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公开(公告)号:US20220141967A1
公开(公告)日:2022-05-05
申请号:US16955442
申请日:2019-07-30
Applicant: BOE Technology Group Co., Ltd.
Inventor: Penghao Gu , Chunyan Xie , Shiming Shi
Abstract: Provided are a backboard support structure, a preparation method therefor, and a display device. The display device includes a display substrate and a backboard support structure; the backboard support structure includes a substrate support film and an adhesive layer arranged in a laminated manner. The backboard support structure is bonded to the non-display side of the display substrate via the adhesive layer, and includes a first bendable region and a first non-bent region. The adhesive layer includes a first portion located in the first bendable region and a second portion located in the first non-bent region; the first portion has a modulus of elasticity of about 1 Kpa-150 Kpa, the second portion has a modulus of elasticity of about 150 Kpa-250 Kpa, and the substrate support film has a modulus of elasticity of about 1 Gpa-10 Gpa.
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32.
公开(公告)号:US11239444B2
公开(公告)日:2022-02-01
申请号:US16464621
申请日:2018-10-29
Applicant: BOE Technology Group Co., Ltd.
Inventor: Lingzhi Qian , Song Zhang , Rui Hong , Penghao Gu
Abstract: A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.
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33.
公开(公告)号:US20200321554A1
公开(公告)日:2020-10-08
申请号:US16464621
申请日:2018-10-29
Applicant: BOE Technology Group Co., Ltd.
Inventor: Lingzhi Qian , Song Zhang , Rui Hong , Penghao Gu
Abstract: A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.
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