULTRASONIC SIGNAL DETECTION CIRCUIT, ULTRASONIC SIGNAL DETECTION METHOD AND ULTRASONIC DETECTION APPARATUS

    公开(公告)号:US20240069182A1

    公开(公告)日:2024-02-29

    申请号:US17765349

    申请日:2021-05-21

    CPC classification number: G01S7/534 H03K17/56

    Abstract: The disclosure provides an ultrasonic signal detection circuit including a sensing circuit, a unidirectional conduction circuit and a source follower circuit. The sensing circuit is connected to an input terminal of the source follower circuit through the unidirectional conduction circuit; the sensing circuit is configured to generate a piezoelectric signal according to a received ultrasonic echo signal and output the piezoelectric signal to the unidirectional conduction circuit. The piezoelectric signal is an alternating current signal; the unidirectional conduction circuit is configured to rectify the alternating current signal to only allow a forward or a reverse current portion thereof to pass through. The forward/reverse current portion charges/discharges the input terminal of the source follower circuit after passing through the unidirectional conduction circuit. The source follower circuit is configured to generate a detection signal according to a voltage at its input terminal and output the detection signal through its output terminal.

    ATTACHING APPARATUS FOR CHIP-ON-FILMS
    2.
    发明申请
    ATTACHING APPARATUS FOR CHIP-ON-FILMS 有权
    连接胶片的连接装置

    公开(公告)号:US20170042041A1

    公开(公告)日:2017-02-09

    申请号:US14910801

    申请日:2015-07-30

    Abstract: An attaching apparatus for chip-on-films includes: a base; a rotary table; a first driving device configured to drive the rotary table to rotate around the axis of the rotary table; a TCP side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the TCP adhesive-attaching region; a PCB side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the PCB adhesive-attaching region; and a pre-pressing mechanism configured to pre-press conductive films attached on a chip-on-film on a carrier located in the pre-pressing region. The rotary table is in a first operating position, a second operating position, a third operating position and a fourth operating position successively during a rotation around its axis. When the rotary table is in any one of the operating positions, there is always one carrier in each region of the base.

    Abstract translation: 一种用于片上胶片的附着装置包括:底座; 旋转台; 第一驱动装置,其构造成驱动旋转台绕旋转台的轴线旋转; TCP侧粘合剂附着机构,被配置为将导电膜附着在位于所述TCP粘合剂附着区域中的载体上的片上胶片上; PCB侧粘接机构,被配置为将导电膜附着在位于所述PCB粘附剂附着区域的载体上的片上胶片上; 以及预压机构,被配置为预先安装在位于所述预压区域中的载体上的贴片上的导电膜。 旋转台在围绕其轴的旋转期间连续地处于第一操作位置,第二操作位置,第三操作位置和第四操作位置。 当旋转台处于任何一个操作位置时,在基座的每个区域中总是有一个载体。

    DISPLAY DEVICE, METHOD FOR PRODUCING DISPLAY DEVICE, AND GESTURE RECOGNITION METHOD

    公开(公告)号:US20220300733A1

    公开(公告)日:2022-09-22

    申请号:US17532670

    申请日:2021-11-22

    Abstract: A display device, a method for producing a display device, and a gesture recognition method are disclosed. The display device includes a display module including a base and an array substrate, a resin layer, a first electrode layer, a pixel definition layer, a light-emitting unit layer, a second electrode layer disposed opposite to the first electrode layer, and an encapsulation layer. The light-emitting unit layer is between the first electrode layer and the second electrode layer and includes a plurality of light-emitting units respectively in a plurality of openings of the pixel definition layer, and an ultrasonic sensor including the second electrode layer, a piezoelectric material layer between the first electrode layer and the pixel definition layer, and a third electrode layer between the pixel definition layer and the resin layer. The piezoelectric material layer includes a plurality of piezoelectric material units separated by the plurality of light-emitting units.

    TOUCH PANEL, TOUCH RECOGNITION METHOD AND TOUCH DEVICE

    公开(公告)号:US20210405808A1

    公开(公告)日:2021-12-30

    申请号:US17355776

    申请日:2021-06-23

    Abstract: The present disclosure provides a touch panel including: a touch region having a plurality of ultrasonic signal detection circuits and a reference region having a plurality of reference circuits, each ultrasonic signal detection circuit includes an ultrasonic sensor and a first driving circuit; the ultrasonic sensor includes a first electrode, a second electrode, and a dielectric layer between the first electrode and the second electrode, the first driving circuit is configured to drive the ultrasonic sensor; each of the plurality of reference circuits includes a reference transceiver and a second driving circuit, the reference transceiver includes a third electrode, a fourth electrode, and a dielectric layer between the third electrode and the fourth electrode; the second driving circuit is configured to drive the reference transceiver; the dielectric layer of the ultrasonic sensor has piezoelectric sensitivity; the dielectric layer of the reference transceiver does not have the piezoelectric sensitivity.

    SENSING SUB-CIRCUIT, CIRCUIT, RECOGNITION METHOD, SENSOR, PANEL AND DEVICE

    公开(公告)号:US20220147729A1

    公开(公告)日:2022-05-12

    申请号:US17489605

    申请日:2021-09-29

    Abstract: The present disclosure provides a fingerprint sensing sub-circuit, a fingerprint sensing circuit, a fingerprint recognition method, a sensor, a touch display panel and a display device. The fingerprint sensing sub-circuit includes an acoustic wave generation circuit and an acoustic wave reception circuit. The acoustic wave generation circuit is configured to generate an ultrasonic wave. The acoustic wave reception circuit is configured to collect a voltage signal, convert the voltage signal into a current signal, and output the current signal to a signal output end. The acoustic wave generation circuit and the acoustic wave reception circuit are separated from each other, so that the fingerprint sensing sub-circuit operates in a mode where a transmitting operation and a receiving operation are separated from each other.

    ULTRASONIC IMAGING APPARATUS AND ULTRASONIC IMAGING METHOD

    公开(公告)号:US20240168143A1

    公开(公告)日:2024-05-23

    申请号:US17778119

    申请日:2021-06-07

    CPC classification number: G01S7/52019 A61B8/145 A61B8/54

    Abstract: The present disclosure provides an ultrasonic imaging method and apparatus. The apparatus includes an ultrasonic signal emission source and a receiving array including ultrasonic signal receiving circuits; the method includes: turning on the source to perform emission of ultrasonic waves toward an object to be detected and causing the ultrasonic waves to propagate through the object, a depth-wise direction of which is along a propagation direction of the ultrasonic waves; after a first predetermined time period having elapsed since the source was turned on, turning on the receiving array to receive reflected echoes returning from a first section plane of the object to be detected perpendicular to the depth-wise direction; thereafter, turning off the receiving array, storing the reflected echoes by the ultrasonic signal receiving circuits and acquiring reflected echo signals, and successively reading the reflected echo signals from the ultrasonic signal receiving circuits during a reading time period.

    BACKLIGHT SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20230093943A1

    公开(公告)日:2023-03-30

    申请号:US16966581

    申请日:2019-08-05

    Abstract: The present disclosure provides a backlight substrate, a manufacturing method thereof, and a display device. The backlight substrate includes: a base substrate; a plurality of first light emitting elements on the base substrate and configured to emit first light; a plurality of second light emitting elements on the base substrate and configured to emit second light having a different wavelength from the first light; a plurality of depth sensors on the base substrate and configured to receive the second light emitted from the plurality of second light emitting elements and reflected by an object and determine depth information of the object based on the received second light; and a diffusion layer in direct contact with light emitting surfaces of the plurality of first light emitting elements and configured to diffuse the first light emitted from the plurality of first light emitting elements.

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